• Journal of Powder Materials
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• v.13 no.5 s.58
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• pp.351-359
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• 2006

Ni based($Ni_{57}Zr_{20}Ti_{18}Si_2Sn_3$) bulk metallic glass(BMG) powders were produced by a gas atomization process, and ductile Cu powders were mixed using a spray drying process. The Ni-based amorphous powder and Cu mixed Ni composite powders were compacted by a spark plasma sintering (SPS) processes into cylindrical shape. The relative density varied with the used SPS mold materials such as graphite, hardened steel and WC-Co hard metal. The relative density increased from 87% to 98% when the sintering temperature increased up to $460^{\circ}C$ in the WC-Co hard metal mold.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.7 no.4
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• pp.610-618
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• 1997

$Al_2O_3$/Al composite was produced by the infiltration of molten Al Into $Al_2$O$_3$ preform at 900-$1200^{\circ}C$, The process was accelerated by spreading borosilicate glass powder onto the interface between Al powder compact and $Al_2O_3$ preform. Melt infiltration initialed after incubation period, and the growth of infiltration was observed to be linearly propotional with time. The major components of the composite are $Al_2O_3$ and Al with a trace of Si which is remained from borosilicate, the reaction accelerator. Relative density of the composite increased with the particle size of $Al_2O_3$ but decreased with infiltration temperature. As infiltration temperature increases from room to $950^{\circ}C$ higher strength and fracture toughness were obtained.

• Journal of the Korean Applied Science and Technology
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• v.41 no.1
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• pp.46-57
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• 2024

In this study, the various process conditions for high-power DC Magnetron Sputtering (DCMS) on the surface roughness of carbon thin films were investigated. The optimal conditions for Si/C coating were 40min for deposition time, which does not deviate from normal plasma, to obtain the maximum deposition rate, and the conditions for the best surface roughness were -16volt bias voltage and 400watt DC power with 1.3x10-3torr chamber pressure. Under these optimal conditions, an excellent carbon thin film with a surface roughness of 1.62nm and a thickness of 724nm was obtained. As a result of XPS analysis, it was confirmed that the GLC structure (sp² bonding) was more dominant than the DLC structure (sp³ bonding) in the thin film structure of the carbon composite layer formed by DC sputtering. Except in infrequent cases of relatively plasma instability, the lower bias voltage and applied power induces smaller surface roughness value due to the cooling effect and particle densification. For the optimal conditions for Graphite/C composite layer coating, a roughness of 36.3 nm and a thickness of 711 nm was obtained under the same conditions of the optimal process conditions for Si/C coating. This layer showed a immensely low roughness value compared to the roughness of bare graphite of 242 nm which verifies that carbon coating using DC sputtering is highly effective in modifying the surface of graphite molds for glass forming.

• Journal of the Korean Ceramic Society
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• v.46 no.4
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• pp.413-418
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• 2009

Glass systems based on Ca, Sr, Ba, and Zn modified alumino-boro silicates were investigated in order to improve the dielectric and mechanical properties of a typical LTCC (low temperature co-fired ceramic) which was developed for high frequency highly-integrated modules. The glass was prepared by a typical melting procedure and then mixed with cordierite fillers to fabricate glass/ceramic composite-type LTCC materials. The amount of cordierite filler was fixed at 50 volumetric%. For an optimal glass composition of 7.5% CaO, 7.5% BaO, 5% ZnO, 10% $Al_2O_3$, 30% $B_2O_3$, and 40% $SiO_2$ in mole ratio, the resultant LTCC composite showed a dielectric constant of 5.8 and a dielectric loss ($tan{\delta}$) of 0.0009 after firing at $900^{\circ}C$. An average bending strength of 160MPa was obtained for the optimal composition.

• Journal of the Semiconductor & Display Technology
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• v.12 no.1
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• pp.29-33
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• 2013

We have fabricated transparent polymer composite films with high thermal emissivity, which can be used for heat dissipation of transparent electronics. PMMA (poly(methyl methacrylate)) solution with high transparency and thermal emissivity is mixed with various fillers (carbon nanotubes (CNTs), aluminum nitride (AlN), or silicon carbide (SiC)) with high thermal conductivity. We have achieved the thermal emissivity as high as 0.94 by the addition of CNTs. Compared with the PMMA film on glass, however, the addition of AlN or SiC is shown to rather decrease the thermal emissivity. It is also observed that the thickness of the PMMA film does not affect its thermal emissivity. To avoid any degradation of the thermal conductivity, therefore, the PMMA film thickness is desirable to be $1{\mu}m$. There also exists a tradeoff between the optical transmittance and thermal conductivity on the selection of the amount of fillers.

