• Korean Journal of Materials Research
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• v.16 no.9
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• pp.564-570
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• 2006

Silicides have been required to be below 40 nm-thick and to have low contact resistance without agglomeration at high silicidation temperature. We fabricated composite silicide layers on the wafers from Ni(20 nm)/Co(20 nm)/poly-Si(70 nm) structure by rapid thermal annealing of $700{\sim}1100^{\circ}C$ for 40 seconds. The sheet resistance, surface composition, cross-sectional microstructure, and surface roughness were investigated by a four point probe, a X-ray diffractometer, an Auger electron spectroscopy, a field emission scanning electron microscope, and a scanning probe microscope, respectively. The sheet resistance increased abruptly while thickness decreased as silicidation temperature increased. We propose that the fast metal diffusion along the silicon grain boundary lead to the poly silicon mixing and inversion. Our results imply that we may consider the serious thermal instability in designing and process for the sub-0.1 um CMOS devices.

• Journal of Hydrogen and New Energy
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• v.22 no.2
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• pp.199-205
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• 2011

Stainless steel 304 and 316 plates were deposited with the multi-layered coatings of titanium film (0.1 um) and gold film (1-2 um) by an electron beam evaporation method. The XRD patterns of the stainless steel plates modified with the multi-layered coatings showed the crystalline phases of the external gold film and the stainless steel substrate. Surface microstructural morphologies of the stainless steel bipolar plates modified with multi-layered coatings were observed by AFM and FE-SEM images. The external gold films formed on the stainless steel plates showed micro structure of grains of about 100 nm diameter. The grain size of the external surface of the stainless steel plates increased with the gold film thickness. The electrical resistance and water contact angle of the stainless steel bipolar plates covered with multi-layered coatings were examined with the thickness of the external gold film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.330-333
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• 2002

The substrate temperature is an important parameter in thin film deposition process. In this paper the effects of the substrate temperature on the properties of CuIn0.75Ga0.25Se2(CIGS) thin films are reported. Structure, surface morphology and optical properties of CIGS thin films deposited at various substrate temperatures have been investigated using a number of analysis techniques. X-ray diffraction (XRD) analysis shows that CIGS films exhibit a strong <112> preferred orientation. As expected, at higher substrate temperatures the films displayed a higher degree of crystallinity. The <112> peak was also enhanced and other CIGS peaks appeared simultaneously These results were supported by experimental work using Raman spectroscopy. The Raman spectra of the as-grown CIGS thin films show only the Al mode peak. The intensity of this peak was enhanced at higher deposition temperatures. Scanning electron microscopy (SEM) results revealed very small grains in films fabricated at 48$0^{\circ}C$ substrate temperature. When the substrate temperature was increased the average grain size also increased together with a reduction in the number and size of the voids. The deposition temperature also had a significant influence on the transmission spectra.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.383-386
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• 2002

Polycrystalline Cu(In,Ga)Se$_2$(CIGS) thin-films were grown by co-evaporation on a soda lime glass substrate. In this paper the effects of the Se evaporation temperature on the properties of CuIn0.75Ga0.25Se2 (CIGS) thin films. Structure, surface morphology and optical properties of CIGS thin films deposited at various Se evaporation temperatures have been investigated using a number of analysis techniques. X-ray diffraction (XRD) analysis shows that CIGS films exhibit a strong <112> preferred orientation. As expected, at higher Se evaporation temperatures the films displayed a lower degree of crystallinity. The <112> peak was also enhanced and other CIGS peaks appeared simultaneously. These results were supported by experimental work using scanning electron microscopy When the Se evaporation temperature was increased, the average grain size also decreased together with a reduction Cu content. The Se evaporation temperature also had a significant inf1uence on the transmission spectra. Increasing the Se evaporation temperature, the cell efficiency was improved dramatically to 11.75% with Voc = 556 mV, Jsc = 32.17 mA/cm2 and FF = 0.66. The Se evaporation temperature is an important parameter in thin film deposition regardless of the deposition technique being used to deposit thin films

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1264-1267
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• 1998

$Cu(In_xGa_{1-x})Se_2$ thin films were prepared and characterized with various Ga contents. As the Ga content increased, the grain size of CIGS film became smaller. The 2 $\theta$ values in XRD patterns were shifted to larger values and the overlapped peaks were splitted. The energy bandgap increased from 1.04 to 1.67 eV and the resistivity decreased. The solar cell fabricated with ZnO/CdS/$Cu(In_{0.7}Ga_{0.3})Se_2/Mo$ structure yielded an efficeincy of 14.48% with an acitive area of 0.18 $cm^2$. The efficiency decreased with further increase of Ga content.

