• International Journal of Aerospace System Engineering
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• v.1 no.1
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• pp.44-47
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• 2014

This study proposes a development for the nano silver adhesive, which is applicable to high efficiency LED(light-emitting diode) light. The important issue of LED light is heat exhaust from LED. Generally, the middle area of LED light is increased up to 380K. Therefore, the bottleneck between LED chip and heat sink are caused by high temperature. In this work, the adhesive material between LED Chip and heat sink was newly developed for improvement of bottleneck. The nano silver was adopted to solve heat problem of chip on board package for LED light. In order to evaluate the performance of the nano silver adhesive, the thermal analysis was performed. Moreover both adhesive performance and heat exhaust were verified through the prototype test. From the experimental test results, it is found that the developed nano silver adhesive has the high performance.

• Journal of Photoscience
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• v.5 no.4
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• pp.157-162
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• 1998

The effect of heat treatment in the light on the subsequent CO2 fixation was studied with isolated spinach chloroplasts to define the role of light during heat stress. The degree of inhibition in CO2 fixation after heat treatment at 35$^{\circ}C$ under full light intensity (600W/$m^2$) was same as that in the dark. However, heat treatment of isolated chloroplasts in the light manifested thylakoidal damage, which did not occur in the dark. Under weak light (10~30 W/$m^2$ ) where no thylakoidal damage occurred, the inhibition was substantially alleviated , showing protective effect of light . The inhibition caused by heat treatment in the dark or light is prevented by the addition of a few combined compounds to the medium prior to treatment. Fructose-1-6- bisphosphate(with aldolase)and ribose-5-phosphate, known to be effective combined with oxaloacetate in preventing inhibition after heat treatment in the dark were equally effective in the light even without oxaloacetate. Addition of sugar phosphate reduced the Mehler reaction, which may occur in fast rae under high light. However, the addition of bicarbnate and catalase that would remove Mehler reaction did not provide any protection, indicating that protective role of sugar phosphate is elsewhere. Furghermore, in whole plants rapid recovery from heat stress was observed in the light. The apparently lesser or equal inhibition in spite of additional thylakoidal damage under heat stres in the light and less requirement for the protection against heat treatment suggest that the inhibitory effect of heat stress is alleviated by light treatment.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.1
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• pp.81-85
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• 2011

Recently, the electronic parts are to be thinner plate, smaller size, light weight material and CPU, HDD and DRAM in all the parts have been produced on the basis of the high speed and greater capacity. Also, conventional goods have replaced a LED (Light-Emitting Diode) in lighting products so; such industry devices need to have cooling. To maximize all the performance on the heat-radiated products, the area of heat-radiated parts is required to be cooled for keeping the life time extension and performance of product up. Existing cooling systems are using radiant heat plate of aluminum, brass by extrusion molding, heat pipe or hydro-cooling system for cooling. There is a limitation for bringing the light weight of product, cost reduction, molding of the cooling system. So it is proposed that an alternative way was made for bringing to the cooling system. EP (Engineering Plastic) of low-cost ABS (Acrylonitrile butadiene styrene Resin) and PC (Polycarbonate) was coated with brass and the coating made the radiated heat go up. The performance of radiant heat plate is the similar to the existing part. We have studied experimentally on the radiated heat plate for the light-weight, molding improvement and low-cost. From now on, we are going to develop the way to replace the exiting plate with exterior surface of product as a cooling system.

• Transactions on Electrical and Electronic Materials
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• v.13 no.6
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• pp.292-296
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• 2012

An optimum heat sink for a 30 W chip on board (COB) LED down-light is designed, fabricated, and characterized. By using the SolidWorks Flow simulator and thermal analysis software, the thermal characteristics of the optimum heat sink is analyzed. Four different types of heat sink are simulated and an optimum structure of the heat sink is found. The simulated temperature of the heat sink when operating the LED down-light is $55.9^{\circ}C$, which is only a difference of $2^{\circ}C$ from the measured temperature. In order to reduce the temperature further, a copper spreader is introduced to the heat sink. The temperature of the heat sink with the copper spreader is $3^{\circ}C$ lower than without the copper spreader.