• Korean Journal of Materials Research
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• v.26 no.12
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• pp.671-675
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• 2016

In this study, the glass-forming ability and mechanical properties of newly developed Fe-Mn-Cr-Mo-B-C-P-Si-Al bulk amorphous alloys were investigated, and metalloid elements such as B, C, and P were found to have a strong influence on the properties of the Fe-based amorphous alloys. When the total metalloid content (B, C, and P) is less than 5 %, only the crystal phase is formed, but the addition of more than 10 % metalloid elements enhances the glass forming ability. In particular, the alloys with 10 % metalloid content exhibit the best combination of very high compressive strength (~2.8 GPa) and superior fracture elongation (~30 %) because they consist of crystal/amorphous composite phases.

• Fire Science and Engineering
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• v.33 no.1
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• pp.60-68
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• 2019

The paper reports the characteristics of conduction heat transfer to the backside part according to the heating temperature of a composite wall in a lightweight partition used for indoor space compartments. Stud partitions, SGP partitions, sandwich panels, urethane foam panels, and glass wool panels. which are generally used as light-weight partition walls, were selected as experiment samples, and the characteristics of conduction heat transfer to the backside part as the top surface were analyzed by applying heating temperatures of $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, and $500^{\circ}C$ to the bottom surface for 1800 s. According to the experimental results, the maximum backside temperatures at the maximum heating temperature of $500^{\circ}C$ was $51.6^{\circ}C$, $63.6^{\circ}C$, $317.2^{\circ}C$, $124.9^{\circ}C$, and $42.2^{\circ}C$ for the stud partition, SGP partition, sandwich panel, urethane foam panel, and glass wool panel, respectively. The maximum conduction heat- transfer rates at $500^{\circ}C$ were 17.16 W, 18.39 W, 136.65 W, 14.34 W, and 5.57 W for the stud partition, SGP partition, sandwich panel, urethane foam, and glass wool panel, respectively.

• Journal of the Korean Ceramic Society
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• v.44 no.2 s.297
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• pp.110-115
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• 2007

The effects of $TiO_2$ in the glasses on the shrinkage and dielectric properties of BNT-glass composites have been investigated. Without $TiO_2$ addition, BNT-glass composite showed two humps in the shrinkage curve, which are related with crystallization of $BaTi(BO_3)_2\;and\;Bi_4Ti_3O_{12}$. However, the increase of $TiO_2$ addition resulted in the decrease of 2nd hump in the shrinkage. The increased dielectric constant with $TiO_2$ addition might be due to the reduced crystallization of $Bi_4Ti_3O_{12}$. A dielectric constant of 52, a quality factor of 5088 GHz, and a temperature coefficient of resonant frequency of $-0.16ppm/^{\circ}C$ were obtained for a specimen containing $TiO_2$-added glasses, without sacrificing the benefits of high ${\varepsilon}_r$ and low TCF of BNT ceramics.

• Journal of the Korean Ceramic Society
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• v.38 no.9
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• pp.799-805
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• 2001

Two commercial alumina powders having different particle size of $0.5{\mu}m$ and 3${\mu}$m were presintered at 1120$^{\circ}$C for 2h and then lanthanum aluminosilicate glass was infiltrated at 1100$^{\circ}$C for up to 4h to obtain the densified glass-alumina composites. The effect of alumina particle size on packing factor, microstructure, wetting, porosity and pore size, and mechanical properties of the composite was investigated. The optimum mechanical properties and compaction behavior were observed for the 3${\mu}$m alumina particle dispersed composite. The 3${\mu}$m alumina particle size and distribution for he preform were within 0.1 to 48${\mu}$m and bimodal and random orientation. The strength and the fracture toughness of the composite having 3${\mu}$m alumina particles were 519MPa and $4.5MPa{\cdot}m^{1/2}$, respectively.

• Journal of Powder Materials
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• v.25 no.6
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• pp.494-500
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• 2018

In this study, the effect of the content of $MgO-CaO-Al_2O_3-SiO_2$ (MCAS) glass additives on the properties of AlN ceramics is investigated. Dilatometric analysis and isothermal sintering for AlN compacts with MCAS contents varying between 5 and 20 wt% are carried out at temperatures ranging up to $1600^{\circ}C$. The results showed that the shrinkage of the AlN specimens increases with increasing MCAS content, and that full densification can be obtained irrespective of the MCAS content. Moreover, properties of the AlN-MCAS specimens such as microhardness, thermal conductivity, dielectric constant, and dielectric loss are analyzed. Microhardness and thermal conductivity decrease with increasing MCAS content. An acceptable candidate for AlN application is obtained: an AlN-MCAS composite with a thermal conductivity over $70W/m{\cdot}K$ and a dielectric loss tangent (tan ${\delta}$) below $0.6{\times}10^{-3}$, with up to 10 wt% MCAS content.