• Journal of the Mineralogical Society of Korea
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• v.18 no.1
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• pp.11-17
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• 2005

Na-A zeolite were synthesized from melting slag of the incinerated ash by the alkaline activation processes. The experiments were performed in stainless steel vessels, with continuous stirring during the reaction periods. The silica-rich solution, a starting material, which was the waste of crystal growth factory, contains 5.7 wt% SiO₂ and 3.2 wt% Na₂O. And NaAlO₂ was made by the reaction of aluminium dross and NaOH solution and its molar ratios were Na₂O/Al₂O₃= 1.2 and H₂O/Na₂O=9. During the residence time of 7∼8 h at 80℃, the mixing of the silica-rich solution, NaAlO₂ and melting slag yields the production of homogeneous Na-A zeolite. The optimal reactant composition in molar ratio of Na₂O:Al₂O₃:SiO₂ was 1.3∼l.4 : 0.8∼0.9 : 2 and mixing ratio of solution and slag was 1/7∼10 (g/cc). Synthesized Na-A zeolite has cubic form uniformly and its size ranges about 1 ㎛. Ca/sup 2+/ ion exchange capacity of the Na-A was about 180∼210 meq/100g, corresponding approximately 80% to the commercial detergent builder.

• Korean Journal of Materials Research
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• v.6 no.11
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• pp.1113-1120
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• 1996

다이아몬드 박막을 이용한 반도체소자를 실현시키기 위해서는 다이아몬드가 아닌 다른 재료의 기판위에 대면적에 걸쳐 다이아몬드막을 에피텍셜 성장시키는 것이 필수적이다. 그러나 이 분야의 연구는 아직 초보상태로 그 목표가 실현되지 못하고 있다. 본 논문에서는 저압의 ECR 마이크로파 플라즈마 CVD에 의하여 대면적의 Si(100)기판상에 방향성을 갖는 다이아몬드막을 성공적으로 성장시킨 결과를 보고자한다. 지금까지 얻어진 최적 핵생성 공정조건은 다음과 같다 : 반응압력 10Pa, 기판온도 80$0^{\circ}C$(마이크로파 전력이 3kW일 때), 원료가스 CH4/He 계로 농도비 3%/97%, 가스총유량 100sccm, 바이어스 전압 + 30V, 마이크로파 전력(microwave power)4kW, 바이어스 처리 시간 10분간이며, 성장단계에서의 증착공정 조건은 기판온도 80$0^{\circ}C$, 원료가스 CH4/CO2/H2계로 농도비 5%/15%/85%, 가스 총유량 1000sccm, 바이어스 전압 +30V, 마이크로파 전력 5kW, 성막시간 2시간으로 일정하게 유지하였다. 이 조건하에서 기판 면적 3x4$\textrm{cm}^2$의 대면적에 대해서 약 2x109cm-2의핵생성 밀도를 균일하게 재현성있게 얻었다. 원료가스로 CH4/H2를 사용한 경우보다 CH4/H2를 사용할 경우에 라디칼밀도의 증가에 의하여 더 높은 핵생성밀도를 얻을 수 있었다. 또한 저압의 ECR플라즈마 CVD의 경우에는 양의 바이어스전압이 막의 손상이 없어 다이아몬드 핵생성에 더 적합하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.05a
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• pp.53-53
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• 2003

Plasma polymerized organic thin films were deposited on Si(100) glass and metal substrates using thiophene and ethylcyclohexane precursors by PECVD method. In order to compare electrochemical properties of the as-grown thin films, the effects of the RF plasma power in the range of 30~100 W. AFM showed that the polymer films with smooth surface and sharp interface could be grown under various deposition conditions. Impedance analyzer was utilized for the determination of I-V curve for leakage current density and C-V for dielectric constants, respectively. To obtain C-V curve, we used a MIM structure of metal(Al)-insulator(plasma polymerized thin film)-metal(Pt) structure. Al as the electrode was evaporated on the thiophene films that grew on Pt coated silicon substrates, and the dielectric constants of the as-grown films were then calculated from C- V data measured at 1MHz. From the electrical property measurements such as I-V and C-V characteristics, the minimum dielectric constant and the best leakage current of thiophene thin films were obtained to be about 3.22 and $1{\;}{\times}10^{-11}{\;}A/cm^2$. However, in case of ethylcyclohexane thin films, the minimum dielectric constant and the best leakage current were obtained to be about 3.11 and $5{\;}{\times}10^{-12}{\;}A/cm^2$.

• ETRI Journal
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• v.27 no.5
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• pp.545-550
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• 2005

We have carried out the fabrications of a barrier layer on a polyethersulfon (PES) film and organic light emitting diode (OLED) based on a plastic substrate by means of atomic layer deposition (ALD). Simultaneous deposition of 30 nm $AlO_x$ film on both sides of the PES film gave a water vapor transition rate (WVTR) of $0.062 g/m^2/day (@38^{\circ}C,\;100%\;R.H.)$. Further, the double layer of 200 nm $SiN_x$ film deposited by plasma enhanced chemical vapor deposition (PECVD) and 20 nm $AlO_x$ film by ALD resulted in a WVTR value lower than the detection limit of MOCON. We have investigated the OLED encapsulation performance of the double layer using the OLED structure of ITO / MTDATA (20 nm) / NPD (40 nm) / AlQ (60 nm) / LiF (1 nm) / Al (75 nm) on a plastic substrate. The preliminary life time to reach 91% of the initial luminance $(1300 cd/m^2)$ was 260 hours for the OLED encapsulated with 100 nm of PECVD-deposited $SiN_x$ and 30 nm of ALD-deposited $AlO_x$.