• KIEAE Journal
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• v.15 no.2
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• pp.117-122
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• 2015

Purpose: Generally, 30% of the total energy consumption in office building is used for artificial indoor lightings, and almost 75-85% of electric power in fluorescent and Light-Emitting Diode (LED) lightings can be dissipated as a form of heat into indoor environment. The heat generated by indoor lightings can cause the increase of cooling load in office buildings. Thus, it its important to consider indoor lightings as a heat and light source, simultaneously. Method: In this study, we installed two kinds of indoor lightings including fluorescent and LED lightings and measured surface temperature of both indoor lightings. In addition, we obtained ambient temperature of indoor space and finally calculated total heat dissipated from plenum area and surface of lightings. Result: Total indoor heat gain was 87.17Wh and 201.36Wh in cases of six 40W-LED lightings and 64W-fluorescent lightings, respectively.

• Restorative Dentistry and Endodontics
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• v.20 no.2
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• pp.827-831
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• 1995

This study was designed to etermine the changes in the degree of conversion for composite resins after heat curing following the methods proposed by Lee & Park(1995). 8-mm diameter hole was made in 1mm teflon plate and one of three types of composites (Charisma, Brilllant, Z100) was placed and light cured for 60seconds. The samples were devided into 3 groups according to the placing composites. After light curing, the samples were separated from the moulds. Using this method, 10 samples were prepared in each group; 5 samples from each group were heat cured according to the methods proposed by manutfactures, These samples were then thinned to 50-$70{\mu}m$ and analysed with a Fourier Transform Infrared Spectrometer. Standard baseline technique was used to calculate the degree of conversion. When the samples were light cured, the degrees of conversion in each groups were 47.1 % (charisma), 53.3% (Z100), and 70.1 % (Brilliant). The degree of conversion after heat curing were; 60.1 % (Charisma), 71.1 % (Z100), and 73.3 % (Brillant). Once the samples were heat cured, there were significant increases in degree of conversion.

• The Journal of Korean Academy of Prosthodontics
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• v.28 no.1
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• pp.25-41
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• 1990

The purpose of this study was to evaluate and compare the dimensional changes of relined dentures with a light-curing resin, a heat-curing resin, and a direct, hard reline resin. And also to measure the transverse strength, impact strength, surface hardness of the three resins used in relining. The surface textures of three resins also of evaluated by using scanning electron microscope. Through analyses on the data from this study, the following conclusions were obtained. 1. Impact strength of heat-curing resin was highest, and direct, hard reline resin higher, light-curing resin lowest. 2. Transverse strength of heat-curing resin was highest, and direct, hard reline resin and light-curing resin was lower and not signiicantly different. 3. Surface hardness of light-curing resin was lighest, heat-curing resin higher, and direct, hard reline resin was lowest. 4. After storage of the relined dentures for 1 day and 1 week in water at room temperature, linear shrinkage of distance between the reference points in the maxillary base relined with direct, hard reline resin was lowest, and those relined with light-curing resin and heat-curing resin were lower and were not significantly different. 5. After storage for 4 weeks in orator at room tempeature, linear shrinkage of distance between ridge crests of dentures relined with heat-curing resin was highest and that of distance between denture borders was not significantly different. 6. The dimensional changes of relined dentures during storage in water was not significant except those of distance between denture borders relined with light-curing resin at 1 day and 1 week storage in water. 7. At low magnification (x40) of SEM examination, the surface textures of three resins were similar except light-curing resin which had some defects. At high magnification (x200), the surface textures of hard, direct reline resin were smooth with little defects, but those of heat-curing resin and light-curing resin w ere irregular.

• Restorative Dentistry and Endodontics
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• v.24 no.2
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• pp.265-285
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• 1999

