• Title/Summary/Keyword: Grinding technique

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Recovery of $\alpha$-iron from converter dust in a steelmaking factory (제철소 전노 dust로부터 철분강 회수에 관한 연구)

  • 김미성;김미성;오재현;김태동
    • Resources Recycling
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    • v.2 no.2
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    • pp.27-38
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    • 1993
  • In this study, we investigated the grinding and sedimentation(elutriation) process of the dusts for the effective separation of high purity iron and iron oxides. For characterization of the dust, particle size distribution and chemical composition, were examined. The results obtained in this study may be summarized as follows : 1. The converter CF(clarifier) dust of the Pohang 1st, 2nd steel making factory and EC(Evaporation Cooler), EP(Eltrostatic precititator) dust of the Kwangyang 2nd steel making factory are composed $\alpha$-Fe(21~50%), FeO(wustite)$Fe_3$$O_4$(magnetite), $Fe_2$$O_3$, CaO, $Al_2$$O_3$, $SiO_2$, and etc. 2. Pure iron has ductile characteristic in nature, particle size of the pure iron increase by increasing the grinding time. On the other hand, it is conformed that bo고 particles of hematite and magnetite become less than 325 mesh after 10 minutes grinding. 3. By applying the elutriation technique for the EC dust of the Kwangyang 2nd steel making factory, the iron powder of high content more than 99.17% of pure Fe was recovered with 37.8% yield at grinding time for 40 minutes. 4. By applying the elutriation technique for the CF dust of the Pohang 2nd steel making factory, the iron powder of high content more than 98.38% of pure Fe was recovered with 44.42% yield at grinding time for 40 minutes. 5. When magnetic separation was performed using plastic bonding magnet of 70 gauss, more than 98% Fe grade of iron powder was recovered in the size range +65 -200 mesh but the recovery of it was low.

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Factors to Influence Thermal-Cycling Reliability of Passivation Layers in Semiconductor Devices Utilizing Lead-on-Chip (LOC) Die Attach Technique (리드 온 칩 패키징 기술을 이용하여 조립된 반도체 제품에서 패시베이션 박막의 TC 신뢰성에 영향을 미치는 요인들)

  • Lee, Seong-Min;Lee, Seong-Ran
    • Korean Journal of Materials Research
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    • v.19 no.5
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    • pp.288-292
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    • 2009
  • This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

A Study on the Characteristics on Ultra Precision Machining of HMD Optical System (Head Mounted Display 광학계 초정밀 가공특성에 관한 연구)

  • Yang S.C.;Kim G.H.;Kim Hyo-Sik;Sin Hyeon-Su;Kim Myeong-Sang;Won J.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.184-187
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    • 2005
  • This paper is described about the technique of ultra-precision machining for optical parts in HMD system. Machining technique for PMMA and BK7 with single point diamond turning machining is reported in this paper. The main factors influencing on the machined surface quality are discovered and regularities of machining process are drawn. The purpose of our research is to find the optimum machining conditions fur cutting of PMMA and grinding of BK7. Also, apply the SPDTM technique to the manufacturing of ultra precision optical components of HMD system. Aspheric PMMA lens without a polishing process, the surface roughness of 5 nm Ra, and the form error of ${\lambda}/2\;({\lambda}=632.8nm)$ for reference curved surface 30 mm has been required.

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A Study on Solving Engineering Problems of a Piece-removing System using 6-Sigma DMADOV Technique with ARIZ & Brainstorming (6시그마 DMADOV기반 아리즈와 브레인스토밍을 이용한 취부용 피스제거 시스템의 공학문제 해결에 관한연구)

