• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.5
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• pp.452-458
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• 2022

The electro-thermal erasing (ETE) configuration utilizes Joule heating intentionally generated at word-line (WL). The elevated temperature by heat physically removes stored electrons permanently within a very short time. Though the ETE configuration is a promising next generation NAND flash memory candidate, a consideration of power efficiency and erasing speed with respect to device structure and its scaling has not yet been demonstrated. In this context, based on 3-dimensional (3-D) thermal simulations, this paper discusses the impact of device structure and scaling on ETE efficiency. The results are used to produce guidelines for ETEs that will have lower power consumption and faster speed.

• Korean Journal of Acupuncture
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• v.40 no.4
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• pp.156-168
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• 2023

Objectives : This study aimed to determine the status of thermal stimulation devices approved in Korea for medical applications over the past 10 years, and based on this, to obtain insight for future thermal treatment in Korean medical institutions. Methods : We searched the item classification list entitled "Regulations on Medical Device Items and Rating by Item" from the Ministry of Food and Drug Safety Notice No. 2021-24, 2021 (Enforced March 19, 2021; www.mfds.go.kr) for individually licensed heaters using the terms "heat" and "heating". Results : We identified 17 items of thermal stimulation product group, of which 1,308 devices were licensed by February 4, 2022, and 53.2% of them (n=696) were devices with valid permits for distribution in Korea. Among the licensed devices, heating pad systems under/overlay (electric, home use) were approved the most, but combinational stimulator (for medical use, home use; Grade 2) accounted for the highest percentage among the current valid permission. Moxibustion apparatuses were licensed separately for electrical use and non-electrical use, and occupied a low percentage of the total devices. We analyzed 307 devices that were accompanied by technical documents and found that the heat sources were wires in 145 (47.2%), infrared rays in 44 (14.3%) and ultrasonic waves in 42 (13.7%) devices. Most (83.1%) devices were used for pain relief, while other applications included beauty, cancer treatment, maintenance of infant body temperature, and healing fractures. Conclusions : Thermal stimulation devices accounted for about 0.9% of all medical devices, and among them, combinational stimulators and heating pad systems under/overlay had the most valid permits. Thermal stimulation devices using heating wires and infrared rays were the most prevalent, and most were used to relieve pain. In order to develop a range of thermal stimulation devices that can be utilized in Korean medical institutions, it is imperative that they have potential applications beyond pain management, addressing various medical purposes. To achieve this, foundational research is necessary to effectively apply diverse heat sources based on medical objectives.

• Journal of the Korean Society of Marine Environment & Safety
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• v.19 no.2
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• pp.207-212
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• 2013

In this study, distributed the ship's Centralized Air Conditioning System the way an individual to replace the air conditioning system by using Air-cooled air conditioner. Research results, Individually separated air conditioning system complement the heat source control and thermal efficiency problems and improves the efficiency of the device was confirmed. In addition, under the same conditions refrigeration capacity and coefficient of performance of the device, an average of about 3 %, 23 ~ 26 %, higher, Chilled Water Plants Compressor power consumption is about 12 % lower. Also while heating under the same conditions, power consumption is about 33.5 % lower. Therefore Individually Separated Air Conditioning System greatly contributed to the improved performance of the device and living spaces for comfortable temperature and humidity control as well as heating source could be obtained.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.7
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• pp.66-79
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• 1999

We investigate the effects of high input power on the performance of optical bistable symmetric self-electooptic effect devices (S-SEEDs) using extremely shallow quantum wells (ESQWs). In this study, we consider the four ESQWs SEEDs; anti-reflection (AR)-coated ESQWs S-SEED, back-to-back AR coated ESQWs S-SEED, asymmetric F뮤교-Perot (AFP) ESQWs S-SEED, and back-to-back AFP-ESQWs S-SEED. As the input power increases, device performances such as on/off contrast ratio, on/off reflectivity difference are seriously degraded because of ohmic heating and exciton saturation. On the other hand, switching speed of the device increases up to certain value and then begins to decrease. With reasonable optimization of the input power for the best switching speed operation of the devices in a cascading optical interconnection system, we simulate and analyze the system bit-rate of the various ESQWs S-SEEDs, for a mesa of $5{\times}5{\mu}m^2$ size, changing the namber of quantum wells for the external bias of 0 V and -5V.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.41 no.10
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• pp.827-832
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• 2013

Heating wire cutting type separation mechanism has been widely used for cube satellite applications due to its design constraints such as small size of $10cm{\times}10cm{\times}10cm$ and light weight of less than 1kg. In addition, usage of pyro technic device is not allowed for cube satellite application. The conventional methods have some disadvantages of relatively small mechanical constraint force and the system complexity for the multi-deployable systems. In this paper, a separation nut type non-explosive separation mechanism has been proposed and investigated. The effectiveness of the design has been verified through the qualification tests of the mechanism.

