• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.45-52
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• 2009

The research on miniature devices based on non-silicon materials, in particular polymeric materials has been attracting more and more attention in the research field of the micro/nano fabrication in recent years. Lost of applications and many literatures have been reported. However, the study on the micro thermal imprint process of glassy polymer is still not systematic and inadequate. The aim of this research I to obtain a numerical material model for an amorphous glassy polymer, polycarbonate (PC), which can be used in finite element analysis (FEA) of the micro thermal imprint process near the glass transition temperature (Tg). An understanding of the deformation behavior of the PC specimens was acquired by performing tensile stress relaxation tests. The viscoelastic material model based on generalized Maxwell model was introduced for the material near Tg to establish the FE model based on the commercial FEA code ABAQUS/Standard with a suitable set of parameters obtained for this material model form the test data. As a result, the feasibility of the established viscoelastic model for PC near Tg was confirmed and this material model can be used in FE analysis for the prediction and improvement of the micro thermal imprint process for pattern replication.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.355-356
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• 2006

The glass transition behavior of OLED materials is very important for both processing and lifetime. We report about the correlation between the structure of selected small molecule Hole Transport Materials (HTM's) and their glass transition temperature. The thermal stability of devices manufactured with them was investigated. The results give researchers and engineers some information which are helpful for designing new molecules and processing them in device making.

• Bulletin of the Korean Chemical Society
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• v.29 no.6
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• pp.1167-1172
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• 2008

We investigated the glass transition temperatures ($T_g$) of dendrons consisting of conformationally mobile aliphatic polyether dendritic cores plus glassy peripheral polystyrenes (PSs), and linear PSs in the molecular weight range of 1000-8500 g/mol. We compared their $T_g$ behavior depending on their polymeric architecture. The linear PSs show a typical growth of $T_g$ up to 92.5 ${^{\circ}C}$ as the molecular weight increases to 8300 g/mol, while the dendrons display nearly constant $T_g$ values of 58-61 ${^{\circ}C}$, despite the increase of molecular weight with each generation. The striking contrast of Tg behavior would be mainly attributed to the fact that the dendrons keep the ratio of $N_e$/M ($N_e$: number of peripheral chain ends, M: molecular weight) over all the generations. Additionally, for the influence of dendritic spacers on glass transition temperature we prepared dimeric PSs with different linkage groups such as aliphatic ether, ester and amide bonds. We found that the dimer with the ether spacer exhibited the lowest glass transition at 55.4 ${^{\circ}C}$, while the amide linked dimer showed the highest glass transition temperature at 74.2 ${^{\circ}C}$. This indicates that the peripheral PS chains are effectively decoupled by the conformationally flexible ether spacer. The results from this study demonstrated that polymeric architecture and dendritic core structures play a crucial role in the determination of glass transition behavior, providing a strategy for the systematic engineering of polymer chain mobility.

• Journal of the Korean Ceramic Society
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• v.32 no.12
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• pp.1424-1432
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• 1995

Chalcogenide glasses having IR (8~12${\mu}{\textrm}{m}$) transmittance were prepared and their densities, thermal and mechanical properties, IR-transmittances and chemical durabilities were determined. Glass transition temperatures (Tg) of Ge-As-Se, Ge-As-Se-Te and Ge-SE-Te system glasses were in the range of 280~3$65^{\circ}C$, 210~236$^{\circ}C$ and 210~26$0^{\circ}C$, respectively. Crystallization temperature (Tc) of Ge-Se-Te system glass was in the range of 305~40$0^{\circ}C$. Their thermal expansion coefficients($\alpha$) were in the range of 11.7~15.2$\times$10-6/K, 15.4~16.0$\times$10-6/K and 17.4~27.8$\times$10-6/K, respectively. Their MOR, hardness and fracture toughness were in the range of 15.2~18.6MPa, 36.1~58.2Kg/$\textrm{mm}^2$, 1.0~1.3 MPa.mm1/2, 18.9~24.9 MPa, 40.9~65.1Kg/$\textrm{mm}^2$, 1.3~1.5 MPa.mm1/2, and 24.1~30.8 MPa, 40.9~86.0Kg/$\textrm{mm}^2$, 1.4~1.8 MPa.mm1/2, respectively. IR transmittance of Ge-Se-Te system glass was about 60%. Ge-O extrinsic absorption peaks at 8, 12 ${\mu}{\textrm}{m}$ were significantly eliminated by the addition of Mg. Chemical durabilities in deionizied water of Ge-Se-Te system glass were good and IR-transmittances decreased with leaching time and temperature.

