• Title/Summary/Keyword: H-bond

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Semiempirical Estimation of Standard Enthalpy of Formation for Halogen Substituted Hydrocarbons (할로겐화합물의 표준생성열의 계산)

  • Kwang Yul Choo;Pil Heui Lee
    • Journal of the Korean Chemical Society
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    • v.24 no.2
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    • pp.108-114
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    • 1980
  • By using electrostatic model and simple bond additivity scheme a reasonable and simple method was developed for the estimation of standard enthalpy of formation $({\Delta}H_f\;^{\circ})$ of very polar compounds. The bond contributions to the enthalpy of formation for halomethanes were; ${\Delta}H_f\;^{\circ}(C-F)=-36.44\;kcal/mole,\;{\Delta}H_f\;^{\circ}(C-Cl)=-2.57\;kcal/mole,\;{\Delta}H_f\;^{\circ}(C-Br)=5.32\;kcal/mole,\;{\Delta}H_f\;^{\circ}(C-I)=19.18\;kcal/mole,\;and\;{\Delta}H_f\;^{\circ}(C-H)=-3.61\;kcal/mole$, respectively. Using these values and calculated electrostatic energies, the estimated ${\Delta}H_f\;^{\circ}$ values were estimated and found to be in good agreement with observed values.

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Correction Method of the Hydrogen Bond-Distance from X-ray Diffraction: Use of Neutron Data and Bond Valence Method (X-선 회절로 얻은 수소결합의 결합거리 보정 방법: 중성자 회절결과와 결합원자가 방법 이용)

    • Journal of the Mineralogical Society of Korea
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    • v.16 no.1
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    • pp.65-73
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    • 2003
  • In this study we have derived the two correction methods of hydrogen bonding distance. In case of the intermediate or long hydrogen bond(>2.5 $\AA$), hydrogen bonding distances can be corrected by using the function d(O-H)=exp((2.173-d(O…O))/0.138)+0.958 obtained by least- squares fit to the data from the neutron diffraction at low temperatures. The valence-least-squares method is effective for the distance correction of very short hydrogen bond(<2.5 $\AA$). The distance correction is necessary for the long intermolecular hydrogen bond obtained from X-ray diffraction analysis.

Characterization of pH Dependent Properties of mCherry Mutant, I202T (형광 단백질 mCherry-I202T의 pH 감응성 분석)

  • Lee, Sangmin;Chung, Minsub
    • Applied Chemistry for Engineering
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    • v.32 no.1
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    • pp.10-14
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    • 2021
  • mCherry is one of the well-understood red fluorescent proteins which has a similar tertiary structure as GFPs, but pH resistant due to the lack of hydrogen bond network. Whereas mCherry-I202T showed far-red fluorescence and also pH sensitive property because of the additional hydrogen bond formed by substituting Ile of 202 amino acid sequence on mCherry with Thr. In order to verify the pH sensitive characteristic of mCherry-I202T owing to the extension of hydrogen bond, UV-vis spectrum was measured over the range of acidic to basic pH. We also demonstrate further possibilities of applying mCherry-I202T as a pH sensor.

Effect of Deposition Pressure on the Conductivity and Optical Characteristics of a-Si:H Films (증착 압력이 a-Si:H막의 전도도와 광학적 특성에 미치는 영향)

  • Jeon, Bup-Ju;Jung, Il-Hyun
    • Applied Chemistry for Engineering
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    • v.10 no.1
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    • pp.98-104
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    • 1999
  • In this work, we investigated hydrogen content, bond structure, and electrical properties of a-Si:H films prepared by ECR plasma CVD as a function of pressure. In general, the photo sensitivity of a-Si:H films prepared by CVD method decreases as the deposition rate increases, but the photo sensitivity of a-Si:H films prepared by ECR plasma deposition method increases as the deposition rate increases. In the same condition of microwave power, the ratio of $SiH_4/H_2$, and pressure, though film thickness increases linearly with deposition time and hydrogen content in the film is constant, photo conductivity can be decreased because $SiH_2$ bond is made more than SiH bond in the short reaction time. According to increase pressure in the chamber, SiH bond in the film increase and optical energy gap decrease. So, photo conductivity can be increased. But photo sensitivity decreased as dark conductivity increase. It must be grown in the condition of low pressure and hydrogen gas for taking the a-Si:H film of high quality.

