• Title/Summary/Keyword: HAUSAT-2, Thermal Analysis

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THE ORBITAL THERMAL ANALYSIS OF HAUSAT-2 AND ITS THERMAL CONTROL SUBSYSTEM PRELIMINARY DESIGN (HAUSAT-2의 궤도 열해석과 열제어계의 예비설계)

  • Lee Mi-Hyeon;Kim Dong-Woon;Chang Young-Keun
    • Bulletin of the Korean Space Science Society
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    • 2005.04a
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    • pp.129-132
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    • 2005
  • This paper describes BAUSAT-2 orbital thermal analysis and preliminary design of thermal control subsystem. To design thermal control subsystem of HAUSAT-2, we have considered active & passive thermal control method based on basic theory and themal equilibrium equation. Using this result, suitable thermal control method and material have been selected. We have designed thermal control subsystem based on analysis of HAUSAT-2's thermal environments on sun synchronous orbit with altitude 650km, inclination $98^{\circ}$ and thermal distribution and range expectation of each HAUSAT-2's surface. Thermal analysis consists of system level, box level and board level analysis. We have completed system level and box level analysis. Till now, board level analysis of main heat dissipation board in progress. Thermal control subsystem has designed according to thermal analysis result. This design is to maintain all of the HAUSAT-2 components within the allowable temperature limits. In future, STM

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THERMAL ANALYSES AND VERIFICATION FOR HAUSAT-2 SMALL SATELLITE (HAUSAT-2 소형위성 열해석 검증 및 보드-레벨 열해석)

  • Lee Mi-Hyeon;Kim Dong-Woon;Chang Young-Keun
    • Journal of Astronomy and Space Sciences
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    • v.23 no.1
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    • pp.39-54
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    • 2006
  • HAUSAT-2 is nano satellite with 25kg mass being developed by Space System Research Lab. in Hnakuk Aviation University. This paper addresses HAUSAT-2 small satellite thermal analyses and its verification at satellite system, electronic box, and PCB levels. Thermal model which is used for system-level and box-level thermal analyses was verified and corrected through thermal vacuum/balance test. The new board-level thermal analysis methodology, modelling high-power dissipating EEE parts directly, was proposed. The proposed methodology has been verified with test results.

HAUSAT-2 STM(Structural-Thermal Model) Development and Launch Environment Test Result Analyses (HAUSAT-2 위성 STM 개발 및 발사환경시험 분석)

  • Chang, Jin-Soo;Hwang, Ki-Lyong;Chang, Young-Keun
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.33 no.11
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    • pp.95-105
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    • 2005
  • The HAUSAT-2 nanosatellite which is scheduled to launch in 2008 is being developed by SSRL(Space System Research Lab.). The HAUSAT-2 STM(Structural-Thermal Model) was developed as the first system model to verify structural and thermal design margin. The qualification level vibration and thermal tests have been conducted on STM. This paper addresses the comparison of structural analysis and test results of HAUSAT-2 STM. It was shown that the natural frequency of HAUSAT-2 STM satisfies the stiffness requirements without structural damage in the random vibration test. The assembly and integration validity were also checked out through STM.

Space Simulation Test and Thermal Verification of HAUSAT-2 STM (Structural-Thermal Model) by Using Surface Heaters (표면히터를 이용한 HAUSAT-2 위성 STM의 우주모사 및 열해석 검증 연구)

  • Lee, Mi-Hyeon;Kim, Dong-Woon;Hwang, Ki-Lyong;Chang, Young-Keun
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.33 no.11
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    • pp.106-114
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    • 2005
  • This study addresses space simulation test results and thermal modelling verification of HAUSAT-2 nanosatellite STM (Structural-Thermal Model). The thermal modelling of the HAUSAT-2 has been modified in accordance with test results. Thermal analysis results were repeatedly compared with test results for modified thermal modelling. It is verified that the analysis results for modified thermal modelling agree well with test results. Some surface heaters were implemented to simulate solar illumination for HAUSAT-2 Thermal Vacuum/Balance Test. A low-cost and effective thermal test methodology, which is applicable to ultra-small satellite system, was proposed and verified by test results in this study.

A Study of High-Power Dissipation Parts Modeling for Spacecraft PCB Thermal Analysis (위성 PCB 열해석을 위한 고 전력소산 소자의 모델링 연구)

  • 이미현;장영근;김동운
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.34 no.6
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    • pp.42-50
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    • 2006
  • This paper addresses the optimized thermal modeling methodology for spacecraft board level thermal analysis. A direct thermal modeling of external and internal structure of active parts which have high power dissipation is newly proposed, based on conventional plate modeling for Printed Circuit Board(PCB). The parts thermal modeling results were compared with other generic methodologies and verified by thermal vacuum test. This parts thermal modeling was directly applied to thermal analysis of CS(Communication Subsystem) board of HAUSAT-2 small satellite. As a result, it was confirmed that the parts thermal modeling can complement other conventional modeling methodologies. A parts thermal modeling is very effective for thermal control design, since the existing thermal problems can be solved at the parts level in advance.

Development and Performance Validation of Integrated Bus Electronic Unit for Small Satellite (소형위성용 통합형 전장박스의 개발 및 성능검증)

  • Chang, Jin-Soo;Kim, Dong-Woon;Kang, Suk-Jin;Lee, Byung-Hoon;Moon, Byoung-Young;Chang, Young-Keun
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.35 no.4
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    • pp.353-362
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    • 2007
  • Unlike large satellites, small satellites, such as nanosatellite and microsatellite, can provide a limited interior space for components mounting. In order to mitigate this issue, the compact Bus Electronic Unit(BEU) that integrates satellite electronic modules, combining most of bus subsystems and payload electronic modules into one unit, has been developed for HAUSAT-2 nanosatellite. This paper addresses the design and environmental test result analyses of BEU. The vibration and thermal vacuum tests were conducted at qualification level for the verification of design margin of newly developed BEU. The performance of individual electronic subsystem modules has been verified through performance tests before and after the qualification tests. It was confirmed that the natural frequency of BEU satisfies the design stiffness requirement without structural damage in the vibration test. Thermal analysis results were also almost consistent with test results through modified thermal analysis modeling.