• 한국압력기기공학회 논문집
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• 제14권1호
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• pp.15-23
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• 2018

A compact heat exchanger is one of critical components in a very high temperature gas-cooled reactor (VHTR). Alloy 617 (Ni-Cr-Co-Mo) is considered as one of leading candidates for this application due to its excellent thermal stability and strengths in anticipated operating conditions. On the basis of current ASME code requirements, sixty sheets of this alloy are prepared for diffusion welding, which is the key technology to have a reliable compact heat exchanger. Optical microscopic analysis show that there are no cracks, incomplete bond, and porosity at/near the interface of diffusion weldment, but Cr-rich carbides and Al-rich oxides are identified through high resolution electron microscopic analysis. In high-temperature tensile testing, superior yield strengths of the diffusion weldment compared to the code requirement are obtained up to 1223 K ($950^{\circ}C$). However, both tensile strength and ductility drop rapidly at higher temperature due to the insufficient grain boundary migration across the interface of diffusion weldment. Best fit curves for minimum yield strength and average tensile strength are drawn from the experimental tensile results of this study.

• 한국군사과학기술학회지
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• 제2권1호
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• pp.183-193
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• 1999

환원분위기 소결조건에서 반도성 (Sr0.85Ca0.15)TiO3 소결체를 제조한후, 금속 양이온(Na, K)을 소결체 입계를 통해 확산시켜 확산시간과 확산량에 따른 소결체의 전기적 특성 변화를 고찰하였다. K이온과 Na 이온을 입계확산시킨 경우 반도성 소결체는 바리스터 특성을 나타내며, 확산시간과 확산량이 증가함에 따라 문턱전압이 증가하였다. 이들 소결체의 입계전위장벽은 0.01 ~ 2.89 eV이며 입계저항은 2.2 ~ 120.4 $M{\Omega}$ 값을 나타냈다 투과전자현미경을 이용하여 입계의 구조를 관측하였으며 이들 결과와 소결체의 전기적 특성과의 상관관계를 고찰하였다.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2014년도 임시총회 및 하계학술연구발표회
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• pp.82-83
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• 2014

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2013년도 자성 및 자성재료 국제학술대회
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• pp.110-110
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• 2013

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2016년도 임시총회 및 하계학술연구발표회
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• pp.52-53
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• 2016

• 동력기계공학회지
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• 제10권3호
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• pp.51-57
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• 2006

The effect of grain size on corrosion resistance and high temperature oxidation behavior was studied in 22Cr-15Ni-5W super austenitic stainless steels for desulfurization equipment as a heat power station. In the high temperature oxidation test, oxidation rate was increased as the temperature increased from $600^{\circ}C\;to\;800^{\circ}C$. In vapor, oxidation rate was faster than that in air. Because the vapor was inhibited nucleation of $Cr_2O_3$ film. And the high temperature oxidation resistance at $600^{\circ}C{\sim}800^{\circ}C$ was excellent from all specimens and specimen of the smallest grain size was the most excellent. Because increasing of diffusion course through the grain-boundary was promoted nucleation and growth of $Cr_2O_3$ film. In the test temperature at $600^{\circ}C{\sim}800^{\circ}C$, Cr rich round particle oxide was formed in air, whereas Fe rich needle type oxide was developed in vapor.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• Journal of Magnetics
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• 제16권4호
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• pp.342-349
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• 2011

[ $Nd_2Fe_{14}B$ ]permanent magnetic powders ($_iH_c$ = 9.2 kOe, $B_r$ = 12.2 kG) were produced by HDDR process. Their coercivity was enhanced to 12.6 kOe through the grain boundary diffusion process with dysprosium hydride ($DyH_x$). $DyH_x$ diffusion process was optimized through rotating diffusion process, resulting in distinct phases rich in Nd and Dy observable by field emission scanning microscopy and transmission electron microscopy. The mechanism of coercivity enhancement that resulted in restrain the coupling effect between $Nd_2Fe_{14}B$ grains is also discussed.

• Journal of Microbiology and Biotechnology
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• 제21권12호
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• pp.1257-1263
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• 2011

This paper is dedicated to the study on the external and internal mass transfers of glucose for succinic acid fermentation under substrate and product inhibitions using a bioreactor with stirred bed of immobilized Actinobacillus succinogenes cells. By means of the substrate mass balance for a single particle of biocatalysts, considering the kinetic model adapted for both inhibitory effects, specific mathematical models were developed for describing the profiles of the substrate concentration in the outer and inner regions of biocatalysts and for estimating the substrate mass flows in the liquid boundary layer surrounding the particle and inside the particle. The values of the mass flows were significantly influenced by the internal diffusion velocity and rate of the biochemical reaction of substrate consumption. These cumulated influences led to the appearance of a biological inactive region near the particle center, its magnitude varying from 0 to 5.3% of the overall volume of particles.

• 한국진공학회지
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• 제9권3호
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• pp.267-272
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• 2000

electroplating(EP)법을 이용하여 ULSI용 Cu 박막을 제조하였다. seed Cu는 sputtering으로 증착하였으며, 확산방지막으로 TaN를 사용하였다. 제작된 EP Cu 박막은 seed Cu의 영향으로 열처리 조건에 관계없이 Cu(111)방향으로 강하게 우선 배향 하였다. 열처리 온도와 시간이 증가함에 따라 Cu박막의 미세조직이 non-columnar structure에서 약 2배 이상 결정립 성장하여 columnar structure로 바뀌었으며, 또한 as-deposit시 관찰되었던 stacking fault, twin, dislocation들이 상당히 줄어드는 것이 관찰되었다. Cu의 확산에 의하여 생기는 copper-silicide는 관찰할 수 없었으며, 이것은 두께 45nm의 TaN막이 $450^{\circ}C$, 30분 열처리시 확산방지막으로 충분한 역할을 한 것으로 판단된다. Cu(111)우선 배향과 열처리에 의한 결정립 성장 및 defect감소는 Cu 박막의 결정립계에서 발생하는 electromigration 현상을 상당히 줄일 수 있을 것으로 판단된다.