• Title/Summary/Keyword: Heat sink effect

Search Result 90, Processing Time 0.022 seconds

A Study on the Performance of Thermoelectric Module and Thermoelectric Cooling System (열전소자 및 열전냉각장치의 성능에 관한 연구)

  • 유성연;홍정표;심우섭
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
    • /
    • v.16 no.1
    • /
    • pp.62-69
    • /
    • 2004
  • Thermoelectric module is a device that can produce cooling in a direct manner using the electrical energy. The purpose of this study is to investigate the performance of thermoelectric module and cooling system equipped with the thermoelectric module. The performance of a thermoelectric module is estimated using two methods; theoretical analysis based on one-dimensional energy equations and experimental tests using heat source, heat sink and brass conduction extenders. For the thermoelectric cooling system, the temperatures in the chamber are recorded and then compared with those of lumped system analysis. The results show that the cooling capacity and COP of the thermoelectric module increases as the temperature difference between hot and cold surface decreases, and there is particular current at which cooling capacity reaches its maximum value. The experimental results for the thermoelectric cooling system are similar to those of lumped system analysis.

Computational study of orientation effects on thermal performance of natural convection cooled lightweight high performance hollow hybrid fin heat sinks (자연대류 냉각되는 경량고성능 할로우 하이브리드 휜 히트싱크의 열성능에 대한 방향 영향의 전산연구)

  • Effendi, Nico Setiawan;Kim, Kyoung-Joon
    • Journal of Advanced Marine Engineering and Technology
    • /
    • v.40 no.9
    • /
    • pp.786-790
    • /
    • 2016
  • This paper discusses numerically explored orientation effects on the thermal performance of hollow hybrid fin heat sinks (HHFHSs) under natural convection. A HHFHS consists of an array of hollow pin fins concatenated with plate fins and having perforations near the fin bases. Orientation effects on the footprint-based and mass-based thermal performance of the HHFHS were numerically studied for orientation angles ranging from $0^{\circ}$ to $180^{\circ}$. The performance of the HHFHS was compared with that of a pin fin heat sink (PFHS) having similar physical parameters. The results show that the thermal resistance of the HHFHS did not vary considerably from $0^{\circ}$ to $45^{\circ}$. The thermal resistance increased from $45^{\circ}$ to $90^{\circ}$, reached its maximum at $90^{\circ}$, and decreased consistently from $90^{\circ}$ to $180^{\circ}$. Dissimilar behaviors of the thermal resistance of the HHFHS vs. the PFHS resulted mainly from the effect of heat pumping induced by the internal flows of the hollow fins. Despite various orientations, the mass-based thermal resistance of the HHFHS was found to be nearly 30% smaller than that of the PFHS. This result shows the feasibility of the HHFHS for the lightweight thermal management of electronics under natural convection.

Computational Thermal Flow Analysis of a Cabin Cooler for a Commercial Vehicle (상용차용 캐빈냉방기의 전산 열유동 해석)

  • Kim, J.K.;Oh, S.H.
    • Journal of Power System Engineering
    • /
    • v.16 no.2
    • /
    • pp.17-23
    • /
    • 2012
  • The steady three-dimensional computational thermal flow analysis using standard k-${\varepsilon}$ turbulence model was carried out to investigate the heat transfer characteristics of a cabin cooler for a commercial vehicle. The heat exchanging method of this cabin cooler is to use the cooling effect of a thermoelectric module. In view of the results so far achieved, the air system resistance of a cabin cooler is about 12.4 Pa as a static pressure, and then the operating point of a cross-flow fan considering in this study is formed in the comparatively low flowrate region. The air temperature difference obtained from the cold part of an thermoelectric module is about $26^{\circ}C$, and the cooling water temperature difference obtained from the hot part of an thermoelectric module is about $3.5^{\circ}C$.