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Structural Requirements of Minoxidil Analogs for Enhancing Lysyl Hydroxylase Inhibitory Activity (Lysyl Hydroxylase의 저해활성을 증가시키기 위한 Minoxidil 유도체들의 구조적인 요건)

  • Myung, Pyung-Keun;Sung, Nack-Do;Lee, Jae-Heung
    • KSBB Journal
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    • v.27 no.2
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    • pp.121-126
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    • 2012
  • In order to explore structural features of minoxidil analogs with a view of enhancing lysyl hydroxylase (LH) inhibitory activity, molecular holographic QSAR (HQSAR) and CoMSIA (comparative molecular similarity indices analysis) were performed. The results from the atomic contributions with optimized the HQSAR 6-2 model indicated that, in case of pyrimidine-1-N-oxide substituent, C2 atom of pyrimidine ring and C'3-C'4 bond of 4-piperidinol group showed the highest impact on the inhibitory activity towards LH enzyme. It was also evident from the information of the optimized CoMSIA F5 model that the inhibitory activity mainly depended on the hydrophobic field contribution (36%) and the hydrogen bond (H-bond) field contribution (49.2%) of substrate molecule. Particularly, it is predicted that the functional groups which disfavor H-bond acceptors in large space around the piperidinol group and also the functional groups which favor the H-bond acceptors at C'4 (& C'5) atom in $R_5$ group play a role for increased inhibitory activity. With this in mind, it is likely that a novel candidate having more improved inhibitory activity on hair growth could be designed in the future.

THE EFFECT OF SURFACE TREATMENTS ON THE SHEAR BOND STRENGTH OF REPAIRED COMPOSITES (광중합형 복합레진 수리시 표면처리가 전단결합강도에 미치는 영향)

  • Moon, Jang-Won;Lee, Kwang-Won;Park, Soo-Joung
    • Restorative Dentistry and Endodontics
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    • v.24 no.1
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    • pp.156-165
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    • 1999
  • The purpose of this study was to evaluate the effect of surface treatments on the shear bond strength between new and old composites. Circular cavities prepared on the center of acrylic resin mold and the prepared cavities were filled with composite resin. They randomly assigned into control group and 8 groups according to the difference in surface treatments of old composites; Control group: no surface treatment, Group 1: surface treated with #120 SiC paper & bonding agent, Group 2: surface treated with #400 SiC paper & bonding agent, Group 3: surface treated with #120 SiC paper, 32% $H_3PO_4$ & bonding agent, Group 4: surface treated with #400 SiC paper, 32% $H_3PO_4$ & bonding agent, Group 5: surface treated with #120 SiC paper, primer & bonding agent, Group 6: surface treated with #400 SiC paper, primer & bonding agent, Group 7: surface treated with #120 SiC paper, 32% $H_3PO_4$, primer & bonding agent, Group 8: surface treated with #400 SiC paper, 32% $H_3PO_4$, primer & bonding agent. New composites were applicated on the old composites of experimental groups. The shear bond strengths for the experimental specimen were measured and the results were analyzed by using one way ANOVA. The observations of surface morphology after SiC paper roughening and debonded surface morphology after shear bond strength test were done by SEM. The results were as follows; 1. Shear bond strengths for specimens roughened with #120 SiC paper matching with the particle size of coarse diamond bur were significantly higher than those for the specimens with #400 SiC paper(P<0.05). By SEM, the surface of the specimens roughened with #120 SiC paper was more irregular than the specimens with #400 SiC paper. 2. Shear bond strengths for specimens treated with 32% $H_3PO_4$ etchant, primer, bonding resin were significantly higher than those for specimens treated with 32% $H_3PO_4$ and bonding resin(P<0.05). 3. Shear bond strengths for the specimens treated with 32% $H_3PO_4$ etchant and bonding resin were significantly higher than those for specimens treated with only bonding resin(P<0.05). There was no remarkable change of surface morphology after 32% $H_3PO_4$ etching. 4. It was possible to observe mixed fracture patterns (the cohesive fracture of old composite and the adhesive fracture between old and new composite) in the specimens roughened with #120 SiC paper, but almost adhesive fracture in the specimens roughened with #400 SiC paper.

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Effect of Acidic Environment on the Push-Out Bond Strength and Surface Morphology of Tricalcium Silicate Materials (산성 환경이 Tricalcium Silicate 재료의 압출강도와 표면형태에 미치는 영향)

  • Park, Misun;Kim, Jaehwan;Choi, Namki;Kim, Seonmi
    • Journal of the korean academy of Pediatric Dentistry
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    • v.43 no.2
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    • pp.137-144
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    • 2016
  • The aim of this study was to evaluate the effect of a range of acidic pH values on the push-out bond strength and surface morphology of tricalcium silicate materials: Biodentine$^{(R)}$, Theracal$^{(R)}$ and ProRoot MTA$^{(R)}$. The standardized lumens of root slices prepared from extracted single-root human teeth were filled with Biodentine$^{(R)}$, Theracal$^{(R)}$ and ProRoot MTA$^{(R)}$ according to manufacturer's instructions. The specimens were randomly divided into 4 groups (n = 20) for each material and then incubated for 4 days at $37^{\circ}C$; 3 acidic groups (butyric acid buffered at pH 4.4, 5.4, 6.4) and 1 control group (phosphate buffered saline solution at pH 7.4). The push-out bond strengths were then measured by using a universal testing machine and the surface morphology of each experimental group was analyzed by a scanning electron microscope. Biodentine$^{(R)}$ and Theracal$^{(R)}$ showed higher push-out bond strength compared with ProRoot MTA$^{(R)}$ after exposure to acidic pH values. A substantial change in the surface morphology of each material occurred after exposure to different pH values. In conclusion, the push-out bond strengths of Biodentine$^{(R)}$ and Theracal$^{(R)}$ are higher than the ProRoot MTA$^{(R)}$. Further the acidic environment weakens the push-out bond strength and microstructure of tricalcium silicate materials.