The purposes of this investigation were to observe the reaction kinetics of five commercial dual cured resin cements (Bistite, Dual, Scotchbond, Duolink and Duo) when cured under varying thicknesses of porcelain inlays by chemical or light activation and to evaluate the effect of the porcelain disc on the rate of polymerization of dual cured resin cement during light exposure by using thermal analysis. Thermogravimetric analysis(TGA) was used to evaluate the weight change as a function of temperature during a thermal program from $25{\sim}800^{\circ}C$ at rate of $10^{\circ}C$/min and to measure inorganic filler weight %. Differential scanning calorimetry(DSC) was used to evaluate the heat of cure(${\Delta}H$), maximum rate of heat output and peak heat flow time in dual cured resin cement systems when the polymerization reaction occured by chemical cure only or by light exposure through 0mm, 1mm, 2mm and 4mm thickness of porcelain discs. In 4mm thickness of porcelain disc, the exposure time was varied from 40s to 60s to investigate the effect of the exposure time on polymerization reaction. To investigate the effect on the setting of dual cured resin cements of absorption of polymerizing light by porcelain materials used as inlays and onlays, the change of the intensity of the light attenuated by 1mm, 2mm and 4mm thickness of porcelain discs was measured using curing radiometer. The results were as follows 1. The heat of cure of resin cements was 34~60J/gm and significant differences were observed between brands (P<0.001). Inverse relationship was present between the heat of reaction and filler weight % the heat of cure decreased with increasing filler content (R=-0.967). The heat of reaction by light cure was greater than by chemical cure in Bistite, Scotchbond and Duolink(P<0.05), but there was no statistically significant difference in Dual and Duo(P>0.05). 2. The polymerization rate of chemical cure and light cure of five commercially available dual cured resin cements was found to vary greatly with brand. Setting time based on peak heat flow time was shortest in Duo during chemical cure, and shortest in Dual during light cure. Cure speed by light exposure was 5~20 times faster than by chemical cure in dual cured resin cements. The dual cured resin cements differed markedly in the ratio of light and chemical activated catalysts. 3. The peak heat flow time increased by 1.51, 1.87, and 3.24 times as light cure was done through 1mm, 2mm and 4mm thick porcelain discs. Exposure times recommended by the manufacturers were insufficient to compensate for the attenuation of light by the 4mm thick porcelain disc. 4. A strong inverse relationship was observed between peak heat flow and peak time in chemical cure(R=0.951), and a strong positive correlations hip was observed between peak heat flow and the heat of cure in light cure(R=0.928). There was no correlationship present between filler weight % or heat of cure and peak time. 5. The thermal decomposition of resin cements occured primarily between $300^{\circ}C$ and $480^{\circ}C$ with maximum decomposition rates at $335^{\circ}C$ and $440^{\circ}C$.

• Journal of the Korea Institute of Building Construction
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• v.8 no.6
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• pp.131-137
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• 2008

In recent years, the light-weight aggregate has widely been used to reduce the weight of construction structures, and to achieve the thermal insulation of building structures. The purpose of this study is to evaluate the heat resistance of polymer concrete composites with light-weight aggregate made by binders as resin and cement with polymer dispersion. The light-weight polymer concrete composites are prepared with various conditions such as binder content, filler content, void-filling ratio, light-weight aggregate content and polymer-cement ratio, and tested for heat resistant test, and measured the weight reducing ratio, strengths and exhaustion content of gas such as CO, NO and $SO_2$. From the test results, the weight reducing ratio of light weight polymer concrete using UP binder after heat resistance test increase with an increase in the UP content irrespective of the filler content. The weight reducing ratio of polymer cement concrete is considerably smaller than that of UP concrete. In general, the strengths after heat resistance of polymer concrete composites are reduced about 40 to 65% compared with those before test. The exhausted quantity of CO, NO and $SO_2$ gases in polymer concrete composites is less than EPS(Expanded poly styrene). From the this study, it is confirmed that the many types gases discharge according to binder type of polymer concrete composites, its amount is controlled by selection of the binder type and mix proportions.

• The Journal of Korean Academy of Prosthodontics
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• v.31 no.3
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• pp.385-393
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• 1993

Injection processing of denture base resin was introduced by Pryer in 1942, in an attempt to reduce processing shrinkage. More recently a continuous-pressure injection type technique has been developed (SR-Ivocap, Ivoclar AG, Schaan, Liechtenstein.), and it reduced processing error and increased resin density. The purpose of this study was to compare tensile bond strength of heat-cured, cold-cured, and light-cured denture base resin bonded to continuous-pressure injection type resin. To know it, 60 cylindrical resin specimens were fabricated, and tensile bond strength were measured. The results were as follows : 1. The mean tensile bond strength bonded to continuous-pressure injection type resin was lower than bonded to conventional heat cured resin. But tensile bond strength of conventional heat cured resin bonding with light cured resin was lower than continuous-pressure injection type resin. 2. Of the tensile bond strength bonded to continuous-pressure injection type resin, tensile bond strength bonding with continuous-pressure injection type resin was the greatest(but not significantly different from bonding with conventional heat cured resin), followed by cold-cured, light-cured resin. 3. Of the tensile bond strength bonded to conventional heat cured resin, tensile bond strength bonding with conventional heat cured resin was the greatest and followed by continuous-pressure injection type resin, cold-cured resin, light-cured resin. According to these results, bonding of continuous-pressure injection type resin with conventional heat cured resin or continuous-pressure injection type resin is acceptable, but bonding with light-cured resin is questionable.