• Journal of Powder Materials
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• v.5 no.1
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• pp.15-21
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• 1998

The effect of $\alpha$/$\beta$ phase on the mechanical properties and contact damage of silicon nitrides $Si_3N_4$) was investigated. Silicon nitride materials were prepared from two starting powders, at selective increasing hot-pressing temperatures to coarsen the microstructures: (i) from relatively coarse $\alpha$-phase powder, essentially equiaxed $\alpha$-$Si_3N_4$ grains, with limited, slow transformation to $\beta$-$Si_3N_4$ grain; (ii) from relatively fine $\alpha$-phase powder, a more rapid transformation to $\beta$-$Si_3N_4$, with attendant grain elongation. The resulting micro-structure thereby provided a spectrum of $\alpha$/$\beta$ phase ratios, grain sizes, and grain shapes. Fracture strength, hardness, and toughness were measured, and contact damage and strength degradation after indentation were investigated by Hertzian indentation using spherical indenter. A brittle to ductile transition in $Si_3N_4$ depended on $\alpha$/$\beta$ phase ratio as well as grain size. Silicon nitride with elongated $\beta$ grains showed a superior, contact damage resistance.

• Journal of the Korean Society of Safety
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• v.17 no.4
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• pp.45-51
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• 2002

In this study, the fracture characteristics of carbonized silicon grinding wheels were examined with tensile, compression, impact and bending test. The experiment was performed for the various grinding wheels with grain size #46, #80, and grade H, L, P, and one vitrified bond and one structure No.7. Also the centrifugal fracture rpm of carbonized silicon grinding wheels were measured and compared with the calculated values for the various wheel diameters and thicknesses. The results showed that the fracture tensile strength was $1.5~2.0Kg_f/mm^2$, and it was increased by decreasing grain size and increasing grade. The fracture compression loads were $1,600~3,000Kg_f$, and the inner stress was higher than outer's. And the absorption energy of impact test was 3.3~4.7 J, and it was increased by decreasing grain size but it was not effected by grade. The fracture bending stress was $0.1~0.2Kg_f/mm^2$, and it was increased by decreasing grain size and increasing grade. The centrifugal fracture rpm of carbonized silicon grinding wheel was about 8,500~12,000 and agreed well with the calculated value, and it was increased by decreasing diameter. However, it was almost constant for the reduction of wheel thickness.

• Journal of Surface Science and Engineering
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• v.27 no.5
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

• Korean Journal of Materials Research
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• v.31 no.7
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• pp.397-402
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• 2021

In this study, binderless-WC, WC-6 wt%Co, WC-6wt% 1 and 2.5 B₄C materials are fabricated by spark plasma sintering process (SPS process). Each fabricated WC material is almost completely dense, with a relative density up to 99.5 % after the simultaneous application of pressure of 60 MPa. The WC added Co and Co-B₄C materials resulted in crystalline growth. The WC with HCP crystal structure has respective interfacial energy (basal facet direction: 1.07 ~ 1.34 J·m^-2, prismatic direction: 1.43 ~ 3.02 J·m^-2) that depends on the grain growth direction. It is confirmed that the continuous grain growth, biased by the basal facet, which has relatively low energy, is promoted at the WC/Co interface. As abnormal grain growth takes place, the grain size increases more than twice from 0.37 to 0.8 um. It is found through analysis that the hardness property also greatly decreases from about 2661.4 to 1721.4 kg/mm², along with the grain growth.

• Journal of Surface Science and Engineering
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• v.49 no.4
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• pp.376-381
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• 2016

The effects of ICP (Inductively Coupled Plasma) power, ranging from 0 to 200 W, on the crystal structure, microstructure, surface roughness and mechanical properties of magnetron sputtered VN coatings were systematically investigated with FE-SEM, AFM, XRD and nanoindentation. The results show that ICP power has a significant influence on coating microstructure and mechanical properties of VN coatings. With the increasing of ICP power, coating microstructure evolves from a porous columnar structure to a highly dense one. Average crystal grain size of single phase cubic fcc VN coatings was decreased from 10.1 nm to 4.0 nm with increase of ICP power. The maximum hardness of 28.2 GPa was obtained for the coatings deposited at ICP power of 200 W. The smoothest surface morphology with Ra roughness of 1.7 nm was obtained from the VN coating sputtered at ICP power of 200 W.

