• Bulletin of the Korean Chemical Society
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• 제23권12호
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• pp.1790-1800
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• 2002

The DNA nucleosides(dA, dC, dG, dT)bound to gold nanoparticles (~13 nm) in aqueous solution has been studied as a probe by the SERS and their coordination structures have been proposed on the basis of them. According to UV-Visible absorption of gold nanoparticles after modifying with DNA nucleosides, the rates of absorption of dA, dC, and dG were much faster than that of dT as monitored by the aggregation kinetics at 700 nm. These data indicated that the nucleosides dA, dC, and dG had a higher affinity for the gold nanoparticles surface than nucleoside dT. As the result of SERS spectra, the binding modes of each of the nucleosides on gold nanoparticles have been assigned. A dA binds to gold nanoparticles via a N(7) nitrogen atom of the imidazole ring, which the C(6)-$NH_2$ group also participates in the coordination process. In the case of dC, it binds to the gold surface via a N(3) nitrogen atom of the pyrimidine ring with a partial contribution from the oxygen of C(2)=O group. A coordination of dG to the gold surfaces is also proposed. Although the dG has the two different nitrogens of a pyrimidine ring and the amino group, the N(1) nitrogen atom of a pyrimidine ring has a higher affinity after the hydrogen migrates to the amino group. Conversely, dT binds via the oxygen of the C(4)=O group of the pyrimidine ring. Accordingly, these data suggest that the nitrogen atom of the imidazole or the pyrimidine ring in the DNA nucleosides will bind more fast to the gold nanoparticles surfaces than the oxygen atom of the carbonyl group.

• Bulletin of the Korean Chemical Society
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• 제25권9호
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• pp.1392-1396
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• 2004

The micellization of dodecylpyridinum chloride (DPC) assembled on aqueous gold nanoparticles has been studied as a function of concentration using Surface-Enhanced Raman Scattering (SERS). At the low concentration, the strong SERS band of the benzene ring moiety was observed at 1025 $cm^{-1}$, and assigned to “trigonal ring breathing”. According to high concentration of DPC, a new strong band was also appeared at 1012 $cm^{-1}$, which was assigned to “totally symmetry ring breathing”. The difference of two spectra seems to ascribe to the geometry of polar head group, i.e., pyridinium cation. These geometry exist flat-down at low concentration, whereas standing-up or tilted geometry at high concentration. The critical micelle concentration (CMC) was first obtained from the ratio of intensities of the two bands related to the benzene ring moiety by vibrational spectroscopy, and was about 28 mM. After the CMC, the benzene ring moiety in the micelle state was more restricted than in monomer state because there is no more change of intensities at 1012 $cm^{-1}$. In addition, the size of gold-assembled micelle was estimated using light scattering and it was about 328.3 nm.

• 한국기계가공학회지
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• 제15권2호
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• pp.97-103
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• 2016

When chewing forces are repetitively applied to a dental implant, gaps are often generated at the interface surfaces between the abutment and the fixture, which results in some deterioration, such as loosening of the fastening screw, dental retraction, and fixture fractures. To cope with such problems, a sealing-type abutment having a number of grooves along the conical-surface circumference was previously developed, and it showed better sealing performance than conventional ones. To enhance the sealing performance, a new model in which a gold ring is inserted into the top groove of the sealing-type abutment is developed in this study. In addition, a manufacturing process is developed, and performance evaluations, such as fatigue and sealing tests, are carried out. The evaluation results show that the gold-ring-inserted sealing abutment yields better performance than conventional ones.

• 헤리티지:역사와 과학
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• 제52권3호
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• pp.160-171
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• 2019

