• Journal of the Korean GEO-environmental Society
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• v.16 no.3
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• pp.35-39
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• 2015

Continuous adsorption and recovery characteristics for gold and lead-cyanide complexes in industrial wastewater were investigated by the Dowex 21K XLT resin. The Dowex 21K XLT resin could continuously remove over 95% for gold-cyanide complex until 520 bed volumes at the 0.5 mL/min of influent flow rate, however, could not remove lead-cyanide complex at all. The 96% of gold-cyanide complex adsorbed onto Dowex 21K XLT resin could be recovered by mixed solvent with HCl and acetone (7:3 ratio) within 8 bed volumes. Also, the bed volume for gold-cyanide complex using secondly reused Dowex 21K XLT resin was maintained as the 490, therefore, continuous process using Dowex 21K XLT resin can be sufficiently applied to the industrial wastewater containing gold ions.

• Clean Technology
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• v.19 no.4
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• pp.487-491
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• 2013

To efficiently desorb gold and copper-cyanide complexes adsorbed onto Dowex21K XLT resin, the mixed solvent with HCl and acetone which is a kind of dipolar aprotic solvent was used as a desorbing agent. The desorption efficiency for gold-cyanide complex was the highest as about 94% when the mixing ratio of HCl and acetone based on volume was the 7:3, however, the value decreased as the ratio of acetone increased. In the case of copper-cyanide complex, most of them was desorbed when the amount of HCl was relatively higher than that of acetone, however, desorption efficiency decreased as the ratio of acetone increased. The desorption efficiency for gold and copper-cyanide complexes was the 94 and 100%, respectively at the 0.6 M of HCl with the 7 (HCl) : 3 (Acetone) of mixing ratio and desorption efficiency for gold-cyanide complex not increased any more even though higher HCl concentration was used. And the desorption efficiency for gold and copper-cyanide complexes was about 100% at the S/L raio ${\leq_-}1.0$ whereas desorption efficiency for gold-cyanide complex was very low as about 20-29% at the S/L ratio > 1.0. Also, most of desorption process for gold and copper-cyanide complexes was completed within 120 min.

• Corrosion Science and Technology
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• v.21 no.2
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• pp.89-99
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• 2022

A versatile method for performing non-cyanide electroless gold plating using thiomalic acid (TMA) as a complexing agent and 2-aminoethanethiol (AET) as a reducing agent was investigated. It was found that TMA was an excellent complexing agent for gold. It can be used in electroless gold plating baths at a neutral pH with a high solution stability, makes it a potential candidate to replace conventional toxic cyanide complex. It was found that one gold atomic ion could bind to two TMA molecules to form the [2TMA-Au⁺] complex in a solution. AET can be used as a reducing agent in electroless gold plating solutions. The highest current density was obtained at electrode rotation rate of 250 to 500 rpm based on anodic and cathodic polarization curves with the mixed potential theory. Increasing AET concentration, pH, and temperature significantly increased the anodic polarization current density and shifted the plating potential toward a more negative value. The optimal gold ion concentration to obtain the highest current density was 0.01 M. The cathodic current was higher at a lower pH and a higher temperature. The current density was inversely proportional to TMA concentration.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.304-307
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• 2007

As to the reflection electrode of LCD (liquid crystal displays), silver-copper-gold alloy (hereafter, it is called as ACA (Ag98%, Cu1%, Au1%)) is an effective material of which weathering resistance can be improved more compared with pure silver. However, there is a problem that gold remains on the substrate as residues when ACA is etched in cerium ammonium nitrate solution or phosphoric acid. Gold can not be etched in these etchants as readily as the other two alloying elements. Gold residue has actually been removed physically by brushing etc. This procedure causes damage to the display elements. Another etchant of iodine/potassium iodide generally known as one of the gold etchants can not give precise etch pattern because of remarkable difference in etching rates among silver, copper and gold. The purpose of this research is to obtain a practical etchant for ACA alloy. The results are as follows. The cyanogen complex salt of gold generates when cyanide is used as the etchant, in which gold dissolves considerably. Oxygen reduction is important as the cathodic reaction in the dissolution of gold. A new etchant of sodium cyanide / potassium ferricyanide whose cathodic reduction is stronger than oxygen, can give precise etch patterns in ACA alloy swiftly at room temperature.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.337-341
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• 2001

A new method to extract gold from pyrite roster cinder, which combines ultra-fine-grinding with resin-in-pulp, has been studied in this paper. Compared with traditional leaching technology, it can short leaching time, avoid complex filter process, lower sodium cyanide consumption and increase gold recovery by 35%. During leaching, aluminium oxide ball was used as stirred medium, hydrogen peroxide as leaching aid and sodium hexametaphosphate as grinding aid. With the high efficiency and chemistry effect of ultra-fine-grinding, the leaching process was developed and the gold leaching rate may reach 88%. With AM-2 Б resin as abosorber and sulfocarbamide (TU) as eluent, gold was recovered from cyanide pulp by resin-in-pulp. AM-2 Б resin has good adsorbability in cyanide solution(pH=10). It was easy to elude gold from the loaded resin with 0.1㏖/L cholhydric acid and 1㏖/L sulfocabamide. The effect of contact time, temperature and acidity etc. on the gold absorption had been examined with static methods. The results showed that the adsorption and desorption of gold could both reach over 98%. The effects of flow rate of solution on dynamic adsorption and elution of gold had been examined with dynamic methods. Breakthrough curve and elution curve had been drawn in this paper. A mild condition was determined through a number of experiments: leaching time 2 hours, liquid solid ratio 4:1, sodium cyanide 3kg/t, hydrogen peroxide 0.05%, sodium hexametaphosphate 0.05%; adsorption time 30 minutes, temperature 10-3$0^{\circ}C$, resin($m\ell$) solid(g) ratio 1:10, eluent resin ratio 10-20:1, velocity of eluent $1.5m\ell$/min. Under the mild condition, the gold recovery may reach 85%.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.714-719
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• 1996

For the fabrication of the circuits, contact or terminal areas are usually coated with nickel and gold. Usually, diluted palladium solution is applied to initiate electroless nickel plating on the copper circuits. However, the trace amounts of palladium remains on the resin and it causes the extraneous deposition. We confirmed that selectivity was greatly improved by the treatment with the strong reducing agents such as SBH or DMAB. Bondability was greatly influenced by the contents of phosphorus in the deposited nickel. Stabilizers in the electroless gold plating were also influenced the bonding strength. The baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. The gold deposits having strong orientation with Au(220) and Au(311) showed good bond ability.