a-SiGe:H 박막의 고상결정화에 따른 주요 결험 스핀밀도의 변화

  • 노옥환;윤원주;이정근
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.78-78
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    • 2000
  • 다결정 실리콘-게르마늄 (poly-SiGe)은 태양전지 개발에 있어서 중요한 물질이다. 우리는 소량의 Ge(x=0.05)으로부터 다량의 Ge(x=0.67)을 함유한 수소화된 비정질 실리콘-게르마늄 (a-SiGe:H) 박막의 고상결정화 과정을 ESR (electron spin resonance)방법으로 조사해보았다. 먼저 PECVD 방법으로 Corning 1737 glass 위에 a-Si1-xGex:H 박막을 증착시켰다. 증착가스는 SiH4, GeH4 가스를 썼으며, 기판온도는 20$0^{\circ}C$, r.f. 전력은 3W, 증착시 가스압력은 0.6 Torr 정도이었다. 증착된 a-SiGe:H 박막은 $600^{\circ}C$ N2 분위기에서 다시 가열되어 고상결정화 되었고, 결정화 정도는 XRD (111) peak의 세기로부터 구해졌다. ESR 측정은 상온 x-band 영역에서 수행되었다. 측정된 ESR스팩트럼은 두 개의 Gaussian 함수로써 Si dangling-bond와 Ge dangling-bond 신호로 분리되었다. 가열 초기의 a-SiGe:H 박막 결함들의 스핀밀도의 증가는 수소 이탈에 기인하고, 또 고상결정화 과정에서 결정화된 정도와 Ge-db 스핀밀도의 변화는 서로 깊은 상관관계가 있음을 알 수 있었다. 특히 Ge 함유량이 큰 박막 (x=0.21, 0.67)에서 뿐만 아니라 소량의 Ge이 함유된 박막(x=0.05)에서도 Ge dangling-bond가 Si dangliong-bond 보다 고상결정화 과정에서 더 중요한 역할을 한다는 것을 알수 있었다. 또한 초기 열처리시 Si-H, Ge-H 결합에서 H의 이탈로 인하여 나타나는 Si-dangling bond, Ge-dangling bond 스핀밀도의 최대 증가 시간은 x 값에 의존하였는데 이러한 결과는 x값에 의존하는 Si-H, Ge-H 해리에너리지로 설명되어 질 수 있다. 층의 두께가 500 미만인 커패시터의 경우에 TiN과 Si3N4 의 계면에서 형성되는 슬릿형 공동(slit-like void)에 의해 커패시터의 유전특성이 파괴된다는 사실을 알게 되었으며, 이러한 슬릿형 공동은 제조 공정 중 재료에 따른 열팽창 계수와 탄성 계수 등의 차이에 의해 형성된 잔류응력 상태가 유전막을 기준으로 압축응력에서 인장 응력으로 바뀌는 분포에 기인하였다는 사실을 확인하였다.SiO2 막을 약화시켜 절연막의 두께가 두꺼워졌음에도 기존의 SiO2 절연막의 절연 파괴 전압 및 누설 전류오 비교되는 특성을 가졌다. 이중막을 구성하고 있는 안티퓨즈의 ON-저항이 단일막과 비교해 비슷한 것을 볼 수 잇는데, 그 이유는 TiO2에 포함된 Ti가 필라멘트에 포함되어 있어 필라멘트의 저항을 감소시켰기 때문으로 사료된다. 결국 이중막을 구성시 ON-저항 증가에 의한 속도 저하 요인은 없다고 할 수 있다. 5V의 절연파괴 시간을 측정한느 TDDB 테스트 결과 1.1$\times$103 year로 기대수치인 수십 년보다 높아 제안된 안티퓨즈의 신뢰성을 확보 할 수 있었다. 제안된 안티퓨즈의 이중 절연막의 두께는 250 이고 프로그래밍 전압은 9.0V이고, 약 65$\Omega$의 on 저항을 얻을수 있었다.보았다.다.다양한 기능을 가진 신소재 제조에 있다. 또한 경제적인 측면에서도 고부가 가치의 제품 개발에 따른 새로운 수요 창출과 수익률 향상, 기존의 기능성 안료를 나노(nano)화하여 나노 입자를 제조, 기존의 기능성 안료에 대한 비용 절감 효과등을 유도 할 수 있다. 역시 기술적인 측면에서도 특수소재 개발에 있어 최적의 나노 입자 제어기술 개발 및 나노입자를 기능성 소재로 사용하여 새로운 제품의 제조와 고압 기상 분사기술의 최적화에 의한 기능성 나노 입자 제조 기술을 확립하고 2차 오염 발생원인 유기계 항균제를 무기계 항균제로 대체할 수 있다. 이와 더불

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