• Progress in Superconductivity
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• v.6 no.2
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• pp.133-137
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• 2005

We fabricated the Au/Ni template for YBCO coated conductors and evaluated texture formation and the microstructural evolution. The cube textured Ni substrate was fabricated by rolling and recrystallization annealing, and subsequently Au layer formed on the substrate by electroless-plating method. The texture was evaluated by pole-figure with x-ray goniometer with orientation distribution function (ODF) analysis. The surface roughness and grain boundary morphology of template were characterized by atomic force microscopy (AFM) We observed that Au layer deposited epitaxially on Ni substrate and formed a strong cube texture when plating time was optimized. The full-width at half-maximum (FWHM) was $8.4^{\circ}$ for out-of-plane and $9.98^{\circ}$ for in-plane texture for plating time of 30 min. Microstructural observation showed that the Au layer was homogeneous and dense without formation of crack/microcrack. In addition, we observed that root-mean-square (RMS) and depth of grain boundary were 14.6 nm and 160 $\AA$ for the Au layer, respectively, while those were 27.0 nm and 800 $\AA$ for the Ni substrate, indicating that the electoless-plated Au layer had relatively smooth surface and effectively mollified grain groove.

• Korean Journal of Materials Research
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• v.27 no.5
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• pp.276-280
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• 2017

This study was carried out to evaluate the developed microstructures and mechanical properties of friction welded A6063 alloy. For this work, specimens were prepared at a size of 12 mm ${\O}{\times}80mm$, and friction welding was carried out at a rotation speed of 2,000 RPM, friction pressure of $12kgf/cm^2$ and upset pressure of $25kgf/cm^2$. To perform an analysis of the grain boundary characteristic distributions, such as the grain size, orientation and misorientation angle distributions, the electron back-scattering diffraction method was used. In addition, in order to identify the dispersed intermetallic compounds of the base and welded materials, transmission electron microscopy was used. The experimental results found that the application of friction welding on A6063 led to significant grain refinement of the welded zone relative to that of the base material. Besides this, intermetallic compounds such as AlMnSi and $Al_2Cu$ were found to be dispersed with more refined size relative to that of the base material. This formation retains the mechanical properties of the welds, which results in the fracture aspect at the base material zone. Therefore, based on the developed microstructures and mechanical properties, the application of friction welding on A6063 could be used to obtain a sound weld zone.

• Journal of the Korean Vacuum Society
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• v.7 no.1
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• pp.29-34
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• 1998

The solid-phase crystallization (SPC) of plasma-enhanced chemical vapor depsoited (PECVD) amorphous silicon (a-Si) films ha s been investigated by x-ray diffraction (XRD). The a-Si films were prepared on Si (100) wafers using $SiH_4$ gas and without $H_2$ dilution at the substrate temperatures between $120^{\circ}C$ and $380^{\circ}C$, and than annealed at $600^{\circ}C$ for crystallization. The annealed samples exhibited (111), (220), and (311) XRD peaks with preferential orientation of (111). The XRD peak intensities increased as the substrate temperature decreased, and the $H_2$dilution suppressed the solid-phase crystallization. The average grain size estimated by XRD analysis for the (111) texture has increased from about 10 nm to about 30 nm, as the substrate temperature decreased. The deposition rate also increased with the decreasing substrate temperature and the grain size was closely dependent on the deposition rate of the films. The grain size enhancement was attributed to an increase of the structural disorder of the Si network.

• Journal of Magnetics
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• v.21 no.1
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• pp.35-39
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• 2016

$Cr_{100-x}Ti_x$ amorphous texture-inducing layers (TIL) were investigated to realize highly (002) oriented $L1_0$ FePt-C granular films through hetero-epitaxial growth on the (002) textured bcc-$Cr_{80}Mn_{20}$ seed layer (bcc-SL). As-deposited TILs showed the amorphous phase in Ti content of $30{\leq}x(at%){\leq}75$. Particularly, films with $40{\leq}x{\leq}60$ kept the amorphous phase against the heat treatment over $600^{\circ}C$. It was found that preference of the crystallographic texture for bcc-SLs is directly affected by the structural phase of TILs. (002) crystallographic texture was realized in bcc-SLs deposited on the amorphous TILs ($40{\leq}x{\leq}70$), whereas (110) texture was formed in bcc-SLs overlying on crystalline TILs (x < 30 and x > 70). Correlation between the angular distribution of (002) crystal orientation of bcc-SL evaluated by full width at half maximum of (002) diffraction (FWHM) and a grain diameter of bcc-SL indicated that while the development of the lateral growth for bcc-SL grain reduces FWHM, crystallization of amorphous TILs hinders FWHM. $L1_0$ FePt-C granular films were fabricated under the substrate heating process over $600^{\circ}C$ with having different FWHM of bcc-SL. Hysteresis loops showed that squareness ($M_r/M_s$) of the films increased from 0.87 to 0.95 when FWHM of bcc-SL decreased from $13.7^{\circ}$ to $3.8^{\circ}$. It is suggested that the reduction of (002) FWHM affects to the overlying MgO film as well as FePt-C granular film by means of the hetero-epitaxial growth.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.3
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• pp.190-194
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• 2003

