• 유체기계공업학회:학술대회논문집
• /
• 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
• /
• pp.479-482
• /
• 2006

The most the electronic industry has recently accelerated the modularization, the miniaturization and the high integrated trend of electronics fields such as electronics components, appliances and etc., the most increasingly the heat generation problem rises. Even though the conventional cooling technologies are widely used in order to reduce the heat loads, the technologies are not easy to meet the present trends due to the fact that most of many conventional methods are relative to external form environments such as size, design and so on. With regardless of those environments, however, a heat pipe is one of the most efficient systems to improve the heat transfer performance. And then the performance of the heat pipe depends on a wick structure. Of various wick structures, sintered metal wick is known so that it has some advantages such as smaller pore size, increasing porosity as well as high reliability. In this study sintered metal wicks, thickness 0.7 mm, 0.8 mm and 0.9 mm, were manufactured as of $100{\mu}m$ copper powder to obtain the manufacturing technology of heat pipes mounted with a sintered metal wick. Furthermore, experiments for the operational performance factors such as capillary limit, thermal resistance were not only performed but also compared with a theoretical model simultaneously. Experimental results agreed with the theoretical model, and then it seems to be required to study various development processes of sintered metal wicks for the high performance of a heat pipe system.

• Journal of Welding and Joining
• /
• 제5권2호
• /
• pp.44-52
• /
• 1987

The fracture toughness, $J_{IC}$ of high frequency electric resistance welded steel pipe for smooth and side-grooved CT specimen was evaluated by unloading compliance method. The crack growth, .${\delta}a$ was obtained from the equation of Donald and Saxena & Hudak, and $J_{IC}$ was determined from the curve of J-${\delta}a$ relations. The crack growth on the experiment using unloading compliance method is underestimated as compared with ${\delta}a$ measured directly by the SEM, so the reliability of $J_{IC}$ from saxena & Hudak equation is large than that from Donald. The $J_{IC}$ value of side-grooved CT Specimen is estimated less than that of smooth, and this is the effect of the side-groove, the shear-lip of crack tip and the reduction of crack tunnelling phenomena.

• 마이크로전자및패키징학회지
• /
• 제23권4호
• /
• pp.93-99
• /
• 2016

본 논문에서는 AgNW 필름의 기계적 전기적 신뢰성을 연구하였다. 특히 전류가 흐르는 상태에서 굽힘 변형이 발생하였을 때의 AgNW 필름의 내구성 및 신뢰성을 연구하였다. AgNW 필름의 전압 및 전류 시험을 수행하여, AgNW에서 발생하는 발열과 전류 밀도의 변화를 관찰함으로써 AgNW의 전기적 내구성을 평가하였다. AgNW는 곡률반경 2 mm까지 굽힐 수 있었으며, 200,000회의 굽힘 반복시험에도 높은 신뢰성 및 유연성을 보여주었다. 또한 over-coating 막은 AgNW 필름의 내구성을 향상시키는 효과가 있음을 확인하였다. Over-coating이 없는 AgNW 필름의 경우, AgNW 표면에서 국부적인 발열을 보인 반면에 over-coating이 된 AgNW 필름의 경우 균일하게 발열되어 over-coating막이 AgNW 필름의 내구성을 향상시킴을 알 수 있었다. 전류를 인가한 상태에서의 굽힘 시험을 수행한 결과 굽힘 반복시험에서는 전류밀도가 지속적으로 감소하여 시험 후, 52.4%의 전류밀도 감소를 보였다. 전류가 인가된 상태에서 AgNW의 굽힘 변형이 지속되면 AgNW들의 인장, 굽힘 및 sliding 등의 기계적인 변형에 의하여 AgNW network 구조의 변형이 발생하거나, 혹은 개별 AgNW의 접촉 접합부들이 떨어지면서 접촉저항이 증가하여 주울 열에 의하여 파괴가 발생한다. 또한 over-coating막의 적용은 AgNW 필름의 전기적 신뢰성을 향상시킬 수 있음을 알 수 있었다.

• 한국표면공학회지
• /
• 제43권3호
• /
• pp.142-147
• /
• 2010

We evaluated characteristics of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface treatment for mobile equipment that requires high reliability, in addition to investigating surface treatment processes for semiconductor boards that require high reliability such as regular PCB-package systems, board-on-chip, chip-scaled package (CSP), etc and application for semiconductor package board of SIP, BOC. As a result, it appeared that ENEPIG has superior properties compared to ENIG surface treatment in corrosion resistance, solder junction, wetting, etc. We anticipate that these results will be able to lend credibility to ENEPIG as a low-cost alternative for producing mobile devices such as the cell phones, especially when applied to mass production.

