Fabrication of Low Temperature Cofired Ceramic (LTCC) Chip Couplers for High Frequencies : I, Effects of Binder Burnout Process on the Formation of Electrode Line (고주파용 저온 동시소성 세라믹(LTCC)칩 커플러 제조: I. 전극형성에 대한 결합제 분해공정의 영향)
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- Journal of the Korean Ceramic Society
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- v.36 no.6
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- pp.583-589
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- 1999