나주 정촌고분 1호 석실 출토 소환두도는 내부 별도 장식이 없는 오각형 환두도이다. 또한 모도와 자도 2자루로 구성된 모자대도이다. 정촌고분 소환두도는 환두부, 병부, 신부, 초미금구로 구성되었다. 소환두도 환두는 철지은장(鐵地銀裝)이지만 은(銀)이 염화은으로 부식되면서 연보라색을 띠며 내부 철제 심의 부식물이 표면에 형성되었다. 염화은은 염화이온이 용해된 매장 환경에서 은이 수분과 반응하여 생성되는데, 가루 형태로 부식되어 유물의 형태 보존을 어렵게 한다. 정촌고분에서 함께 출토된 다른 은제 유물도 유사한 부식 형태를 보여주고 있다. 정촌고분 소환두도의 X선 투과조사 및 CT 분석 결과, 철제 외환에 T자형 슴베를 만들고 신부의 슴베와 연결하였다. 소환두도의 자도를 참고하여 모도의 형태를 유추하면, 모도는 환두, 병두금구, 병연금구를 은판(銀板)으로 감싸고 금제 환과 은제 선으로 병부를 장식하였다. 환두 슴베와 신부 슴베의 연결 방식은 리벳 구멍이 확인되지 않아 단접(鍛接)한 것으로 판단되었다. 초미금구는 철판으로 형태를 만들고 끝단을 견직물로 감싸고 그 아래를 은판과 금제 환으로 장식하였다. 정촌고분 소환두도는 금 은 철제 금속을 다양하게 사용하였으며 백제, 신라, 가야의 여러 가지 요소가 복합적으로 구성되어 주변 유적 및 여러 문화권 영향을 받았음을 확인할 수 있었다.

• 공업화학
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• 제19권4호
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• pp.382-387
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• 2008

착체중합법을 이용하여 $Ba_{0.5}Sr_{0.5}Co_{0.8}Fe_{0.2}O_{3-{\delta}}$ 조성의 산화물을 합성하였으며, 합성된 분말은 압축 성형 후 $1080^{\circ}C$에서 소결하여 치밀한 페롭스카이트 분리막을 제조하였다. 밀봉 재료로 gold ring, Pyrex ring 및 Pyrex 분말을 사용하여 가스누출 실험을 수행하였다. $Ba_{0.5}Sr_{0.5}Co_{0.8}Fe_{0.2}O_{3-{\delta}}$ 분리막의 산소투과량 분석결과 온도가 증가함에 따라 산소투과량은 증가하였고, $900^{\circ}C$에서 $0.74mL/min{\cdot}cm^2$의 값을 나타내었다. $950^{\circ}C$에서 밀봉 재료에 따른 투과 특성 분석 결과, gold ring을 이용할 경우 높은 산소투과량을 보인 반면, Pyrex를 밀봉재로 사용할 경우 낮은 투과량을 보였다. 이는 Pyrex를 밀봉재로 이용할 경우 분리막 표면으로 유리가 침투하여 유효 산소투과면적을 감소시켰기 때문이며, 광화학 현미경 분석으로 Pyrex 유리의 확산 침투를 확인하였다.

• 헤리티지:역사와 과학
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• 제52권1호
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• pp.4-21
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• 2019

영남지역에서 출토된 6~7세기 신라 금제 귀걸이 23점에 대한 성분 분석을 실시하고, 금판에 포함된 은(Ag) 함량을 기준으로 세 가지 유형으로 분류하였다. I 유형(20~50wt%), II 유형(10~20wt%), III 유형(10wt% 이하)으로 구분하였는데, I II 유형의 귀걸이 금판은 금(Au) 함량이 상대적으로 높은 부분에서 미세한 기공이 집중적으로 분포되는 현상이 관찰되었다. 금판 표면의 성분 차이 발생 원인을 네 가지로 구분하여 1) 표면 처리, 2) 제작 과정에서 열 확산, 3) 사금의 성분 차이, 4) 금의 정련 방법 측면에서 검토하였다. 금판 표면의 금 함량이 상대적으로 높은 부분에서는 미세한 기공이 집중적으로 관찰되며, 이와 관련하여 금 합금 표면에 의도적으로 금을 제외한 금속 성분을 제거하면서 금 함량을 높이는 고갈 도금(depletion gilding) 가능성을 제시하였다. 의도적인 표면 처리와 더불어 제작 과정에서 금판과 금속 봉 사이에 열 확산이 일어나 금판의 구리 함량이 높아진 사례를 세환이식의 분석 결과로 확인되었다. 금판의 재료적인 측면에서 살펴보면 금판에 포함된 은(Ag)이 자연금에 포함된 것인지, 합금에 의해 추가된 것인지를 국내에서 채취된 사금 분석을 통해 살펴보았다. 분석 결과 평균적으로 13wt% 정도의 은이 포함된 것으로 미루어 보아 II 유형은 자연금의 범주에 포함되고, III 유형은 정련 과정을 거친 금, I 유형은 자연금에 은이 합금된 것으로 보인다. 여기에서 III 유형의 경우 정련 과정을 거쳐 순수한 금을 만든 뒤 은을 합금했을 가능성에 대해 국내외 고대 문헌에 소개된 금 정련 방법을 조사하였다. 고대 정련 방법은 자연금에 포함된 은이 염화물 또는 황화물과 반응하여 결합됨으로써 제거되는 방법이었는데, 이러한 방법을 통해 순수한 금을 얻기 위해서는 장시간의 노력과 기술이 요구된다는 것이 밝혀졌다. 따라서 정련 과정을 통해 순금을 만든 후에 강도를 높이기 위해 소량의 은을 첨가했을 가능성은 낮아 보인다.

