• Title/Summary/Keyword: Heat flow resistance

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Thermographic Inspection of Fatigue Crack by Using Contact Thermal Resistance (접촉 열저항 효과를 이용한 피로균열의 적외선검사)

  • Yang, Seungyong;Kim, Nohyu
    • Journal of the Korean Society for Nondestructive Testing
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    • v.33 no.2
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    • pp.187-192
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    • 2013
  • Fatigue crack was detected from a temperature change around surface crack using the thermographic technique. Thermal gradient across the crack decreased very much due to thermal resistance of contact surface in the crack. Heat diffusion flow passing through the discontinuity was visualized in temperature by infrared camera to find and locate the crack. A fatigue crack specimen(SM-45C), which was prepared according to KS specification and notched in its center to initiate fatigue crack from the notch tip, was heated by halogen lamp at the end of one side to generate a heat diffusion flow in lateral direction. A abrupt jump in temperature across the fatigue crack was observed in thermographic image, by which the crack could be located and sized from temperature distribution.

Effect of Vapor-Cooled Heat Stations in a Cryogenic Vessel (극저온액체 저장용기에서 열전도 차폐단의 영향)

  • Kim, S.Y.;Kang, B.H.;Choi, H.J.
    • Transactions of the Korean hydrogen and new energy society
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    • v.9 no.4
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    • pp.169-176
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    • 1998
  • An experimental study on effect of vapor-cooled heat stations in a 5.5 liter cryogenic vessel has been performed. The cryogenic vessel is made of stainless steel of thickness of 1mm and insulated by the combined insulation of vacuum, MLI(multi-layer insulation) and vapor-cooled radiation shield. Vapor-cooled heat stations are also constructed based on the 1-dimensional thermal analysis to reduce the heat inleak through a filling tube. Thermal analysis indicates that the vapor-cooled heat stations can substantially enhance the performance of vessel for cryogenic fluids with high $C_p/h_{fg}$ where $C_p$ the specific heat and $h_{fg}$ the heat of vaporization, such as $LH_2$ and LHe. The experimental results for $LN_2$ shows that the total heat inleak into inner vessel consists of 14% radiation and 86% conduction through the filling tube. Therefore, it is expected that the conduction heat in leak of the vessel for high $C_p/h_{fg}$ cryogenic fluids can be significantly reduced. powders. The amount of copper coating was 20wt%. In order to examine corrosion behavior of the electrodes, the corrosion current and the current density, in 6M KOH aqueous solution after removal of oxygen in the solution, were measured by potentiodynamic and cyclic voltamo methods. The results showed that Co in the alloy increased corrosion resistance of the electrode whereas Ni decreased the stability of the electrode during the charge-discharge cycles. The electrode used Si sealant as a binder showed a lower corrosion current density than the electrode used PTFE and the electrode used Cu-coated alloy powders showed the best corrosion resistance.

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An Experimental Study on the Convection Heat Transfer of Al-Mg/water Micro Fluid in a Circular Tube with Swirl

  • Chang, Tae-Hyun;Kim, Chiwon;Kil, Sang-Cheol;Lee, Chang-Hoan
    • Journal of Advanced Marine Engineering and Technology
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    • v.36 no.7
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    • pp.869-875
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    • 2012
  • In the past decades, extensive studies on convection heat transfer on internal flow have been conducted by using high specific surface area, by increasing heat transfer coefficient and swirl flow, and by improving the transport properties. In this study, we applied a tangential slot swirl generator to improve heat transfer in a horizontal circular copper tube. The Al-Mg particles (approximately $100{\mu}m$ to $130{\mu}m$) were employed for this experimental work. The copper tube was heated uniformly by winding a heating coil with a resistance of 9 ohm per meter for heat transfer. Using Al-Mg particles, experiments were performed in the Reynolds number range of 5,000 to 13,130, with and without swirl. Experimental data transfers or comparisons between Nusselt numbers with and without swirl along the test tube and Reynolds numbers are presented. The Nusselt number is improved by increasing Reynolds numbers or swirl intensities along the test tube.