• Applied Microscopy
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• v.36 no.spc1
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• pp.35-40
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• 2006

Self-assembled InAs/GaAs quantum dots (QDs) were grown by the atomic layer epitaxy (ALE) and molecular beam epitaxy (MBE) techniques, The structure and the thermal stability of QDs have been studied by high resolution electron microscopy with in-situ heating experiment capability, The ALE and MBE QDs were found to form a hemispherical structure with side facets in the early stage of growth, Upon capping by GaAs layer, however, the apex of QDs changed to a flat one. The ALE QDs have larger size and more regular shape than those of MBE QDs. The QDs collapse due to elevated temperature was observed directly in atomic scale, In situ heating experiment within TEM revealed that the uncapped QDs remained stable up to $580^{\circ}C$, However, at temperature above $600^{\circ}C$, the QDs collapsed due to the diffusion and evaporation of In and As from the QDs, The density of the QDs decreased abruptly by this collapse and most of them disappeared at above $600^{\circ}C$.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.2
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• pp.189-194
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• 2015

In this study, the heat radiation performance of COB LED according to the structure of thermoelectric device were compared. Thermoelectric device of the sheet copper structure and ceramic structure were used for bonding with the heating part of the COB LED. The temperature distribution in the bonding part of the thermoelectric device of COB LED was measured with a contact-type thermometer. The temperature variation of the thermoelectric device was measured by inputting the currents of 0.1A, 0.3A, 0.5A, and 0.7A. When 0.7A was applied, the temperature of the bonding part where there was a heat aggregation phenomenon of the COB LED was $59^{\circ}C$ for thermoelectric device of the sheet copper structure and $67^{\circ}C$ for the thermoelectric device of the ceramic structure. Therefore, the sheet copper thermoelectric device whose temperature was lower by $9^{\circ}C$ showed better heat radiation performance than those of the ceramic structure.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.6
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• pp.37-43
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• 2017

This review investigates the basic principle of physical interactions and failure mechanisms introduced in the materials and inner parts of semiconducting components under electromagnetic pulses (EMPs). The transfer process of EMPs at the semiconducting component level can be explained based on three layer structures (air, dielectric, and conductor layers). The theoretically absorbed energy can be predicted by the complex reflection coefficient. The main failure mechanisms of semiconductor components are also described based on the Joule heating energy generated by the coupling between materials and the applied EMPs. Breakdown of the P-N junction, burnout of the circuit pattern in the semiconductor chip, and damage to connecting wires between the lead frame and semiconducting chips can result from dielectric heating and eddy current loss due to electric and magnetic fields. To summarize, the EMPs transferred to the semiconductor components interact with the chip material in a semiconductor, and dipolar polarization and ionic conduction happen at the same time. Destruction of the P-N junction can result from excessive reverse voltage. Further EMP research at the semiconducting component level is needed to improve the reliability and susceptibility of electric and electronic systems.

• Journal of computational fluids engineering
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• v.21 no.2
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• pp.90-98
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• 2016

A numerical study is conducted on thermal performance of a large-area hot plate specially designed as a heating and cooling tool for thermal nanoimprint lithography process. The hot plate has a dimension of $240mm{\times}240mm{\times}20mm$, in which a series of cartridge heaters and cooling holes are installed. The material is stainless steel selected for enduring the high molding pressure. A numerical model based on the ANSYS Fluent is employed to predict the thermal behavior of the hot plate both in heating and cooling phases. The PID thermal control of the device is modeled by adding user defined functions. The results of numerical computation demonstrate that the use of cartridge heaters provides sufficient heat-up performance and the active liquid cooling in the cooling holes provides the required cool-down performance. However, a crucial technical issue is raised that the proposed design poses a large temperature non-uniformity in the steady heating phase and in the transient cooling phase. As a remedy, a new hot plate in which heat pipes are installed in the cooling holes is considered. The numerical results show that the installation of heat pipes could enhance the temperature uniformity both in the heating and cooling phases.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.9
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• pp.940-946
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• 2015

In this paper, we study a method that amplifies the output gain of a high voltage pulse using 300 kHz or higher frequency. We conducted a study on a method for amplifying the output gain using the resonance between the capacitance components of the load and the parasitic components of the circuit, instead of the conservative method for amplifying the pulse-amplitude by raising the voltage of the power stage. In particular, the method simplifies the circuit configuration throughout the appliance of flyback-type topology instead of the bridge-type. There are advantages that prevent damage from overload and the heat in the output circuit through the hard switching by amplifying the gain of the output voltage applying to the load as given by the capacitance component of the output electrode to the output pulse waveform. This study proposed a method to enhance the spatial and electrical efficiency of the contact-type heating device through the dielectric heating method applied to the field of medical and industrial heating.