• Journal of the Korean Ceramic Society
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• v.41 no.2
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• pp.97-101
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• 2004

W $O_{x}$-based semiconductor type thin film gas sensor was fabricated for the detection of N $O_{x}$ by reactive d.c. sputtering method. The relative oxidation state of the deposited W $O_{x}$ films was approximately compared by the calculation of the difference of the binding energy between Ols to W4 $f_{7}$2/ core level XPS spectra in the standard W $O_3$ powder of known composition. As the annealing temperature increased from 500 to 80$0^{\circ}C$, relative oxygen contents and grain size of the sputtered films were gradually increased. As the results of sensitivity ( $R_{gas}$/ $R_{air}$) measurements for the 5 ppm N $O_2$ gas, the sensitivity was 110 and the sensor showed recovery time as fast as 200 s. The other sensor properties were examined in terms of surface microstructure, annealing temperature, and relative oxygen contents. These results indicated that the W $O_3$ thin film with well controlled structure is a good candidate for monitoring and controlling of automobile exhaust.haust.t.t.t.

• The Korean Journal of Ceramics
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• v.5 no.3
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• pp.224-229
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• 1999

The preparation and toughening of SiC-AIN solid solution from powder mixtures of $\beta$-SiC, AIN and $\alpha$-SiC by hot-pressing were studied in the 1870 to $2030^{\circ}C$ temperature range. The reaction of AIN and $\beta$-SiC(3C) powders causing transformation to the 2H(wurtzite) structure appeared to depend on hot-pressing temperatures and an additive of $\alpha$-SiC. For the composition of 49wt% SiC with 2 wt% $\alpha$-SiC and 47.5 wt% AIN47.5wt% SiC with 5 wt % $\alpha$-SiC at 203$0^{\circ}C$ for 1 h, th complete solid solutions with a single phase of 2H could be obtained. The appreciable amount of $\alpha$-SiC could develop the columnar inter-grains of 4H phase and the stable 2H phase with the relatively uniform composition and grain size distributions. The effect of $\alpha$-SiC on the phases present and compositional microstructures with columnar inter-grains was invetigated using X-ray diffraction, scanning electron microscopy and transmission electron microscopy. The fracture toughness and Vickers hardness of the hot-pressed solid solutions wre examined by the indentation-fracture-test method.

• Journal of the Korean Ceramic Society
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• v.53 no.2
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• pp.234-240
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• 2016

Energetically-modified material using reject fly ash (RFA), generated from thermal power plants, was manufactured to investigate the effect of the material on the physical and chemical characteristics of cement mortar. In order to modify reject fly ash, a vibration mill was used. Particle size, grain shape, and crystal structure of the ash were analyzed. Then, the compressive strength of the mortar using energetically-modified reject fly ash (ERFA) was measured. Microstructure and X-ray diffraction (XRD) patterns were also used in the analysis. As the replacement rate of ERFA increased, the value of the compressive strength tended to decrease. However, it was found that the compressive strength values of 7 and 28 days-cured specimens were higher than those of conventional ordinary Portland cement (OPC) mortar with 10 % replacement rate condition.

• Transactions on Electrical and Electronic Materials
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• v.4 no.2
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• pp.24-28
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• 2003

(Ba,Sr,Ca)TiO$_3$ powders, prepared by the sol-gel method, were mixed with organic binder and the BSCT thick films were fabricated by the screen printing techniques on alumina substrates. All the BSCT thick films, sintered at 1420$^{\circ}C$, showed the typical XRD patterns of a perovskite polycrystalline structure. The average grain sizes decreased with increasing amounts of ZrO$_2$, and the BSCT(40/40/20) thick films doped with 2wt% MnO$_2$ showed a value of 8$\mu\textrm{m}$. The thickness of thick films by four-cycle on printing/drying was approximately 951$\mu\textrm{m}$. The relative dielectric constant decreased with increasing Ca content and MnO$_2$ doping amount. The relative dielectric constant, dielectric loss and tunability of the BSCT(50/40/10) thick films doped with 2.0wt% ZrO$_2$ were 772, 0.184％ and 15.62%, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.05a
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• pp.100-103
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• 1993

Ferroelectric lean-titanate thin films were fabricated by sol-gel processing. Sol-gel derived $PbTiO_3$ thin films crystallized into the expected tetragonal perovskite structure when heated to $600^{\circ}C$ and above. The effects of annealing temperature on grain size made with SEM observation are reported. The films heated at $650^{\circ}C$ for 30min showed a square-type hysteresis loop with $P_r$ and $E_c$ of $11.5{\mu}C/cm^2$, 115kV/cm, respectively.