  • Lee, Seong-Jo;Chung, Won-Ji;Lee, Choon-Man
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.19 no.1
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    • pp.50-56
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    • 2010
  • This paper presents a new design algorithm for piece-removing dynamical system, based on 6-Sigma DMADOV technique using ARIZ and Brainstorming. Our design target is the piece-removing system installed on a mobile platform of bead-grinding equipment. The 6-Sigma DMADOV technique guides us design process according to 6 steps, i.e., Define - Measure - Analyze - Design - Optimize - Verify. A Design strategy to reduce the weight of piece-removing dynamical system will be explored by using ARIZ, i.e.,(the abbreviation of Algorithm for Inventive Problem Solving in Russian). The ARIZ will result in a final solution that the height and angle control parts for a cutting tool should be replaced by a kinematical approach, rather than complicated mechatronic approach(using motors). The Optimize step is composed of two sub-steps: (i) Generating process for obtaining several ideas of piece-removing system by using Brainstorming technique, satisfying the final solution derived from the Design step using ARIZ, and (ii) Optimizing process for selecting the most optimal idea of piece-removing system by using Pugh's matrix from the viewpoints of weight, cost and accuracy. The laststep of Verify has shown that the final design obtained by the 6-Sigma DMADOV technique with ARIZ & Brainstormingcan improve an initial design with design requirements satisfied. In this paper, we have shown that ARIZ and Brainstorming can be cooperatively merged into 6-Sigma DMADOV to give us both a formulatedproblem-solving approach and diverse candidate solutions(or ideas) without trial-and-error efforts.

Development of Recycling Technique of Mill Reject Produce using Ttiboelectrostatic Separation (마찰하전형정전선별법을 이용한 Mill Reject 산물 재활용 기술개발)

  • 전호석;한오형;신선명;윤로한
    • Resources Recycling
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    • v.11 no.2
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    • pp.20-27
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    • 2002
  • This study was to develop the triboelectrostatic separation technique to recycle the coal from about 20% of mill reject products remained by grinding process in the coal thermoelectric power plant. In this study, we get a test results that can product the cleaned coal of 15% ash content and 66.23% recovery from mill reject of 47% ash content. And then, from the result of the releases analysis, we proved the excellence of treatment method, after showing the treament processing which is able to get 80% of recovery of coal from 20% of ash content demanded in the power plant.

An Optical Surfacing Technique of the Best-fitted Spherical Surface of the Large Optics Mirror with Ultra Precision Polishing Machine (대형 광학계 연마 장비에 의한 대구경 반사경의 최적 근사 구면 제조 방법에 관한 연구)

  • Song, Chang Kyu;Khim, Gyungho;Hwang, Jooho;Kim, Byung Sub;Park, Chun Hong;Lee, Hocheol
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.3
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    • pp.324-330
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    • 2013
  • This paper describes a novel method to surface large optics mirror with an extremely high hardness, which could replace the high cost of the repetitive off-line measurement steps and the large ultra-precision grinding machine with ultra-positioning control of 10 nm resolution. A lot of diamond pellet to be attached on the convex aluminum base consists of a grinding tool for the concave large mirror, and the tool was pressured down on the large mirror blank. The tool motion at an interval on the spiral path was controlled with each feed rate as the dwell time in the conventional computer-controlled polishing. The shape to be surfaced was measured directly by a touch probe on the machine without any separation of the mirror blank. Total 40 iterative steps of the surfacing and measurement could demonstrate the form error of RMS $7.8{\mu}m$, surface roughness of Ra $0.2{\mu}m$ for the mirror blank with diameter of 1 m and spherical radius of curvature of 5400 mm.

Physico-Chemical Characteristics of Korean Red Ginseng Powder on Pulverizing Methods (분쇄방법에 따른 고려홍삼분말의 이화학적 특성)

  • 이종원;서창훈;장규섭
    • Journal of the Korean Society of Food Science and Nutrition
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    • v.32 no.3
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    • pp.363-369
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    • 2003
  • In this study, cell cracker method as a non-collision method was evaluated for the possibility of new red ginseng grinding technique. The moisture contents were 3.16% for the powder pulverized by hammer mill (group A) and 6.30% for the powder produced by cell cracker (group B), and the difference between both groups was significant, The contents of other component such as ash, crude lipid, reducing sugar, total sugar, acidic polysaccharide, crude fiber and crude protein between both groups were not significant. There were no significant differences in phenolic compound, fatty acid, amino acid, free sugar, crude saponin and ginsenosid contents between both groups. And also the contents of mineral components were evaluated to determine the incorporation of red ginseng powder during grinding, and also the differences of those between both groups were not significant.

