• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1053-1054
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• 2011

• Transactions of Materials Processing
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• v.16 no.2 s.92
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• pp.138-143
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• 2007

Superplastic forming/diffusion bonding (SPF/DB) processes were analyzed using a 3-D rigid visco-plastic finite element method. A constant-triangular element based on membrane approximation and an incremental theory of plasticity are employed for the formulation. The coulomb friction law is used for interface friction between tool and material. Pressure-time relationship for a given optimal strain rate is calculated by stress and pressure values at the previous iteration step. In order to improve the contact searching, hierarchical search algorithm has been applied and implemented into the code. Various geometries including sandwich panel and 3 sheet shape for 3-D SPF/DB model are analyzed using the developed program. The validity fer the analysis is verified by comparison between analysis and results in the literature.

• Transactions of Materials Processing
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• v.16 no.2 s.92
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• pp.144-149
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• 2007

The superplastic forming/diffusion bonding(SPF/DB) is widely used in the automotive and aerospace industry because it has great advantage to produce complex, light and strong parts. But the superplastic forming process requires much forming time and generates excessive thinning in the thickness distribution of formed part. It is necessary to minimize trial and error for SPF/DB Process. Finite element analysis using $L_{18}$ orthogonal may table of Taguchi method for 3-Sheet D/B process is carried out. Through the study, effect of process parameters, such as DH region size, thickness and friction coefficient, is evaluated and the optimum condition is derived.

• Bulletin of the Korean Chemical Society
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• v.32 no.6
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• pp.1879-1883
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• 2011

The electronic structure and bonding in $Ti_2Pd$ and $Pd_2Ti$ alloys with and without hydrogen as an interstitial atom were studied by performing extended Huckel tight-binding band calculations. The hydrogen absorption near an octahedral site is found to be a favorable process in $Ti_2Pd$ rather than in $Pd_2Ti$. In metal hydrides, the metal-hydrogen bonding contribution is crucial to the stability of the system. The stronger interaction of hydrogen with Ti atoms in $Ti_2PdH_2$ than with Pd atoms in $Pd_2TiH_2$ is analyzed by perturbation theory.

• Journal of Power System Engineering
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• v.7 no.2
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• pp.73-79
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• 2003

The present study was aimed at analysing the damage of a used gas turbine bucket after 39,500h of total service. Microstructures and cracks of service-induced bucket were observed. The crack might have initiated from the coating in the bucket surface by thermal fatigue and propagated into the GTD111 base metal. Maximum depth of penetration was 2.7 mm(full penetration) at the leading edge. Crack contains a lot of Cr-,Ti-,Al-oxide which will prohibit filling and wetting of insert metal. Depth and propagation direction of crack were accorded with centrifugal force and temperature distribution in turbine bucket. Present result will provide basic data for repair bonding process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.10
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• pp.779-784
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• 2001

In this work, we studied the characteristics of nitride films for the optimization of PMD(pro-metal dielectric) linear process, which can be applied to the recent semiconductor manufacturing process. We split the deposit condition of nitride films into four parts such as PO(protect overcoat) nitride, baseline, low hydrogen and high stress and low hydrogen, respectively. We tried to find out correlation between BPSG deposition and densification. In order to analyze the changes of Si-H and Si-NH-Si bonding density, we used FTIR area method. We also investigated the crack generation on wafer edge after BPSG densification, and the changes of nitride film stress as a function of RF power variation to judge whether the deposited films.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.265-268
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• 2006

The superplastic forming/diffusion bonding is widely accepted as an advanced technique for forming complex industrial components. But the superplastic forming process requires much forming time and generates excessive thinning thickness distribution of formed part. Superplastic in materials is only achieved in a narrow range of strain-rate with optimum value unique to each material. In this study, finite element analysis for surperplastic forming/diffusion bonding (SPF/DB) processes of three-sheet and four-sheet sandwich parts. From this study, forming analysis have offered a lot of information for developing the forming process.

• Transactions of Materials Processing
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• v.16 no.4 s.94
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• pp.239-243
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• 2007

Superplastic forming/diffusion bonding(SPF/DB) has been widely used in the automotive and aerospace industry since it has great advantages to produce very light and strong components. Finite element method(FEM) is used to model the SPF/DB process of 3-sheet sandwich panel to predict the pressure-time curve and to analyze the process parameters. In order to eliminate defects of the part, a new pressurization scheme is proposed. Contrary to the conventional one-step pressurization, which causes the folding at the DB joint, two-step pressurization can eliminate the folding. Effect of pressurization cycle was investigated by using FE analysis and proper pressurization cycle is proposed.

• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.381-388
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• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.393-396
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• 2005

This paper is concerned with the drawing process of $Al-1\%Si$ bonding wire. In this study, the finite-element model established in previous work was used to analyze the effect of various forming parameters, which included the reduction in area, the semi-die angle, the aspect ratio, the inter-particle spacing and orientation angle of the fine Si particle in drawing processes. The finite-element results gave the consolidation condition. From the results of analysis, the effects of each forming parameter were determined. It is possible to obtain the Important basic data which can be guaranteed in the fracture prevention of $Al-1\%Si$ wire by using FE-Simulation.