• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.3
• /
• pp.7-17
• /
• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.

• Proceedings of the KIEE Conference
• /
• 2007.07a
• /
• pp.138-139
• /
• 2007

This research provides machine designers with some intuition to consider both, magnetic and heat transfer effects. A topological multi-objective function includes magnetic energy and heat inflow rate to the system, which equals to the total heat dissipation by conduction and convection. For the thermal field regarding the heat inflow, introduced as a reaction force, topology design sensitivity is derived by employing discrete equations. The adjoint variable method is used to avoid numerous sensitivity evaluations. As a numerical example, a C-core design excited by winding current demonstrates the strength of the multi-physical approach.

• Bulletin of the Korean Space Science Society
• /
• 2004.10b
• /
• pp.270-273
• /
• 2004

The initial thermal analysis needs to be fast and efficient to reduce the feedback time for the optimal electronic equipment designing. In this study, a thermal model is developed by using power consumption measurement values of each functional breadboard, that is, semi-empirical power dissipation method. In modeling heat dissipated EEE parts, power dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board, and is called surface heat model. The application of these methods is performed in the development of a command and telemetry unit (CTU) for a geostationary satellite. Finally, the thermal cycling test is performed to verify the applied thermal analysis methods.

• Journal of IKEEE
• /
• v.23 no.4
• /
• pp.1473-1476
• /
• 2019

Accurate material information is very important in PCB (Printed Circuit Board) design. In an integrated mast of a battleship, heat reduction is essential for stealth functionality. So heat dissipation from internal control equipments should be reduced as much as possible. Control equipments mostly consist of PCBs, but it often suffers from impedance mismatching due to imprecise Dk (Dielectric Constant), which significantly increases heat dissipation. In this paper, measurement methods of Dk is investigated. Also, effects on impedance mismatch by Dk variation with operating frequency is investigated.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.18 no.6
• /
• pp.459-467
• /
• 2006

Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
• /
• 2006.05a
• /
• pp.338-341
• /
• 2006

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.28 no.7
• /
• pp.19-25
• /
• 2014

In the LED lighting applications, because LED packages are the origin of heat generation, there are thermal design problem on heat sinks. In the thermal design, it is important to consider the total volume and the total weight of heat sink simultaneously. In this study, an Al 6063 heat sink was optimized using Computational Fluid Dynamics(CFD) simulation tool for the cooling of 30W LED module, and then the cooling performance and the total weight of heat sinks with Al 6063 and Thermal Conductive Polycarbonate(TCP) were compared under the same conditions. As the result of simulation, an Al 6063 heat sink was optimized with 22 ea. of fins and 1.6 mm of fin thickness. LED Junction Temperature of the TCP Heat Sink was $5.6^{\circ}C$ higher, but total weight of it was 47 % less than the Al 6063.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.45 no.8
• /
• pp.678-685
• /
• 2017

The radiator of the data storage and handling units onboard the earth observation satellite is a groove-type radiator covered with a shield because of the periodic high heat dissipation and design characteristics of arrangement and mountability of the unit. The effect of the groove-type radiator and that of the shield versus plane radiator were verified through the thermal vacuum test. Through the test result, the temperatures of the radiator and the heat exchange due to the view factor were analyzed by using the analytical method. Conclusively the thermal performance of the shield dissipation plate was verified.

• Journal of the Korean Society for Precision Engineering
• /
• v.32 no.2
• /
• pp.219-227
• /
• 2015

A dehumidifier using a thermoelement has many advantages compare to a dehumidifier using compressor systems. However, it is crucial to optimize the performance of heat sink for improving heat dissipation problem on the heat generation part. In this study, we utilized computational fluid dynamics software to compare Nusselt number, temperature and system efficiency based on fin thickness, flow gap between fin and fin length. Moreover, slip flow on the boundary layer was applied for the further analysis. Our objective in this study is to suggest an optimal fin shape to improve heat transfer with the tendency of performance factor depending on change of the shapes. Our results on the optimization of fin shape and analysis of slip flow will be utilized to enhance the heat transfer in the heat sink which is important in the design of dehumidifier using a thermoelement.

• 한국전산유체공학회:학술대회논문집
• /
• 2010.05a
• /
• pp.416-421
• /
• 2010

The north and south panel of a geostationary satellite are used for radiator panels to reject internal heat dissipation of electronics units and utilize several heat pipe networks to control the temperatures of units and the satellite within proper ranges. The design of these panels is very important and essential at the conceptual design and preliminary design stage so several thousands of nodes of more are utilized in order to perform thermal analysis of panel. Generating a large number of nodes(meshes) of the panel takes time and is tedious work because the mesh can be easily changed and updated by locations of units and heat pipes. Also the detailed panel model can not be integrated into spacecraft thermal model due to its node size and limitation of commercial satellite thermal analysis program. Thus development of a program was required in order to generate detailed panel model, to perform thermal analysis and to make a reduced panel model for the integration to the satellite thermal model. This paper describes the development and the verification of panel thermal analysis program with ist main modules and its main functions.