• Journal of Power System Engineering
• /
• v.10 no.4
• /
• pp.65-70
• /
• 2006

This study is to experimentally evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital LabViewTM measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module. In order to verify the optimal cooling performance of the cooling device, two Peltier module, HMN 6040 and HMN 1550 with Bonding and Injection type of heat sink were used. The cooling performance with injection type of heat sink was 2.11% and 6.24% better than that with bonding type of heat sink under the HMN 6040 and HMN 1550, respectively.

• Design & Manufacturing
• /
• v.12 no.1
• /
• pp.31-35
• /
• 2018

The peltier thermoelectric module are used to cool the heat generated by electronic equipment. In order to increase the efficiency of the peltier thermoelectric module, the heat must be released to the outside. A heat sink is used to discharge such heat to the outside. in this paper, two types of heat sinks with internal tunnels were designed. And the heating and cooling performance of the heat sink with internal tunnel structure was compared and analyzed through ANSYS. The heat sink of the A type had better heat transfer than the heat sink of the B type. Which is about 70% improved.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.421-422
• /
• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2009.10a
• /
• pp.503-504
• /
• 2009

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.6
• /
• pp.380-385
• /
• 2016

Thermal characteristics of 20 W LED module on light thermal conductive plastic (TCP) heat sink were investigated in comparison with that on aluminum die casting alloy (ADC-12). Thermal simulations of the heat sinks were conducted by using flow simulation of SolidWorks with the following input parameters: density is 1.70 and $2.82kg/m^2$, thermal conductivity is 20 and $92W/(m{\cdot}K)$ for TCP and ADC-12, respectively. The simulated and measured temperatures of the LED modules on TCP heat sink were consistent with its measured temperature, which was $3^{\circ}C$ higher that on ADC-12. The fabricated LED module on TCP heat sink with a weight of 120.5 g was 30% lighter in weight than that of the ADC-12 reference with 171.0 g.

• Journal of the Korean Solar Energy Society
• /
• v.35 no.1
• /
• pp.1-8
• /
• 2015

In the present study, the effects of the heat spreader thickness and the heat sink size on the thermal performance of a cooling device for a concentrating photovoltaic (CPV) module were numerically investigated. Numerical simulation was conducted by using the simulation tool ICEPAK, commercial software based on the finite volume method. Numerical results were validated by comparing the existing experimental data. The thermal performance of a cooling device, which consisted of a heat spreader and a natural convective heat sink, was evaluated with varying the heat spreader thickness and the heat sink size. The geometric configuration of the natural convective heat sink, such as the fin height, the fin spacing, and the fin thickness, was optimized by using the existing correlation. The numerical results showed that the thermal performance of the cooling device increased as the heat spreader thickness or the heat sink size increased. Also, it was found that the spreading thermal resistance plays an important role in the thermal performance of the cooling device which has the localized heat source.

• 전기의세계
• /
• v.30 no.10
• /
• pp.655-661
• /
• 1981

The concentrating solar module with high concentration ratio(320)has been studied.in this paper. The solar module was composed of the EMVJ solar cell, (Fresnel Lens-DCPC)concentrator and heat sink, and was measured by using the PASTF system. The experimental result and the result analysis for the individual item of the module were as f ollows; (1) The conversion efficiency of the module was 8.3%. (2) The optical efficiency of the concentrator was 46.5% (DCPC; 84.8%, Fresnel Lens; 54.8%). (3) The thermal loss of the solar cell was 4.9%. And methods for the further improvement of the concentrating solar module efficiency have been suggested.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.17 no.1
• /
• pp.138-143
• /
• 2018

In general, the operating temperature of electronic equipment is closely related to product life and reliability, and it is recognized that effectively cooling the parts is an important problem. In this paper, an experimental study on the cooling characteristic according to the pin array of the heat sink is conducted. The experiment on the heat sink was based on the natural convection and temperature distribution changes. The experimental results indicate that the pin array of the heat sink has an effect on the thermoelectric module's cooling characteristic.

• The Transactions of the Korean Institute of Power Electronics
• /
• v.28 no.1
• /
• pp.39-47
• /
• 2023

This paper applies a structural technique with uniform parallel switch characteristics in gates and power loops to minimize the ringing and current imbalance that occurs when a general discrete package (TO-247)-based power semiconductor device is operated in parallel. Also, this propose a heat sink integrated switching module with heat sink design flexibility and high power density. The developed heat dissipation-integrated switching module verifies the symmetry of the parasitic inductance of the parallel switch through Q3D by ansys and the validity of the structural technique of the parallel switch using the LLC resonant converter experiment operating at a rated capacity of 7.5 kW.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.10 no.7
• /
• pp.1484-1488
• /
• 2009

This thesis is about Heat-sink design which is considered as the biggest problems for commercialization of LED lighting and suggests how to solve the problems though analysis on heat-sink using COMSOL. The temperature difference after simulation value and modelling was $10^{\circ}C$by Transient analysis of Heat Transfer Module which is in the COMSOL Multiphysics. The result approximated the object which is close to actual lighting, when various elements are used according to temperature change of interior and exterior surroundings LED lighting is set up.