• 한국전기전자재료학회논문지
• /
• 제35권3호
• /
• pp.269-274
• /
• 2022

We prepared carbon nanotube (CNT) paper by a vacuum filtration method for the use of a chip-typed resistor as a precision passive device with a constant resistance. Hybrid resistor composed of the CNT resistor with a negative temperature coefficient of resistance (T.C.R) and a metal alloy resistor with a positive T.C.R could lead to a constant resistance, because the resistance increase owing to the temperature increase at the metal alloy and decrease at the CNT could counterbalance each other. The constant resistance for the precision passive devices should be maintained even when a heat was generated by a current flow resulting in resistance change. Performance reliabilities of the CNT resistor for the precision passive device applications such as electrical load limit, environmental load limit, and life limit specified in IEC 60115-1 must be ensured. In this study, therefore, the rated power determination and T.C.R tests of the CNT paper were conducted. -900~-700 ppm/℃ of TCR, 0.1~0.2 A of the carrying current capacity, and 0.0625~0.125 W of the rated power limit were obtained from the CNT paper. Consequently, we confirmed that the application of CNT materials for the precision hybrid passive devices with a metal alloy could result in a better performance reliability with a zero tolerance.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 하계학술대회 논문집
• /
• pp.1092-1095
• /
• 2001

Steady state thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin with a thickness of 25${\mu}$m. It was assumed that the generated heat which is mainly by the on-state voltage drop, 9V for 12kV diode, is dissipated by way of the conduction through diodes layers to bonding wire and of the convection at the surface of passivating resin. It was predicted by the thermal analysis that the temperature rise of a pn junction of the 12kV diode can reach at the range of 16∼34$^{\circ}C$ under the given boundary conditions. The thickness and thermal conductivity(0.3∼3W/m-K) of the passivating resin did little effect to lower thermal resistance of the diode. As the length of the bonding wire increased, which means the distance of heat conduction path became longer, the thermal resistance increased considerably. The thermal analysis results imply that the generated heat of the diode is dissipated mainly by the conduction through the route of diode-dummy wafer-bonding wire, which suggests to minimize the length of the wire for the lowest thermal resistance.

• 마이크로전자및패키징학회지
• /
• 제25권4호
• /
• pp.89-93
• /
• 2018

1200V 이상 급의 전기자동차의 파워 모듈에 적용되는 세라믹 기판은 구동 전력으로 고전력이 인가되는 특성상 고열전도도, 고 전기절연성, 저열팽창계수, 급격한 온도 변화에 대한 저항성의 특성이 요구된다. 방열기판에 적용되는 세라믹 중 질화알루미늄과 질화규소는 그 요구를 충족하는 소재로서 고려되고 있다. 이에 따라 본 논문에서는 질화알루미늄과 질화규소의 방열기판 소재로서의 특성을 상용해석프로그램을 통해 비교하였다. 그 결과 질화규소는 질화알루미늄에 대해 각각 동일한 조건의 열을 부여하는 공정을 시물레이션으로 구현했을 때 스트레스와 휨이 덜 발생하여 더 우세한 내충격성, 내stress성을 보였다. 열전도도 측면에서는 질화알루미늄이 방열 소재로서 더 우수한 특성을 지니지만 신뢰성 측면에서는 질화규소가 더 우세함을 시물레이션을 통해 관찰하였다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 추계학술대회 논문집
• /
• pp.191-191
• /
• 2009

In this paper, we have confirmed the temperature of LED chip and McPCB with thermal simulation program which is CFDedign V10 for analysis the thermal flow of HP LED package. we have known that the heat from LED chip is transferred through heat slug to copper layer of McPCB. the temperature of LED chip shows 85.11 [$^{\circ}C$], which shows the temperature gap of 7.52 [$^{\circ}C$] against McPCB. the gap of temperature affect reliability of the wire bonding and die attachment. therefore, copper layer of heat slug on the McPCB should designed with the largest dimension.

• 공업화학
• /
• 제4권2호
• /
• pp.264-272
• /
• 1993

소형화되는 전기, 전자 제품의 효율성과 신뢰성를 제고시키기 위해서 주요 부품인 마그네트 와이어의 내열성에 대한 연구가 진행되고 있다. 마그네트 와이어의 내열성은 주로 에나멜 바니쉬로부터 형성되는 고분자 피막의 물성과 밀접한 관계가 있다. 내열성 에나멜 바니쉬의 설계와 도막 형성과정이 와이어의 물성과 관련지어 논의되었다. 아울러 내열성에 영향을 주는 요인들을 완성 와이어의 물성 평가방법을 통하여 고찰하였다.

• 열처리공학회지
• /
• 제24권4호
• /
• pp.203-208
• /
• 2011

Recently, from general machine parts and automobile parts using carbon steel to a mold, there has been efforts for improving durability and attrition resistance of these parts. Especially, heat treatment with laser which works fast and automatically can be used for the mass production with high quality. Moreover, local heat treatment can be used to handle with complex and precise parts. Accordingly, we analyzed hardening characteristics of carbon steel using the finite element method and compare the experimental results to have more reliability. We also proved the cause of thermal deformation with temperature and stress distribution by heat treatment. After these analysis and experimental, we found that each maximum hardness of the two tests was 728 Hv and 700 Hv, on condition of $1050^{\circ}C$ heating temperature, and 2 mm/sec laser speed. We also found that difference of surface stress-distribution was occurred, and this makes deformation mode up after heat treatment.