• Journal of Ceramic Processing Research
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• v.22 no.5
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• pp.590-596
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• 2021

The widespread use of TiC-based cermets as cutting tools, thin-film, ultracapacitors, nozzles, and bearings is primarily due to exhibit combination of excellent mechanical properties such as low density, high hardness, and stiffness. The TiC cermets were synthesized by high energy ball milling, which includes binder metal (Ni), carbides (WC and Mo2C), wherein the present study focus on the relationship between the core-rim structure, phase constitution, and mechanical properties. Here, using in situ TEM, we clearly observed the behavior of adjacent core-rim formation from the solid-phase reaction with grain refinement of the TiC phase control of both the milling time and lattice formation. Also, we proposed that mechanically alloyed core-rim structure can affect oxidation resistance of TiC-Mo2C-WC-Ni cermets strongly related to activation energy attributed to TiC particle size. The mechanical properties of TiC-Mo2C-WC-Ni cermets suggest the hardening effect is not considered only grain refinement, but rather is solid solution strengthening and particle-dispersion hardening. The present study paves the relation to the formation behavior of both TiC hard phase and core-rim structure due to the mechanical powder synthesis of novel TiC-based cermets.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.309-314
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• 2004

Static and transient behaviour of Low Temperature Poly-Si TFTs (LTPS-TFTs) and Single Grain TFTs (SG- TFTs) are compared 3-D simulation is applied here for the first time to TFTs to account for the structure and twin boundaries in SG-TFTs.

• Applied Microscopy
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• v.1 no.1
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• pp.3-10
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• 1969

By the use of electron microscope, the study has beek made on the grain size in photo graphic emulsions, which are made at different temperature. It is found that ,the optimum temperature is $60^{\circ}C$, at which the average grain size obtained is the biggest. Also electron micrographs show NaCl-type crystal structure of AgBr and AgCl, as we expected.

• Journal of the Semiconductor & Display Technology
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• v.14 no.1
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• pp.67-71
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• 2015

Pulse electroplating was studied to form nanocrystal structure effectively by changing plating current density and duty cycle. When both of plating current density and duty cycle were decreased from $100mA/cm^2$ and 70% to $50mA/cm^2$ and 30%, the P content in the Ni matrix was increased almost up to the composition of $Ni_3P$ compound and the grain growth after annealing was retarded as well. The as-plated hardness values ranging from 660 to 753 HV are mainly based on the formation of nanocrystal structure. On the other hand, the post-anneal hardness values ranging from 898 to 1045 HV, which are comparable to the hardness of hard Cr, are coming from how competition worked between the precipitation of $Ni_3P$ and the grain coarsening. According to the ANOVA and regression analysis, the plating current density showed more strong effect on nanocrystal size and film hardness than the duty cycle.

• Journal of Surface Science and Engineering
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• v.28 no.2
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• pp.67-76
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• 1995

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. As-deposited films show columnar structure. The microstructure of furnace cooled 63Sn/37Pb solder shows typical lamellar form, but that of RTA treated solder has the structure showing an uniform dispersion of Pb-rich phase in Sn matrix. The grain size of 95Pb/5Sn solder reflowed in the furnace is about $5\mu\textrm{m}$, but the grain size of RTA treated solder is too small to be observed. The microstructure in 63Sn/37Pb solder bump shows the segregation of Pb phase in the Sn rich matrix regardless of reflowing method. The 63Sn/37Pb solder bump formed by RTA process shows more uniform microstructure. These result are related to the heat dissipation in the solder bump.