• 한국기계가공학회지
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• 제11권3호
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• pp.13-18
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• 2012

We investigated the cell activity of controlled titanium surface using various grinding methods including ELID (Electrolytic In-Process Dressing) grinding method. The influence of titanium surface condition by each grinding process on the cell activity was evaluated by ALP activity of MSC(Mesenchymal Stem Cells). The ALP activity of controlled surface by ELID grinding process using # 2000 wheel was higher than that of other titanium surface. The morphological, chemical properties of machined surface by grinding method was observed using various analytical method.

• 한국생산제조학회지
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• 제8권6호
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• pp.16-25
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• 1999

In recent years, grinding techniques for precision machining of brittle materials used in die, model and optical parts have been improved by using superfine abrasive wheel and precision grinding machine. The completion of optimum dressing of superfine abrasive wheel makes possible the effective precision grinding of die steel(STD-11). In this study, a new system and the grinding mechanism of optimum in-process electrolytic dressing were proposed. This method can carry out optimum in-process electrolytic dressing of superfine abrasive wheel. Therefore, the optimum in-process electrolytic dressing is a good method to obtain the efficiency and mirror-like grinding of STD-11.

• 한국정밀공학회지
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• 제33권6호
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• pp.485-490
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• 2016

This study focused on developing an electro-discharge truing method for the ELID grinding process using a metal-bonded grinding wheel. The truing process in grinding plays important roles in enhancing the quality of the ground surface. In this study, a reference current in the electro-discharge truing process was confirmed to be a viable solution for efficient truing through performance experiments. Current and voltage variation experiments were carried out and the variation output data were collected with a monitoring program to understand the electrodischarge phenomenon that occurs between metal-bonded grinding wheels and copper electrodes. The experimental results showed that as the reference current decreased, the average electro-discharge energy decreased. Therefore, the reference current can be used as an indicator to estimate the size of the gap between the truer and grinding wheel.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1257-1260
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• 2005

Grinding process has unique characteristics compared with other machining processes. The cutting edges of the grinding wheel don't have uniformity and act differently on the workpiece at each grinding. The response surface analysis is one of various methods for optimizing and evaluating the process parameters to achieve the desired output. In this study, the effect of the grinding parameters on outcomes of the surface grinding was analyzed experimently. To predict the grinding outcomes and to select the grinding conditions before grinding, the second-order response surface models for the grinding force and the surface roughness were developed.

• 한국정밀공학회지
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• 제18권8호
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• pp.150-156
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• 2001

This paper deals with the theoretical estimation and its experimental verification of grinding wheel wear in surface grinding process. A theoretical formulation is provided to predict the grinding wheel wear in surface grinding. To validate the theoretical prediction, the grinding wheel wear is measured by using a laser scanning micrometer. The associated surface roughness and grinding farce are also investigated both theoretically and experimentally. Through a series of simulations and experiments, it is shown that the predictions are in good agreement with the experimental results.

• 한국기계가공학회지
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• 제3권1호
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• pp.45-51
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• 2004

In this paper, the relationship between the mechanical properties of alumina abrasives and grinding performance was investigated. Micro vickers hardness and fracture strength of all abrasives used in this study were measured. The grinding experiments were earned out with alumina grinding wheels made by various kinds of alumina abrasives including 32A, WA, ART, ALOMAX, and RA. The performance of such grinding wheel for grinding SKD11 was evaluated by specific grinding energy, grinding-ratio, and surface roughness. The grinding wheels composed by the harder abrasives and the lower fracture strength abrasives showed better grinding performance.

• 한국기계가공학회지
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• 제6권3호
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• pp.9-15
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• 2007

Three methods for grinding: cross grinding, slanted tool axis grinding and parallel grinding, were carried out to study the machinability of tungsten carbide mold for glass formed aspherics lens. In our research, the optimum grinding conditions were investigated in terms of feed-rate, relative velocity of wheel and work piece, tool marks and surface roughness. It is shown that cross grinding are most effective in removal ratio but poor in surface roughness. In addition, tool marks of each method were differentiated on direction and shape.

• 한국정밀공학회지
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• 제17권9호
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• pp.45-52
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• 2000

To reduce two preprocess operations to one in the surface grinding operation the laminated grinding wheel was introduced and its availability has already been investigated in the cylindrical grinding process. Thus in this study the experiment was carried out to attempt to prove that the laminated grinding wheel can be used in the surface grinding process with respect to the roughness and grinding force.

• 한국정밀공학회지
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• 제21권10호
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• 한국기계가공학회지
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• 제1권1호
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• pp.55-62
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• 2002

This investigation reports the grinding characteristics of titanium alloy(Ti-6AI-4V). Grinding experiments were performed at various grinding conditions. The grinding forces were measured to investigate the grindability of titanium alloy with the five different wheels including Green carbide, Alumina, Resin Diamond, Resin CBN and Vitrified CBN. To investigate the grinding characteristics of titanium alloy grinding force, force ratio, specific grinding energy and grinding-ratio were measured. Surface roughness was also measured with tracer and the ground surfaces were observed with SEM Residual stress measurement was conducted on the X-Ray Diffractometer. Force ratio of grinding of titanium alloy was very lower than that of grinding of SKD-11 Surface roughness with Resin Diamond wheel was a little larger and rougher surface than that with other wheels Grinding ratio of titanium alloy was a little lower than that of other materials. Grinding ratio of titanium alloy with Diamond wheel was almost six times larger than that With CBN wheel. As a result of five different wheels, the most excellent wheel in grinding of Titanium alloy was Resin Diamond wheel.