Numerical Comparison of Thermalhydraulic Aspects of Supercritical Carbon Dioxide and Subcritical Water-Based Natural Circulation Loop

  • Sarkar, Milan Krishna Singha;Basu, Dipankar Narayan
    • Nuclear Engineering and Technology
    • /
    • v.49 no.1
    • /
    • pp.103-112
    • /
    • 2017
  • Application of the supercritical condition in reactor core cooling needs to be properly justified based on the extreme level of parameters involved. Therefore, a numerical study is presented to compare the thermalhydraulic performance of supercritical and single-phase natural circulation loops under low-to-intermediate power levels. Carbon dioxide and water are selected as respective working fluids, operating under an identical set of conditions. Accordingly, a three-dimensional computational model was developed, and solved with an appropriate turbulence model and equations of state. Large asymmetry in velocity and temperature profiles was observed in a single cross section due to local buoyancy effect, which is more prominent for supercritical fluids. Mass flow rate in a supercritical loop increases with power until a maximum is reached, which subsequently corresponds to a rapid deterioration in heat transfer coefficient. That can be identified as the limit of operation for such loops to avoid a high temperature, and therefore, the use of a supercritical loop is suggested only until the appearance of such maxima. Flow-induced heat transfer deterioration can be delayed by increasing system pressure or lowering sink temperature. Bulk temperature level throughout the loop with water as working fluid is higher than supercritical carbon dioxide. This is until the heat transfer deterioration, and hence the use of a single-phase loop is prescribed beyond that limit.

Numerical Analysis on the Thermal Flow by a Thermoelectric Module within the Cabin of a Commercial Vehicle (상용차 캐빈 내의 열전모듈에 의한 열유동 수치해석)

  • Kim, J.K.;Oh, S.H.
    • Journal of Power System Engineering
    • /
    • v.16 no.5
    • /
    • pp.47-54
    • /
    • 2012
  • The steady three-dimensional numerical analysis on the thermal flow using standard k-${\varepsilon}$ turbulence model was carried out to investigate the air cooling effect of a cooler on the cabin for a commercial vehicle. Here, the heat exchanging method of this cabin cooler uses the cooling effect of a thermoelectric module. In consequence, the air system resistance of a cooler within the cabin is about 12.1 Pa as a static pressure, and then the operating point of a virtual cross-flow fan considering in this study is formed in the comparatively low flowrate region. The discharging air temperature of a cooler is about $14{\sim}15^{\circ}C$. Moreover, the air cooling temperature difference obtained under the outdoor cabin temperature of $40^{\circ}C$ shows about $7{\sim}9^{\circ}C$ in a driver resting space and about $9{\sim}14^{\circ}C$ in the front of a driver's seat including the space of a driver's foot.

Buckling and vibration behavior of a non-uniformly heated isotropic cylindrical panel

  • Bhagata, Vinod S.;Pitchaimani, Jeyaraj;Murigendrappa, S.M.
    • Structural Engineering and Mechanics
    • /
    • v.57 no.3
    • /
    • pp.543-567
    • /
    • 2016
  • This study attempts to address the buckling and free vibration characteristics of an isotropic cylindrical panel subjected to non-uniform temperature rise using numerical approach. Finite element analysis has been used in the present study. The approach involves three parts, in the first part non-uniform temperature field is obtained using heat transfer analysis, in the second part, the stress field is computed under the thermal load using static condition and, the last part, the buckling and pre-stressed modal analysis are carried out to compute critical buckling temperature as well as natural frequencies and associated mode shapes. In the present study, the effect of non-uniform temperature field, heat sink temperatures and in-plane boundary constraints are considered. The relation between buckling temperature under uniform and non-uniform temperature fields has been established. Results revealed that decrease (Case (ii)) type temperature variation field influences the fundamental buckling mode shape significantly. Further, it is observed that natural frequencies under free vibration state, decreases as temperature increases. However, the reduction is significantly higher for the lowest natural frequency. It is also found that, with an increase in temperature, nodal and anti-nodal positions of free vibration mode shapes is shifting towards the location where the intensity of the heat source is high and structural stiffness is low.

Thermal Contact Resistance Measurement of Metal Interface at Cryogenic Temperature (극저온에서 금속표면의 열 접촉 저항 측정)

  • Kim, Myung Su;Choi, Yeon Suk
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
    • /
    • v.26 no.1
    • /
    • pp.32-37
    • /
    • 2014
  • The thermal contact resistance (TCR) is one of the important resistance components in cryogenic systems. Cryogenic measurement devices using a cryocooler can be affected by TCR because the device has to consist of several metal components that are in contact with each other for heat transfer to the specimen without a cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement devices using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as the roughness of the metal surface, the contact area and the contact pressure. In this study, we designed a TCR measurement system at variable temperature using a cryocooler as a heat sink. Copper was selected as a specimen in the experiment because it is widely used as a heat transfer medium in cryogenic measurement devices. We measured the TCR between Cu and Cu for various temperatures and contact pressures. The effect of the interfacial materials on the TCR was also investigated.

