• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.755-756
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• 2013

• Tribology and Lubricants
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• 제35권6호
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• pp.323-329
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• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• 한국생산제조학회지
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• 제18권6호
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• pp.681-689
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• 2009

Disk grinding was often applied to deburring process in order to enhance the final product quality. Inherent chamfering capability of the flexible disk grinding process in the early stage was analyzed with respect to various process parameters including workpiece length, wheel speed, depth of cut and feed. Initial chamfered edge defined as arc zone was characterized with local radius of curvature. Averaged radius and arc zone ratio was well evaluated using neural network system. Additional neural network analysis adding workpiece length showed enhance performance in predicting arc zone ratio and curvature radius with reduced error rate. A process condition design parameter was estimated using remaining input and output parameters with the prediction error rate lower than 2.0% depending on the relevant input parameter combination and neural network structure composition.

• 한국공작기계학회논문집
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• 제17권5호
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• pp.123-130
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• 2008

In order to clarify detailed mechanism of the flexible disk grinding system, workpiece length was introduced and its performance was evaluated. Flat zone ratio increased as the workpiece length increased. Increasing wheel speed and depth of cut also enhanced process performance by producing larger flat zone ratio. Neural network system was successfully applied to predict minimum depth of engagement and flat zone ratio. An additional input parameter as workpiece length to the neural network system enhanced the prediction performance by reducing error rate. By rearranging the Input combinations to the network, the workpiece length was precisely predicted with the prediction error rate lower than 2.8% depending on the network structure.

• 한국정밀공학회지
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• 제30권12호
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• pp.1237-1243
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• 2013

This study has focused on the effect of ultrasonic vibration table in ELID grinding process of aluminum nitride ceramics. Aluminum nitride ceramics has superior physical and chemical properties and widely used in IC, LSI substrate, package and so on. To achieve the high effective machining of brittle and high strength ceramics as like aluminum nitride, machining method combined ELID grinding and ultrasonic vibration has been adopted in this study. From the experimental results, material removal rate, MRR has been increased maximum 36 percent and spindle resistance has been decreased in using ultrasonic table. Surface roughness of ground surface became a little worse in using ultrasonic table but was somewhat improved in feed direction.

• 대한기계학회논문집
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• 제12권2호
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• pp.241-251
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• 1988

본 연구에서는 숫돌입자, 결합자 및 기공으로 조성된 연삭숫돌의 구조를 다공질 포성체로 보고, WA계 비트리파이드(vitrified) 및 레지노이드(resinoid) 결합자의 연삭숫돌시험편에 대하여 AE 계측방법을 이용한 인장, 압축, 굽힘 및 압렬시험을 실시하여 Babel과 Sines의 2축응력장해소이론과 연삭숫돌의 파괴조건을 관련시켜 평가함과 동시에, 이 때 검출되는 AE 신호 처리 파라미터(Parameter) 로부터 연삭숫돌의 자인자가 파괴강도 및 AE특성에 미치는 영향을 구명하여 파괴의 예지및 연삭숫돌수명의 예측가능성등의 파괴강도특성을 평가고찰하였다.

• 한국정밀공학회지
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• 제19권8호
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• pp.141-146
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• 2002

This paper has studied to obtain the grinding characteristics and optimal grinding conditions of ceramic materials in the grinding with diamond wheel by design of experiments. The load on wheel by varying the feed rate was related with the surface roughness due to the minute destruction phenomenon of grains for the $Si_3\;N_4\;and\;ZrO_2$. The depth of cut is related with the surface roughness because the grinding is carried out by grain shedding process due to the brittle fracture phenomenon for the $A1_2\;O_3$. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiments using design of experiments.

• 한국기계가공학회지
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• 제15권4호
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• pp.8-15
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• 2016

Most machines lose a lot of energy due to friction. Wear due to friction also reduces performance. Therefore, it is important to reduce friction on the surface to improve energy efficiency and decrease wear. Surface texturing refers to making patterns on the surface for reducing friction. There are many surface texturing methods, such as using lasers, abrasive jet machining, and so on. Recently, mechanical manufacturing methods, such as cutting and grinding, have been highlighted. Among them, the grinding method has the advantage of making patterns in large areas quickly. Therefore, it is appropriate for surface texturing on large machines. This paper is a study on the slope change of the surface texturing pattern using grinding. Therefore, we researched the slopes of the patterns corresponding to "spindle speed and feed rate" and "curvature of workpiece surface" using a mathematical model and experiment. As a result, we made a proper mathematical model concerning our research. Therefore, using the mathematical model in this paper, we could predict the slope change of the pattern according to grinding conditions.

• 한국정밀공학회지
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• 제12권9호
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• pp.74-85
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• 1995

The purpose of this paper is to evaluate the grade of WA vitrified and resinoid bond grinding wheels by the sue of AE measuring system. When the manufactured 48 kinds of specimens were scratched by the method of OKOSHI'S grade test, the relationship between the amount of bit scratch depth of grinding wheel specimens and the character- istics of AE signals, and the relationship of AE counts and grade were considered as fololws; (1) The higher the grades are AE cumlulative event counts N and AE event count rate n, the smaller the values tend to be. But A $E_{rms}$is in reverse. (2) In the case of same grade, the smaller the grain size is, the higher the value of AE cumulative event counts N and A $E_{rms}$is results of comparison and observation. The grinding wheel with lower elasticity and with higher percentage of pore detected higher value of AE cumula- tive event counts N than with higher elasticity and lower percentage of pore. But A $E_{rms}$ is in reverse. (3) AE cumulative event counts N and bit scratch depth h have normally one to one correspondence. (4) It can be expected that quantitative evaluations of grade by using AE have been carried out by the wave observation of AE signal in line with the relationship between load speed of bit and AE cumulative event counts N & AE event count rate n.' AE event count rate n.ate n.

• 한국공작기계학회논문집
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• 제16권3호
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• pp.103-108
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• 2007

The number of parts made of ceramic materials has gradually been increasing in field of from mechanical engineering to electronics engineering and, mechanical engineering ceramics have spread because of three very favourable characteristic features of their application, namely, heat, wear, and corrosion resistance. therefore, the elaboration of suitable grinding technologies is Important. grinding is problematic because crack-free ceramics are difficult to process owing to their particular micro structure. In this paper we report on the application of advanced precision grinding process, elaborating continuous wheel dressing. The removal rate can be increased significantly and surface roughness is improved. Various problems(roughness, ground surface etc)encountered in grinding of ceramics are also discussed.