• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.14 no.1
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• pp.15-23
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• 2018

A compact heat exchanger is one of critical components in a very high temperature gas-cooled reactor (VHTR). Alloy 617 (Ni-Cr-Co-Mo) is considered as one of leading candidates for this application due to its excellent thermal stability and strengths in anticipated operating conditions. On the basis of current ASME code requirements, sixty sheets of this alloy are prepared for diffusion welding, which is the key technology to have a reliable compact heat exchanger. Optical microscopic analysis show that there are no cracks, incomplete bond, and porosity at/near the interface of diffusion weldment, but Cr-rich carbides and Al-rich oxides are identified through high resolution electron microscopic analysis. In high-temperature tensile testing, superior yield strengths of the diffusion weldment compared to the code requirement are obtained up to 1223 K ($950^{\circ}C$). However, both tensile strength and ductility drop rapidly at higher temperature due to the insufficient grain boundary migration across the interface of diffusion weldment. Best fit curves for minimum yield strength and average tensile strength are drawn from the experimental tensile results of this study.

• Journal of the Korea Institute of Military Science and Technology
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• v.2 no.1
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• pp.183-193
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• 1999

Semiconducting (Sr0.85Ca0.15)TiO3 ceramics were prepared by conventional powder synthesis techniques, and then alkaline metallic cations were diffused into the ceramic bodies. The threshold voltage of the ceramics increases with increasing diffusion time and the amount of diffused materials. The ceramics had boundary potential heights of 0.01 ~ 2.89 eV, while their boundary resistance ranged from 2.2 $M{\Omega}$ to 120.4 $M{\Omega}$. Such electrical characteristics of the boundaries were correlated with the boundary structure of the ceramics obtained by transmission electron microscopy.

• Proceedings of the Korean Magnestics Society Conference
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• 2014.05a
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• pp.82-83
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• 2014

• Proceedings of the Korean Magnestics Society Conference
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• 2013.12a
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• pp.110-110
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• 2013

• Proceedings of the Korean Magnestics Society Conference
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• 2016.05a
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• pp.52-53
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• 2016

• Journal of Power System Engineering
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• v.10 no.3
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• pp.51-57
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• 2006

The effect of grain size on corrosion resistance and high temperature oxidation behavior was studied in 22Cr-15Ni-5W super austenitic stainless steels for desulfurization equipment as a heat power station. In the high temperature oxidation test, oxidation rate was increased as the temperature increased from $600^{\circ}C\;to\;800^{\circ}C$. In vapor, oxidation rate was faster than that in air. Because the vapor was inhibited nucleation of $Cr_2O_3$ film. And the high temperature oxidation resistance at $600^{\circ}C{\sim}800^{\circ}C$ was excellent from all specimens and specimen of the smallest grain size was the most excellent. Because increasing of diffusion course through the grain-boundary was promoted nucleation and growth of $Cr_2O_3$ film. In the test temperature at $600^{\circ}C{\sim}800^{\circ}C$, Cr rich round particle oxide was formed in air, whereas Fe rich needle type oxide was developed in vapor.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• Journal of Magnetics
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• v.16 no.4
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• pp.342-349
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• 2011

[ $Nd_2Fe_{14}B$ ]permanent magnetic powders ($_iH_c$ = 9.2 kOe, $B_r$ = 12.2 kG) were produced by HDDR process. Their coercivity was enhanced to 12.6 kOe through the grain boundary diffusion process with dysprosium hydride ($DyH_x$). $DyH_x$ diffusion process was optimized through rotating diffusion process, resulting in distinct phases rich in Nd and Dy observable by field emission scanning microscopy and transmission electron microscopy. The mechanism of coercivity enhancement that resulted in restrain the coupling effect between $Nd_2Fe_{14}B$ grains is also discussed.

• Journal of Microbiology and Biotechnology
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• v.21 no.12
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• pp.1257-1263
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• 2011

This paper is dedicated to the study on the external and internal mass transfers of glucose for succinic acid fermentation under substrate and product inhibitions using a bioreactor with stirred bed of immobilized Actinobacillus succinogenes cells. By means of the substrate mass balance for a single particle of biocatalysts, considering the kinetic model adapted for both inhibitory effects, specific mathematical models were developed for describing the profiles of the substrate concentration in the outer and inner regions of biocatalysts and for estimating the substrate mass flows in the liquid boundary layer surrounding the particle and inside the particle. The values of the mass flows were significantly influenced by the internal diffusion velocity and rate of the biochemical reaction of substrate consumption. These cumulated influences led to the appearance of a biological inactive region near the particle center, its magnitude varying from 0 to 5.3% of the overall volume of particles.

• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.267-272
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• 2000

Electroplating Cu was deposited on Si(100) wafer after seed Cu was deposited by sputtering first. TaN was deposited as a diffusion barrier before depositing the seed Cu. Electroplating Cu thin films show highly (111)-oriented microstructure for both before and after annealing at $450^{\circ}C$ for 30min and no copper silicide was detected in the same samples, which indicates that TaN barrier layer blocks well the Cu diffusion into silicon substrate. After annealing the electroplating Cu film up to $450^{\circ}C$, the Cu film became columnar from non-columnar, its grain size became larger about two times, and also defects density of stacking faults, twins and dislocations decreased greatly. Thus the heat treatment will improve significantly electromigration property caused by the grain boundary in the Cu thin films.