An Excimer Laser Annealed Poly-Si Thin Film Transistor Designed for Reduction of Grainboundary Effect (채널에 단일 그레인 경계를 갖는 다결정 실리콘박막 트랜지스터)

  • 전재홍
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.52 no.12
    • /
    • pp.559-561
    • /
    • 2003
  • We report a new excimer laser annealing method which successfully results in a single grain boundary formation in the channel of polycrystalline silicon thin film transistor. The proposed method is based on lateral grain growth and employs aluminum patterns which act as selective beam mask and lateral heat sink. The maximum grain size obtained by the proposed method is about 1.6${\mu}{\textrm}{m}$ in the length. The grainboundaries should be arranged parallel with the direction of current flow for the best device performance, so we propose a new device fabrication method and a new poly-Si TFT structure. Poly-Si TFT fabricated by the proposed method exhibits considerably improved electrical characteristics, such as high field effect mobility exceeding 240 $cm^2$/Vsec.

Performance Prediction on the Application of a Ground-Source Heat Pump(GSHP) System in an Office Building (업무용 건물의 지열 히트펌프 시스템에 대한 성능 예측)

  • Sohn, Byonghu;Kwon, Han Sol
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
    • /
    • v.26 no.9
    • /
    • pp.409-415
    • /
    • 2014
  • Ground-source heat pump (GSHP) systems have become an efficient alternative to conventional cooling and heating methods due to their higher energy efficiency. These systems use the ground as a heat source and the heat sink for cooling mode operation. The purpose of this simulation study is to evaluate the performance of a hypothetical GSHP system in an office building and to assess the energy saving effect against the existing HVAC systems (boiler and turbo chiller). We collected monthly energy consumption data from an actual office building ($32,488m^2$) in Seoul, and created a model to calculate the hourly building loads with EnergyPlus. In addition, we used GLD (Ground Loop Design) V8.0, a GSHP system design and simulation software tool, to evaluate hourly and monthly performance of the GSHP system. The energy consumption for the GSHP system based on the hourly simulation results were estimated to be 582.6 MWh/year for cooling and 593.2 MWh/year for heating, while those for the existing HVAC systems were found to be 674.5 MWh/year and 2,496.4 MWh/year, respectively. The seasonal performance factor (SPF) of the GSHP system was also calculated to be in the range of 3.37~4.28.

Effect of Alloying Elements on the Thermal Conductivity and Casting Characteristics of Aluminum Alloys in High Pressure Die Casting (고압 다이캐스팅용 알루미늄 합금의 열전도성 및 주조성에 미치는 첨가원소의 영향)

  • Kim, Cheol-Woo;Kim, Young-Chan;Kim, Jung-Han;Cho, Jae-Ik;Oh, Min-Suk
    • Korean Journal of Metals and Materials
    • /
    • v.56 no.11
    • /
    • pp.805-812
    • /
    • 2018
  • High pressure die casting is one of the precision casting methods. It is highly productivity and suitable for manufacturing components with complex shapes and accurate dimensions. Recently, there has been increasing demand for efficient heat dissipation components, to control the heat generated by devices, which directly affects the efficiency and life of the product. Die cast aluminum alloys with high thermal conductivity are especially needed for this application. In this study, the influence of elements added to the die cast aluminum alloy on its thermal conductivity was evaluated. The results showed that Mn remarkably deteriorated the thermal conductivity of the aluminum alloy. When Cu content was increased, the tensile strength of cast aluminum alloy increased, showing 1 wt% of Cu ensured the minimum mechanical properties of the cast aluminum. As Si content increased, the flow length of the alloy proportionally increased. The flow length of aluminum alloy containing 2 wt% Si was about 85% of that of the ALDC12 alloy. A heat dissipation component was successfully fabricated using an optimized composition of Al-1 wt%Cu-0.6 wt%Fe-2 wt%Si die casting alloy without surface cracks, which were turned out as intergranular cracking originated from the solidification contraction of the alloy with Si composition lower than 2 wt%.