An Experimental Study on the Frost Prevention using Micro Liquid Film of an Antifreezing Solution (마이크로 부동액막을 이용한 착상방지에 관한 실험적 연구)

  • Chang Young- Soo;Yun Won -Nam
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.17 no.5
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    • pp.459-467
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    • 2005
  • The effect of anti freezing solution liquid film on the frost prevention is experimentally investigated. It is desirable that the antifreezing solution spreads widely on the heat exchanger surface forming thin liquid film to prevent frost nucleation and reduce the thermal resistance across the film. A porous layer coating technique is adopted to improve the wettedness of the anti freezing solution on a parallel plate heat exchanger. The antifreezing solution spreads widely on the heat exchanger surface with 100 $\mu$m thickness by the capillary force resulting from the porous structure. It is observed that the antifreezing solution liquid film prevents a parallel plate heat exchanger from frosting. The reductions of heat and mass transfer rate caused by thin liquid film are only $1\~2\%$ compared with those for non-liquid film surface.

An Experimental Study on the Convection heat Transfer of Al-Mg/water Micro Fluid in a Circular Tube with Swirl (선회유동장에서 Al-Mg/물 마이크로 유동의 대류 열전달에 대한 실험적 연구)

  • Chang, Tae-Hyun;Kim, Chi-Woon;Kil, Sang-Cheol;Lee, Chang-Hoan
    • Journal of the Korean Society of Visualization
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    • v.10 no.3
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    • pp.16-20
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    • 2012
  • In the past decades, extensive studies on convection heat transfer on internal flow have been conducted by using high specific surface area, by increasing heat transfer coefficient and swirl flow, and by improving the transport properties. In this study, we applied a tangential slot swirl generator to improve heat transfer in a horizontal circular copper tube. The Al-Mg particles (approximately $100{\mu}m$ to $130{\mu}m$) were employed for this experimental work. The copper tube was heated uniformly by winding a heating coil with a resistance of 9ohm per meter for heat transfer. Using Al-Mg particles, experiments were performed in the Reynolds number range of 5,000 to 13,130, with and without swirl. Experimental data transfers or comparisons between Nusselt numbers with and without swirl along the test tube and Reynolds numbers are presented. The Nusselt number is improved by increasing Reynolds numbers or swirl intensities along the test tube.

Heat Dissipation Trends in Semiconductors and Electronic Packaging (반도체 및 전자패키지의 방열기술 동향)

  • S.H. Moon;K.S. Choi;Y.S. Eom;H.G. Yun;J.H. Joo;G.M. Choi;J.H. Shin
    • Electronics and Telecommunications Trends
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    • v.38 no.6
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    • pp.41-51
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    • 2023
  • Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

Analysis and modeling of thermal resistance of multi fin/finger FinFETs (멀티 핀/핑거 FinFET 트랜지스터의 열 저항 해석과 모델링)

  • Jang, MoonYong;Kim, SoYoung
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.8
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    • pp.39-48
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    • 2016
  • In this paper, we propose thermal resistance compact model of FinFET structure that has hexagon shaped source/drain. The heating effect and thermal properties were increased by reduced size of the device, and thermal resistance is an important factor to analyze the effect and the properties. The heat source and each contact that is moved heat out were set up in transistor, and domain is divided by the heat source and the four parts of contacts : source, drain, gate, substrate. Each contact thermal resistance model is subdivided as a easily interpretable structure by analyzing the temperature and heat flow of the TCAD simulation results. The domains are modeled based on an integration or conformal mapping method through the structure parameters according to its structure. First modeled by analyzing the thermal resistance to a single fin, and applying the change in the parameter of the channel increases to improve the accuracy of the thermal resistance model of the multi-fin/ finger. The proposed thermal resistance model was compared to the thermal resistance by analyzing results of the 3D Technology CAD simulations, and the proposed total thermal resistance model has an error of 3 % less in single and multi-finl. The proposed thermal resistance model can predict the thermal resistance due to the increase of the fin / finger, and the circuit characteristics can be improved by calculating the self-heating effect and thermal characterization.

