• Journal of Plant Biotechnology
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• v.49 no.3
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• pp.222-229
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• 2022

Apples are the most grown fruit crops in the fruit industry of Korea. However, virus or viroid infection such as apple mosaic virus (ApMV), apple stem grooving capillovirus (ASGV), apple stem pitting virus (ASPV), apple chlorotic leaf spot virus (ACLSV), apple scar skin viroid (ASSVd) causes fruit yield reduction and poor fruit quality. Therefore, in this study, we examined to established an efficient virus-free system to eliminate the most infected ASGV virus in domestic apple orchard. We investigated that the shoot growth rate and the virus removal rate in ASGV infected potted apples that were treated with heat treatment in a growth chamber (constant temperature/humidity device) maintained at 36℃, 38℃ and 40℃ for 4 weeks. Here we found that the shoot growth rate was the highest in the heat treatment group (36℃) and the virus was removed in the middle and top of the shoot but not in the bottom. The virus was did not removed in the 38℃ and 40℃ heat treatment group in all section of shoots, and the heat treatment group (40℃) died after 4 weeks of heat treatment without growth of shoots. We performed in vivo shoot-tip grafting using the shoot-tip of potted apple heat-treated at 36 ℃, and we also investigated the viability and virus removal rate, which showed 94% viability and 20% virus removal rate. Collectively, our results suggest that it would be possible to produce the virus-free apple plants through heat treatment and shoot-tip grafting.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.21 no.3
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• pp.457-472
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• 1997

We studied the temperature distribution and heat transfer characteristics of TEFC induction motor with thermal network program for more efficient design and better cooling performance of it. We knew the characteristics and the windage loss of outer cooling fan from fan test experiments. Frame axial and peripheral heat transfer coefficients and endwinding heat transfer coefficient were measured by various model experiments and then, compared with other experimental results. Frame was the main heat transfer surface, load-side and fan-side surface were not thermally symmetric from the heat flux distribution analysis. Steady and unsteady temperature distributions were measured by real motor experiments. From the results, we knew that rotor surface temperature was higher than coil temperature and the hottest spot in the coil was loadside endwinding outside surface. We compared the simulation results with those of real motor test and the two results showed a good agreement.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• ETRI Journal
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• v.27 no.3
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• pp.337-340
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• 2005

A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit(PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.

• Tribology and Lubricants
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• v.12 no.3
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• pp.79-84
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• 1996

One of the greatest dangers in mechanical face seals is the formation of heat checking and thermal stress cracks on the sliding surfaces. These thermal distortions due to non-uniform heating lead to increase the leakage of the sealed fluids and wear, and with balance of the seal can cause the seal faces to part. In this study heat checking and thermal stress cracks are investigated experimentally. These thermal distortions are explained using the thermal models of the conatct geometries between the seal ring and the seal seat. To overcome these thermal problems, the thermohydrodynamic seal is presented. The newly developed mechanical seal may substantially reduce the friction torque, frictional heating which causes heat checking and thermal stress cracks, and wear.

• 한국정보통신설비학회:학술대회논문집
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• 2009.08a
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• pp.391-394
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• 2009

In this paper, achieved rise temperature distribution about degradation phenomenon of 2 MVA distribution mold transformer using finite element method (FEM). Usually, life of transformer is depended on temperature distribution of specification region than thermal special quality of transformer interior. Specially, life of transformer by decline of dielectric strength decreases rapidly in case rise by strangeness transformer interior hot spot temperature value permits. Because calculating high-voltage winding and low-voltage winding of mold transformer and Joule's loss of core for improvement these life, forecasted heat source, and high-voltage winding and low-voltage winding of mold transformer and rise temperature distribution of core for supply of electric power and temperature distribution of highest point on the basis of the result Also, calculated temperature rise limit of mold transformer and permission maximum temperature using analysis by electron miracle heat source alculate and forecasted rise temperature distribution by heat source of thermal analysis with calculated result.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.62 no.1
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• pp.6-11
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• 2013

In this paper, the temperature characteristics of mold transformer for the distribution power system have been analyzed by using computational fluid dynamics(CFD). The model has been modeled by coil, cores, insulating materials and frames about 3MVA grade mold transformer and analyzed the temperature distribution of the structure with a heat fluid. The fluid, which is incompressible ideal gas, is analyzed as a turbulent flow phenomenon on the assumption that it is natural cooling of transformer cooling system. Through this study, by examining the temperature distribution and hot-spot of the structure field of the mold transformer, cooling design and temperature distribution information, which are demanded for designing are estimated.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.213-215
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• 2006

Application for laser welding have increased steadily in recent years due to its benefits such as high speed, high productivity and high density energy heat source. In this article these advantages of the laser welding has been considered for Nd:YAG laser stitch welding as a substitute for spot welding of lightweight car body plates. Optimized parameters for Nd:YAG laser stitch welding have been determined comparing the economical and mechanical characteristics to match with the currently used spot welding characteristics.

• Progress in Superconductivity and Cryogenics
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• v.7 no.4
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• pp.14-19
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• 2005

A transient numerical simulation was conducted to have variation of temperature on an element of resistive Superconducting Fault Current Limiter (SFCL) under quench condition. It is very important engineering information for an optimum design of cryogenic system for cooling of a resistive SFCL element. A bifilar coil for resistive SFCL for 10 MVA system was incorporated as a model in this numerical study. From the numerical simulation result, it was found that the averaged temperature on the shunt and Bi-2212 element at 500 kW, 100 ms was 711.1 K and 198.4 K respectively. The temperature variation with the change of the hot-spot size and time is also obtained. The maximum temperature was continuously increased in all cases until the hot-spot stops at 100ms and it was going down after then. Such as, the details of temperature distribution on the SFCL element obtained from this numerical study and it should be very valuable information on the decision of the cooling capacity of cryogenic system.

• 한국신재생에너지학회:학술대회논문집
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• 2008.10a
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• pp.121-123
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• 2008

The PV modules are affected by heat. The hotter the PV module, the lower the power output, then the life time will be short. If the cell temperature rises above a certain limit the encapsulating materials can be damaged, and this will degrade the performance of the PV module. This is called the ‘hot spot’ formation. This paper presents that the PV module temperature can be estimated by using a thermal analysis program, and demonstrates the thermal characteristics of the PV module.