• 한국기계가공학회지
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• 제7권1호
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• pp.3-8
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• 2008

This paper reports some experimental results of cylindrical external grinding using CBN wheels. Many experimental studies for surface grinding have been done, but not for the cylindrical grinding due to the difficulty of grinding force measurement. In this paper a new experimental device has been proposed for the grinding force measurement in cylindrical grinding. The cylindrical grinding experiments were carried out at various grinding conditions with several CBN grinding wheels. The experimental results indicate that the CBN wheels with smaller grains result in the higher grinding forces in both SCM415 and STD11 workpieces. The grinding forces of all wheels were proportional to the infeed speeds and the difference of each wheels was prominent at high infeed speed for SCM415.

• 한국기계가공학회지
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• 제10권3호
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• pp.19-27
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• 2011

A weaving machine for texture industry uses a lot of needles and the nib of these needles is necessary to be kept with sharp edge. The re-grinding of the needle by a special purpose of the grinding wheel can be selected for achieving this aim. This study focused on the manufacture and performance assessment the special grinding wheel. A forming mold for the grinding wheel was designed and a sintering process for furnace process control was established. Manufactured wheels were tested for determining suitable grade of the wheel. The selection of optimal grinding conditions was achieved by a response surface method and a genetic algorithm.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1993년도 한국자동제어학술회의논문집(국내학술편); Seoul National University, Seoul; 20-22 Oct. 1993
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• pp.1024-1030
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• 1993

In manufacturing press die with free surface, grinding operation is an important post process for surface finish and dimensional accuracy. With the advancement of NC technology. surface grinding operation is increasingly replaced by the gantry type manipulator. As the mechanics for grinding operation is different from machining operation, conventional CAM system for machining operation is hard to apply. In this. paper, we develop a five-axis CAM system by which an efficient gantry trajectory can be planned and verified. The developed system consists of four conceptual modules; namely CAD, PROCESS. CAM, and ANALYSIS. In the CAD module, the machined surface is represented by CL-data or surface modeler, and process parameters are specified by the PROCESS module. Then, the CAM module generates a series of grinding paths based on the grinding mechanics together with process databases for tool spaces and grinding conditions. The generated paths are verified via ANALYSIS module. Validation via real experiments is left for further study.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Tribology and Lubricants
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• 제34권6호
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• pp.209-216
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• 2018

Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.

• 한국기계가공학회지
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• 제14권4호
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• pp.55-61
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• 2015

In this paper, the grinding characteristics of internal thrust grinding were studied with vitreous CBN wheels using a machining center. Grinding experiments were performed according to grinding conditions, such as wheel feed speed and depth of cut, workpiece speed, and rate of grinding width. Additionally, the grinding force and grinding ratio were investigated though these experiments. Based on the experimental results, the grinding characteristics of internal thrust grinding were discussed.

• 한국정밀공학회지
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• 제16권1호통권94호
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• pp.18-25
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• 1999

Chipping is an unavoidable phenomenon in the slot grinding process of hard and brittle materials. However, it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished chipping-free grooves and obtained the clear ground surfaces on glass and WC.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.48-52
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• 1995

Chipping is an unavidable phenomean in the slot grinding process of hard and brittle materials. However,it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished shipping-free grooves and obtained the clear ground sufaces on glass and tungsten carbide.

• 한국기계가공학회지
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• 제12권5호
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• pp.36-41
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• 2013

One of the problems in grinding process using a machining center(MC) with a small diametric wheels is machining error due to decrease of the quill diameter. In this study, side-cut grinding is performed with a vitrified bonded CBN wheel on the machining center. Grinding experiments are performed at various grinding conditions including quill length, quill diameter and depth of cut. The effect on the grinding force, machining error and surface roughness due to the change of the quill rigidity are investigated experimentally. The slenderness ratio of the quill is significant factor to analyse the change of the grinding force and machining error.