• Bulletin of the Korean Chemical Society
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• v.16 no.2
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• pp.101-104
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• 1995

In an attempt to understand the nature of hyperthermal ion-surface collisions, noble gas ion beams (He+, Ne+, Ar+, and Xe+) are scattered from a Si(100) surface for collision energies of 20-300 eV and for 45°incidence angle. The scattered ions are mass-analyzed using a quadrupole mass spectrometer and their kinetic energy is measured in a time-of-flight mode. The scattering event for He+ and Ne+ can be approximated as a sequence of quasi-binary collisions with individual Si atoms for high collision energies (Ei > 100 eV), but it becomes of a many-body nature for lower energies, Ar+ and Xe+ ions undergo mutliple large impact parameter collisions with the surface atoms. The effective mass of a surface that these heavy ions experience during the collision increases drastically for low beam energies.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.227-235
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• 2001

In this work, Zn$_2$SiO$_4$:Mn phosphors were prepared by solid state reaction. The effect of sintering/reduction temperature, flow rate of H$_2$-5%/$N_2$-95% mix gas, and ball milling conditions have been investigated on the sake of PDP(Plasma Display Panel) application. The characteristics such as particle morphology and photoluminescence of prepared phosphors were compared to those of commercial Zn$_2$SiO$_4$:Mn Phosphors. It was found that the Phosphor synthesized at 130$0^{\circ}C$ with 0.08 Mn concentration had a maximum brightness, This brightness was increased more 20% by reduction treatment under 100me/min flow rate of 5%H$_2$-95%$N_2$ mixed gas. The size of particles decreased under 3$\mu\textrm{m}$ after ball milling. Especially, higher luminescence was obtained in our Zn$_2$SiO$_4$:Mn phosphors than commercial Zn$_2$SiO$_4$:Mn phosphors, so that they are able to be applied for PDP.

• 한국전자현미경학회:학술대회논문집
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• 2005.11a
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• pp.99-100
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• 2005

• Proceedings of the Korean Vacuum Society Conference
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• 2003.02a
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• pp.176-177
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• 2003

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.141.2-141
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• 1998

• Transactions on Electrical and Electronic Materials
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• v.10 no.4
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• pp.131-134
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• 2009

The electrical properties and the microstructure of nitrogen-doped poly 3C-SiC films used for micro thermal sensors were studied according to different thicknesses. Poly 3C-SiC films were deposited by LPCVD (low pressure chemical vapor deposition) at $900^{\circ}C$ with a pressure of 4 torr using $SiH_2Cl_2$ (100%, 35 sccm) and $C_2H_2$ (5% in $H_2$, 180 sccm) as the Si and C precursors, and $NH_3$ (5% in $H_2$, 64 sccm) as the dopant source gas. The resistivity of the poly SiC films with a 1,530 ${\AA}$ thickness was 32.7 ${\Omega}-cm$ and decreased to 0.0129 ${\Omega}-cm$ at 16,963 ${\AA}$. The measurement of the resistance variations at different thicknesses were carried out within the $25^{\circ}C$ to $350^{\circ}C$ temperature range. While the size of the resistance variation decreased when the films thickness increased, the linearity of the resistance variation improved. Micro heaters and RTD sensors were fabricated on a $Si_3N_4$ membrane by using poly 3C-SiC with a 1um thickness using a surface MEMS process. The heating temperature of the SiC micro heater, fabricated on 250 ${\mu}m$${\times}$250 ${\mu}m$ $Si_3N_4$ membrane was $410^{\circ}C$ at an 80 mW input power. These 3C-SiC heaters and RTD sensors, fabricated by surface MEMS, have a low power consumption and deliver a good long term stability for the various thermal sensors requiring thermal stability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.190-191
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• 2006

We have investigated optical properties of Si/graded-$Si_{1-x}Ge_x$/Si heterostructures grown by reduced pressure chemical vapor deposition. Compared to standard condition using Si(100) substrate and growth temperature of $650^{\circ}C$, Si(111) resulted in low growth rate and high Ge mole fraction. Also samples grown at higher temperatures exhibited increased growth rate and reduced Ge mole fraction. The features regarding both substrate temperature and crystal orientation, representing high incorporation of silicon supplied from gas stream played as a key parameter, illustrate that reaction control were prevailed in this process growth condition. Using secondary ion mass spectroscopy and spectroscopic ellipsometry, microscopic changes in atomic components could be analyzed for Si/graded-$Si_{1-x}Ge_x$/Si heterostructures.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.90-92
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• 2001

Carbon monoxide-sensing behavior of Pt-SiC Schottky diodes. fabricated on the same SiC substrate have been systematically compared and analyzed as a function of carbon monoxide concentrati on and temperature by I-V and ${\Delta}I$-t methods under steady-state and transient condition. Adsorption activation energies of Carbon monoxide on the surface of Pt-SiC Schottky diodes is investigated in a high temperature range ($100{\sim}500^{\circ}C$). The optimal temperature for behavior sensing is $300^{\circ}C$ and saturation concentration is 200 ppm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.221-222
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• 2009

SiN 박막을 Pulsed-PECVD를 이용하여 증착하였다. 박막특성으로는 굴절률, 플라즈마의 특성으로는 이온 에너지 분포를 duty ratio의 함수로 분석하였다. 50-100%의 범위에서 duty ratio의 감소에 따라 고 이온 에너지는 크게 증가하였으며, 반대로 저 이온 에너지는 감소되었다. 굴절률은 duty ratio의 감소에 따라 증가되었으며, 모든 duty ratio의 변화에서 1.75-1.81 사이에서 변화하였다. 40-90%의 duty ratio에서 저 이온 에너지 플럭스보다 고 이온 에너지 플럭스가 높았다. 한편, 굴절률의 변화는 $N_h$의 변화에 가장 밀접하게 연관되어 있음을 확인할 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.336-336
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• 2011

AMOLED에 대한 관심이 높아짐에 따라 LTPS (Low Temperature Poly Silicon) TFT에 대한 연구가 활발히 이루어지고 있다. 다결정 실리콘은 단결정 실리콘에 비해 100 cm2/V 이상의 이동도를 보이는 우수한 특성으로 인해 AMOLED 디스플레이에 적합하며 여러 기업에서 LTPS 공정을 이용한 TFT제작을 연구 중이다. LTPS 공정은 현재 ELA (Excimer Laser Annealing) 방식으로 대면적 유리기판에 ELA 방법을 적용함에 있어 설비투자 비용이 지나치게 높아진다는 단점을 가지고 있다. 설비투자 비용의 문제점을 해결하기 위해 Diode Laser을 이용하여 Annealing하는 방법에 대해 연구하였다. 본 연구는 Diode Laser Annealing 방식을 이용하여 poly-Si을 구현하였다. 단결정 실리콘을 제작하기 위해 ICP-CVD장비를 이용하여 150$^{\circ}C$에서 SiH4, He2 혼합, He/SiH4의 flow rate는 20/2[sccm], RF power는 400 W에서 700 W으로 가변, 증착 압력은 25mTorr으로 하였다. 940 nm 파장의 30 W Diode Laser를 8 mm Spot Size로 a-Si에 순간 조사하여 결정화, 그 결과 grain을 형성한 polycrystalline 구조를 확인하였다.