• 대한치과보철학회지
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• 제20권1호
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• pp.75-81
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• 1982

The purpose of this study was to compare the marginal fitness between Ni-Cr alloy and type III gold alloy, according to two finishing line, chamfer and shoulder. As experimental materials, author selected type III gold alloy and Ni-Cr alloy (Hicrown) which were popularly used in Korea for the full cast crown. Author prepared the wax patterns with milled stainless steel die and ring. The wax patterns were invested, burnouted, and casted. The maginal discrepancy was measured with scanning electron microscope. Author obtained the following results from this study. 1. The maginal fitness of Type III gold alloy was not significantly different from that of Ni-Cr alloy (Hi-crown). 2. There is no significant difference between chamfer and shoulder in case of Type III gold alloy. 3. The maginal fitness of chamfer type is significantly superior to that of shoulder type in the Ni-Cr alloy (Hi-Crown).

• 보존과학연구
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• 통권20호
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• pp.81-90
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• 1999

We performed the non-destructive analysis of objects excavated at the Tomb of Mich’un-ri in Ch’ung-won. We analysed components using of Energy Dispersive X-Ray Micro-Fluorescence Analyzer. Glass bead inlaid with silver was classified as K2O-CaO-SiO2 type of glass. Purity of silver inlaid in the surface was verified above 97%.All small ear-ring were made by rolling up gold broad to a bronze wick. The composition ratio of Au : Ag has significantly higher 87 : 11 than bigear-ring. As a result of composition analysis of a welded part with big ear-ring, it contained the more Cu, Hg contents and the less Au, Ag contents than the surface of big ear-ring.

• 전자공학회논문지A
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• 제29A권8호
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• pp.78-88
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• 1992

To improve the characteristics of sub$\mu$m short channel MOSFET device, a new device having the convex structure is proposed. This device has 3-dimensionally expandable channel length according to the vertical etched silicon height. For the purpose of comparing the DC and AC characteristics, planar device is also fabricated. Comparing the channel length, the convex device with 0.4$\mu$m silicon height is larger about 0.56$\mu$m in NMOS and 0.78$\mu$m in PMOS than planar devices. DC characteristics, such as threshold voltage, operational current, substrate current and breakdown voltage are compared together with AC characteristics using the ring oscillator inverter delay. Also process and device simulation are performed and the differences between convex and pranaldevice are also compared.

• 한국재료학회지
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• 제27권7호
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• pp.386-391
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• 2017

Using a customized diffusion bonder, we executed diffusion bonding for ring shaped white gold and red gold samples (inner, outer diameter, and thickness were 15.7, 18.7, and 3.0 mm, respectively) at a temperature of $780^{\circ}C$ and applied pressure of 2300 N in a vacuum of $5{\times}10^{-2}$ torr for 180 seconds. Optical microscopy, field emission scanning electron microscopy (FE-SEM), and energy-dispersive X-ray spectroscopy (EDS) were used to investigate the microstructure and compositional changes. The mechanical properties were confirmed by Vickers hardness and shear strength tests. Optical microscopy and FE-SEM confirmed the uniform bonding interface, which was without defects such as micro pores. EDS mapping analysis confirmed that each gold alloy was 14K with the intended composition; Ni and Cu was included as coloring metals in the white and red gold alloys, respectively. The effective diffusion coefficient was estimated based on EDS line scanning. Individual values of Ni and Cu were $5.0{\times}10^{-8}cm^2/s$ and $8.9{\times}10^{-8}cm^2/s$, respectively. These values were as large as those of the melting points due to the accelerated diffusion in this customized diffusion bonder. Vickers hardness results showed that the hardness values of white gold and red gold were 127.83 and 103.04, respectively, due to solid solution strengthening. In addition, the value at the interface indicated no formation of intermetallic compound around the bonding interface. From the shear strength test, the sample was found not to be destroyed at up to 100,000 gf due to the high bonding strength. Therefore, these results confirm the successful diffusion bonding of 14K white-red golds with a diffusion bonder at a low temperature of $780^{\circ}C$ and a short processing time of 180 seconds.