Characteristics of Micro EDM using Wire Electrical Discharge Grinding for Al2O3/CNTs Hybrid Materials (Al2O3/CNTs 하이브리드소재의 와이어 방전연삭을 이용한 마이크로 방전가공 특성)

  • Tak, Hyun-Seok;Kim, Jong-Hun;Lim, Han-Suk;Lee, Choon-Tae;Jeong, Young-Keun;Kang, Myung-Chang
    • Journal of Powder Materials
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    • v.17 no.4
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    • pp.319-325
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    • 2010
  • Electrical discharge machining (EDM) is an attractive machining technique but it requires electrically conductive ceramic materials. In this study, Alumina matrix composites reinforced with CNTs were fabricated through CNT purification, mixing, compaction and spark plasma sintering (SPS) processes. $Al_2O_3$ nanocomposites with the different CNT concentrations were synthesized. The mechanical and electrical characteristics of $Al_2O_3$/CNTs composites were examined in order to apply the materials to the EDM process. In addition, micro-EDM using wire electrical discharge grinding (WEDG) was conducted under the various EDM parameters to investigate the machining characteristics of machined hole by Field Emission Scanning Electron Microscope (FE-SEM). The results show that $Al_2O_3$/CNTs 10%Vol. was more suitable than the other materials because high conductivity and large discharge energy caused violent sparks resulting in bad machining accuracy and surface quality.

Preparation of Cross-sectional Specimen for High Resolution Observation of Coating Structure and Visualization of Styrene/butadiene Latex Binder (고배율 도공층 구조 및 S/B latex 분포 분석을 위한 도공층 횡단면 제작)

  • Kim, Chae-Hoon;Youn, Hye-Jung;Lee, Hak-Lae
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.44 no.4
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    • pp.16-24
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    • 2012
  • To characterize the coating structure, diverse methods such as mercury intrusion, nitrogen adsorption and oil absorption methods have been developed and widely employed. These indirect techniques, however, have some limitation to explain the actual coating structure. Recently microscopic observation methods have been tried for analyzing structural characteristics of coating layers. Preparation of the undamaged cross section of a coating layer is essential for obtaining high quality image for analysis. In this study, distortion-free cross-section of the coating layer was prepared using a grinding and polishing technique. The coated paper was embedded in epoxy resin and cured. After curing the resin block it was ground with abrasive papers and then polished with diamond particle suspension and nylon cloth. Polished coating layer was sufficient enough to obtain undamaged cross sectional images with scanning electron microscope under backscattered electron image mode. In addition, the SEM images allowed distinction of the coating layer components. Also S/B latex film formed between pigment particles was visualized by osmium tetroxide staining. Pore size distribution and pore orientation were evaluated by image analysis from SEM cross-sectional images.

A Study on the Improvement of Performance of High Speed Cutting Tool using Magnetic Fluid Grinding Technique(A Performance Estimation of High Speed Cutting Tool) (자기연마기술을 이용한 고속절삭공구의 성능향상에 관한 연구 (고속절삭공구의 성능평가를 중심으로))

  • Cho J.R.;Yang S.C.;Jung Y.G.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.354-361
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    • 2005
  • In high speed cutting process, due to the friction between the tool and workpiece, a temperature rise of contacting part is serious. It need to develop cutting tool for overcoming such a poor condition. So now, some studies, the optimization of tool shapes, the fine grains of tool material, multi-layer coating of tools are processing. If mirror finishing on the tool is processed, there is advantage of relation between chip and tool, because of less friction, and also tool's lift would be increased. As a result mirror like finishing is expected efficient enhancement of tool. Generally, it is too difficult to process by a general way for tools of complex shapes, it is required a new method to process such complex shape tools. The magnetic fluid polishing technique can polish the workpiece of complex shape, because the polishing method which polishes as compress the workpiece by the magnetism abrasives to arrange to the linear according to the line of magnetic force. In this paper, We polished the surface of the high speed cutting tool using the magnetic fluid polishing technique, to enhance the performance of the high speed cutting tool.

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