• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.228-228
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• 2008

본 논문에서는 epoxy bonding film의 phenoxy resin의 함량변화에 따른 특성 변화에 대하여 연구하였다. epoxy bonding film은 미세패턴 구현을 위해서 사용되는 기판재료로써 epoxy, hardener, silica, phenoxy resin 등이 첨가되어진다. phenoxy resin 함량을 변화를 주면서 tape casting 방법을 통해서 flim 형성을 한 후, 제작된 film의 phenoxy resin 함량변화에 따른 조도 특성의 연구를 위해서 sweller, desmear 공정을 후 RA(Roughness Average)를 측정하고, SEM으로 표면을 관찰하였다. 또한 제작된 bonding film을 가열 가압 후 구리 도금공정을 거쳐 peel strength를 측정하였다. phenoxy resin 함량이 증가 할수록 RA가 증가되어지는 것이 관찰되어졌고, 또 한 peel strength 증가하였다.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2000.10a
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• pp.47-52
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• 2000

F.R.P specimens were made by mixture CM(chopped mat) 450-104 matrix & RC(roving clothes)570-100 Roving, the mixture ratio Resin: hardener (92:8) for tensile test. It was also made of plates by hand lay-up method and was been cured for 24 hours and then was cut tensile specimens in accordance with ASTM D638 Type 3. Knowing exact behavior of bonded area's stress and strain when the tensile test was going on, the test specimens were made of 2 plies laminae of F.R.P in each for supporting cut part in middle of specimen length. And in middle part also were covered of F.R.P plies of 1/2, 2/3 length of specimen in each as well. Also we consider shear stress in adhered area. This study reveals that as plys length is more longer, rupture stress grows remarkably larger.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.212-217
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• 2002

The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability. First of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical. The breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised and the electric field is concentrated. In the case of filled specimens with treating silane, the breakdown strength become much higher Finally, from the analysis of weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5 MV/cm.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.05a
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• pp.205-206
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• 2016

This study examines the effect of binding material and alkali activator on the rheology characteristics of alkali active mortar quantitatively, and a result is as follows. In the 1/2 slump flow, the higher mixing ratio of the fly ash has been shown to increase the table flow. the reason is that fly ash ball bearing action. When viewed in the consistency curve, the higher mixing ratio of the blast furnace slag powder was higher shear stress.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.710-713
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• 2005

In this study, waffle type barrier ribs for counter electrode discharge cells were prepared via micro-molding process. The master mold was prepared by UV lithography and working mold was manufactured by replicating the master mold. The UV paste used in this study consisted of ceramic powders for the barrier ribs, binder, hardener, and dispersant was filled into cavities of a polymeric mold by action of capillary pressure developed between mold and paste. The results demonstrated a possibility of one-step process for the manufacturing of waffle type barrier ribs embedded with sustaining electrodes.

• Proceedings of the KIEE Conference
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• 1987.11a
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• pp.499-503
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• 1987

The electrical characteristics of Epoxy Robin vary with temperature. In this study, the variation of the electric characteristics of Epoxy Resin with various hardening temperature was studied. Epoxy Resin used as samples are Epotohto YD-128 of Diglycidyl Ether of Bisphenol A (DGEBA) series and hardener, Goodmide G-240. It's mixing rate is 3 to 1. Hardening temperature was varied from 25[$^{\circ}C$] to 50[$^{\circ}C$] by 5[$^{\circ}C$]. During the hardening progress, illumination, resistivity and the internal temperature of material which were dependet on the variety of hardening temperature were measured. The electrical properties of hardened samples were examined by means of X-ray diffraction, tan $\delta$ test, TG-DTA analysis and treeing test. On this basis, optimal hardening temperature in insulation characteristics was examined.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.8
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• pp.647-651
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• 2001

The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were applied to Weibull distribution probability. First of all, speaking of dielectric breakdown properties, the more hardener increased, the stronger breakdown strength became at low temperature because of cross-linked density by the virtue of ester radical. The breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised and the electric filed is concentrated. In the case of filled specimens with treating silane, the breakdown strength become much higher. Finally, from the analysis of weibull distribution, it was confirmed that to low allowed breakdown probability under 0,.1%, the applied field value needed to be under 21.5MV/cm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.260-264
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• 1996

In this study, the dieiectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability . As a result. first of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature, and the breakdown strength of specimens because it is believed that the adding filler farms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. In the case of filled specimens with treating silane, the breakdown strength become much higher since the suggests that silane coupling agent improves interfacial combination and relays electric field concentration. Finally, from the analysis 7f weibull distribution. it was confirmed that as the allowed breakdown probability was given by 0.11[%].

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05b
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• pp.159-163
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• 2003

In this study, the DC dielectric breakdown of epoxy composites used for PCB material was experimented and then its data were simulated by Weibull distribution equation. The more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical, and the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. From the analysis of Weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1[%], the applied field value needed to be under 21.5[kV/mm].

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.23-26
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• 2012

The monodispersed polystyrene spheres were prepared by emulsion polymerization in aqueous alcohol system. They coated with silver by reduction of silver ion percolated on the surface of them. The spherical hollow type silver has been prepared by dissolving polystyrene with toluene. Epoxy resin compositions with spherical hollow type silver were manufactured, which were composed of a bisphenol F type epoxy resin (RE-304S), amine type hardener (Kayahard AA), and 1-benzyl 2-methyl imidazole (1B2MI) as catalyst. The electrical conductivity with silver content ratio were investigated after cure, the percolation threshold weight ratio for conductance in this epoxy resin system was obtained above the 70 wt% of silver.