Dielectric thin films of (P $b_{0.72}$,L $a_{0.28}$) $Ti_{0.93}$ $O_3$ (PLT(28)) have been deposited on Pt(111)/Ti/ $SiO_2$/Si(100) substrates in-situ by pulsed laser deposition using different annealing and deposition Processes. We have investigated the effect of hydrogen annealing on the ferroelectric properties of PLT thin films and found that the annealing process causes the diffusion of hydrogen into the ferroelectric film resulting in the destruction of polarization. We have tried to form the film by a two-step deposition process In order to improve electrical property. Two-step process to grow PLT films was adopted and verified to be useful to enlarge the grain size of the film and to reduce the leakage current characteristics. Structural properties and electrical properties including dielectric constant, ferroelectric characteristics, and leakage current of PLT thin films were shown to be strongly influenced by grain size. The film deposited by using two-step Process including pre-annealing treatment has a strongly(111) orientation. However, the films deposited by using single -step process with hydrogen annealing process show the smallest grain size. The film deposited by using two-step process including pre-annealing treatment shows the leakage current density of below 10$^{-7}$ A/c $m^2$ for the field of smaller than 100 kV/cm. However, the films deposited by using single-step process with hydrogen annealing process and pre-annealing process show worse leakage current density than the film deposited by using two-step process including pre-annealing treatment.tment.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.6
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• pp.254-261
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• 2010

Polycrystalline silicon (pc-Si) films are fabricated and characterized for application to pc-Si thin film solar cells as a seed layer. The amorphous silicon films are crystallized by the aluminum-induced layer exchange (ALILE) process with a structure of glass/Al/$Al_2O_3$/a-Si using various thicknesses of $Al_2O_3$ layers. In order to investigate the effects of the oxide layer on the crystallization of the amorphous silicon films, such as the crystalline film detects and the crystal grain size, the $Al_2O_3$ layer thickness arc varied from native oxide to 50 nm. As the results, the defects of the poly crystalline films are increased with the increase of $Al_2O_3$ layer thickness, whereas the grain size and crystallinity are decreased. In this experiments, obtained the average pc-Si sub-grain size was about $10\;{\mu}m$ at relatively thin $Al_2O_3$ layer thickness (${\leq}$ 16 nm). The preferential orientation of pc-Si sub-grain was <111>.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.138-141
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• 2001

The evolution of lectures and microstructure during the warm-rolling and subsequent annealing in aluminum 3004 alloy sheets was investigated by employing X-ray texture measurements and microstructure observations. Whereas the typical $\beta$-fiber orientations with the strong Bs-orientation $\{112\}<110>$ formed in the normally cold-rolled specimen, the warm-rolling at $250^{\circ}C$ led to the development of a strong through thickness texture gradient which was characterized by shear texture at the surface layer and rolling textures at the center layer After warm rolling, ultra-fine grains formed in the thickness layer with shear texture components. Upon recrystallization annealing, the $\{001\}<100>$ Cube-texture developed at the expense of normal rolling texture components the rise to the formation of corase recrystallized grains. However, in the layer with shear texture components the continuous recrystallization took place and the fine grain size persisted even after recrystallization annealing.

• Journal of the Korean Ceramic Society
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• v.31 no.8
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• pp.920-926
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• 1994

Ta doped PZT thin films were prepared by a reactive sputtering method with a 3-gun magnetron co-sputter, and effects of Ta doping on physical and electrical properties of the films were studied. Within the doping range of 0 to 3.6 at%, Ta doping enhanced the crystallographic orientation of (110), but reduced that of (100). Ta doped PZT had a larger grain size of about 20 ${\mu}{\textrm}{m}$ compared with that of 5 ${\mu}{\textrm}{m}$ for un-doped PZT. Pits and holes of PZT films which used to appear with annealing at high temperature due to evaporation of PbO were much suppressed with addition of Ta. The leakage current could be reduced down to 1.27$\times$10-8 A/$\textrm{cm}^2$ and the charge storge density as large as 25.8$\mu$C/$\textrm{cm}^2$ was obtained.

• Applied Microscopy
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• v.21 no.2
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• pp.57-66
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• 1991

The main purpose of this paper was to investigate the change of rapidly solidified microstructures and dispersoid behavior according to heat-treatment in the Al-Fe-V-Si-(Mn) alloys. It was found that (111) preferred orientation identified by X-ray diffraction and fine subgrain/large grain were observed in the rapidly solidified Al-Fe-V-Si-(Mn) alloys. Cell boundary of the zone A was composed of the microcrystalline, whereas that of the zone B was amorphous. Decomposition of the Al-Fe-V-Si-(Mn) alloys occurred at about $300^{\circ}C$. These alloys exhibited excellent thermal stability at the elevated temperature. Microstructure of the zone B was more stable than that of the zone A. The spherical dispersoid and 5-fold symmetry phase was also more thermally stable than the amorphous structure of cell boundary.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.120-126
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• 2003

Finite element analysis model is suggested for analysis of milli-forming process, which forms milli-size products. Since the size of workpiece in a milli-forming process ranges from a few hundred micrometers to a few millimeters, microstructural changes such as the growth of micro-voids and the development of preferred orientation in a grain become crucial factors for the success of milli-forming. This analysis model incorporates anisotropy from deformation torture and deterioration of mechanical properties due to the growth of micro-voids. Applications of the proposed modeling to milli-forming are given and the results are carefully examined to understand the deformation characteristics such as texture development and damage evolution during extrusion/drawing of a milli-bar.