• Journal of Information Display
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• v.5 no.3
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• pp.30-34
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• 2004

Fabrications of barrier layer on a polyethersulfon (PES) film and OLED based on a plastic substrate by atomic layer deposition (ALD) have been carried out. Simultaneous deposition of 30 nm of $AlO_x$ film on both sides of PES film gave film MOCON value of 0.0615 g/$m^2$/day (@38$^{\circ}C$, 100 % R.H.). Moreover, the double layer of 200 urn $SiN_x$ film deposited by PECVD and 20 nm of $AlO_x$ film by ALD resulted in the MOCON value lower than the detection limit of MOCON. The OLED encapsulation performance of the double layer have been investigated using the OLED structure of ITO/MTDATA(20 nm)/NPD(40 nm)/AlQ(60 nm)/LiF(1 nm)/Al(75 nm) based on the plastic substrate. Preliminary life time to 91 % of initial luminance (1300 cd/$m^2$) was 260 hours for the OLED encapsulated with 100 nm of PECVD deposited $SiN_x$/30 nm of ALD deposited $AlO_x$.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.322-322
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• 2010

Recently, anti-reflective films (AR) are one of the most studied parts of a solar cell since these films improve the efficiency of photovoltaic devices. Also, anti-reflection films on the textured silicon solar cells reduce the amount of reflection of the incident light, which improves the device performance due to light trapping of incident light into the cell. Therefore, we preformed two step processes to get textured Si (100) substrate in this experiment. Pyramid size of textured silicon had approximately $2{\sim}9\;{\mu}m$. A well-textured silicon surface can lower the reflectance to 10%. For more reduced reflection, TiO2 anti-reflection films on the textured silicon were deposited at $600^{\circ}C$ using titanium tetra-isopropoxide (TTIP) as a precursor by metal-organic chemical vapor deposition (MOCVD), and the deposited TiO2 layers were then treated by annealing for 2 h in air at 600 and $1000^{\circ}C$, respectively. In this process, the treated samples by annealing showed anatase and rutile phases, respectively. The thickness of TiO2 films was about $75{\pm}5\;nm$. The reflectance at specific wavelength can be reduced to 3% in optimum layer.

• Carbon letters
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• v.21
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• pp.16-22
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• 2017

Cobalt was electrodeposited onto chemical vapor deposition (CVD) graphene/Si/$SiO_2$ substrates, during different time intervals, using an electrolyte solution containing a low concentration of cobalt sulfate. The intention was to investigate the details of the deposition process (and the dissolution process) and the resulting magnetic properties of the Co deposits on graphene. During and after electrodeposition, in-situ magnetic measurements were performed using an (AGFM). These were followed by ex situ morphological analysis of the samples with ${\Delta}t_{DEP}$ 30 and 100 s by atomic force microscopy in the non-contact mode on pristine CVD graphene/$SiO_2$/Si. We demonstrate that it is possible to electrodeposit Co onto graphene, and that in-situ magnetic measurements can also help in understanding details of the deposition process itself. The results show that the Co deposits are ferromagnetic with decreasing coercivity ($H_C$) and demonstrate increasing magnetization on saturation ($M_{SAT}$) and electric signal proportional to remanence ($M_r$), as a function of the amount of the electrodeposited Co. It was also found that, after the end of the dissolution process, a certain amount of cobalt remains on the graphene in oxide form (this was confirmed by X-ray photoelectron spectroscopy), as suggested by the magnetic measurements. This oxide tends to exhibit a limited asymptotic amount when cycling through the deposition/dissolution process for increasing deposition times, possibly indicating that the oxidation process is similar to the graphene surface chemistry.

• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.72.2-72.2
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• 2007

• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.75.2-75.2
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• 2007

• Journal of the Korean Vacuum Society
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• v.2 no.4
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• pp.462-467
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• 1993

ECR PECVD(Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition )장치를 이용하여 (100) 실리콘 기판 위에 실리콘 산화막을 상온에서 증착하였다. 기체 유량비(SiH4/O2)가 막의 성질에 미치는 영향을 고찰하여 최적의 증착 조건을 도출하였다. 기체 유량비가 0.071일 때 비가역 파괴 전장은 9~10MV/cm 이었고, 4~5MV/cmm의 전장하에서 누설 전류는 ~10-11 A/$ extrm{cm}^2$이었다. 이러한 수치들은 액정 표시 소자용 박막 트랜지스터와 같이 저온의 제조공정이 요구되는 소자를 만들기에 충분하다.