Experimental Study on the Hydrophilic Porous Film Coating for Evaporative Cooling Enhancement

  • Lee, Dae-Young;Lee, Jae-Wan;Kang, Byung-Ha
    • International Journal of Air-Conditioning and Refrigeration
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    • v.13 no.2
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    • pp.99-106
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    • 2005
  • Falling film heat transfer has been widely used in many applications in which heat and mass transfer occur simultaneously, such as evaporative coolers, cooling towers, absorption chillers, etc. In such cases, it is desirable that the falling film spreads widely on the surface to form a thin liquid film to enlarge contact surface and to reduce the thermal resistance across the film and/or the flow resistance to the vapor stream over the film. In this respect, hydrophilic treatment of the surface has been tried to improve the surface wettability by decreasing the contact angle between the liquid and the surface. However, the hydrophilic treatment was found not very effective to increase the surface wettedness of inclined surfaces, since the liquid flow forms rivulet patterns instead of a thin film as it flows down the inclined surface and accelerates gradually by the gravity. In this work, a novel method is suggested to improve the surface wettedness enormously. In this work, the surface is treated to have a thin hydrophilic porous layer on the surface. With this treatment, the liquid can spread widely on the surface by the capillary force resulting from the porous structure. In addition to this, the liquid can be held within the porous structure to improve surface wettedness regardless of the surface inclination. The experiment on the evaporative cooling of inclined surfaces has been conducted to verify the effectiveness of the surface treatment. It is measured that the latent heat transfer increases almost by $80\%$ at the hydrophilic porous layer coated surface as compared with the untreated surface.

A Study on Performance of Thermoelectric Air-Cooling System in Parallel Flow (평행유동에서 공랭식 열전모듈 냉각시스템의 성능에 관한 연구)

  • Karng, Sarng-Woo;Shin, Jae-Hoon;Han, Hun-Sik;Kim, Seo-Young
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.23 no.6
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    • pp.421-429
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    • 2011
  • Experimental and theoretical studies on cooling performance of two-channel thermoelectric air-cooling system in parallel flow are conducted. The effects of operating temperature to physical properties of thermoelectric module (TEM) are experimentally examined and used in the analysis of an air-cooling system considering thermal network and energy balance. The theoretical predicted temperature variation and cooling capacity are in good agreement with measured data, thereby validating analytic model. The heat absorbed rate increases with increasing the voltage input and decreasing thermal resistance of the system. The power consumption of TEM is linearly proportional to mean temperature differences due to variations of the physical properties on operation temperature of TEM. Furthermore thermal resistance of hot side has greater effects on cooling performance than that of cold side.

Optimizing the Configurations of Cooling Channels with Low Flow Resistance and Thermal Resistance (냉각유로 형상변화에 따른 유동 및 열저항 최적화 연구)

  • Cho, Kee-Hyeon;Ahn, Ho-Seon;Kim, Moo-Hwan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.1
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    • pp.9-15
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    • 2011
  • In this study, we investigated the hydrodynamic and thermal performance of constructal architectures on the basis of the mass flow rates for a given pressure drop, and we determined the thermal resistance and flow uniformity. The five flow configuration used in this study were the first construct with optimized hydraulic diameter, the second construct with optimized hydraulic diameter, the first construct with non-optimized hydraulic diameter, second construct with non-optimized hydraulic diameter, and a serpentine configuration. The results of our study suggest that the best fluid-flow structure is the second constructal structure with optimized constructal configurations. We also found that in the case of the optimized structure of cooling plates, the heat transfer was remarkably higher and the pumping power was significantly lower than those of traditional channels.