• Journal of Korea Foundry Society
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• v.22 no.6
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• pp.304-308
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• 2002

The new Cu-Zr-Ti-Ni-Pd amorphous alloy system has been introduced and manufactured using melt-spinning and Cu-mold die casting methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties of the alloys were examined. The reduced glass transition temperature(Trg = Tg/Tm) and the supercooled liquid region(${\Delta}$Tx = Tx-Tg) of $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ alloy were 0.620 and 57 K respectively. $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ amorphous alloy was produced in the rod shape with 2mm diameter using the Cu-mold die casting. The hardness value of the amorphous bulk alloy was 432 DPN.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.2
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• pp.51-54
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• 2004

In this paper, the thermal and mechanical properties of elastic epoxy for the application of high voltage products were investigated. Glass transition temperature (Tg) of elastic epoxies cannot be found from room temperature to 20$0^{\circ}C$ by DSC (Differential Scanning Calorimetry). Weight reduction occurred at 285$^{\circ}C$ and 451$^{\circ}C$ according to a thermogravimeter. The first temperature was affected by addictives and the second by epoxies characteristic. Maximum tensile strain showed 28.3kgf/$\textrm{cm}^2$/$\textrm{cm}^2$ at 20% of mechanical stress in addictives 35 (phr). The SEM (Scanning electron microscope) micrograph of the fracture surface observed void and tearing of elastic epoxy at addictives 35 (phr). On the other side, the SEM micrograph of the rigid epoxy showed a broken trace.

• Proceedings of the Korean Fiber Society Conference
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• 2002.04a
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• pp.466-469
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• 2002

Polyurethane(PU)은 segmented 블록공중합체로써 상온보다 높은 유리전이온도(glass transition temperature, Tg)를 갖는 hard segment(H.S)와 상온보다 낮은 Tg를 갖는 soft segment (S.S)로 구성되어 있다. 이들 두 segment간의 열역학적 불친화성으로 인해 미세 상분리 구조를 갖는다$^1$. 그 결과 hard segment-rich hard domain과 soft segment-rich soft matrix의 구조를 이룬다. 이중 hard domain(HD)은 상온에서 glassy한 성격을 띄므로 물리적 가교점과 충진제의 역할을 하며 soft domain(SD)은 rubbery한 성질을 가지므로 polurethane에 탄성을 부여하는 역할을 한다. (중략)

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.795-798
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• 2002

Replacing Pb-free glass composition for the dielectric materials is expected in PDP industry. In this study, phosphate glasses, $P_2O_5$- ZnO- SnO (PZS), $P_2O_5$-ZnO-BaO (PZB) were selected for a new transparent dielectric. Thermal properties (Tg, CTE) were measured with differential thermal analyzer and thermal mechanical analyzer. The glass transition of the glasses was ranged at $365{\sim}405^{\circ}C$ for the PZS system and $5.9{\sim}9.5{\times}\;10^{-6}$ of thermal expansion were found. The PZB system showed $445{\sim}470^{\circ}C$ of glass transition. Thus, the glass compositions would be a potential candidate for a transparent dielectric layer in plasma display panel.

• Bulletin of the Korean Chemical Society
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• v.19 no.3
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• pp.354-358
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• 1998

The effect of thermal conditions on the clustering of sulfonated polystyrene ionomers was investigated. It was found that when the zinc-sulfonated ionomer was dried above a matrix glass transition temperature (Tg), the cluster Tg was observed at ca. 310 ℃, which is ca. 45 ℃ higher than that for the ionomer dried below the matrix Tg. This difference is believed to be the result of the increase in chain mobility at higher temperatures, which improves the multiplet formation and clustering; thus the cluster Tg increases. In the lithium ionomer case, however, the increase in the cluster Tg was ca. 6 ℃ upon annealing. From the results, it was suggested that in the zinc ionomer, the zinc ion is soft and divalent, which results in weaker interactions in multiplets, and thus decreases the stability of the multiplets. Therefore, the thermal effect is more significant for the zinc ionomers than for the lithium ionomers.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.34 no.4
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• pp.144-152
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• 1985

This paper temperature gradient thermally stimulated surface potentian (TG-TSSP) in measurements are applied to the study of the polarity of trapped and ionic carriers in cross-linked polyethylene (XLPE) filsm. In the thermally stimulated current in uniform temperature (TSC) of XLPE five peaks appear as indicated of the A B C D and E. In this paper A (at about -120$^{\circ}C$) D (at about 70$^{\circ}C$) and E (at about 110$^{\circ}C$) peaks are investigated. A peak is due to the biassing voltage and biassing temperature. Appear in to the glass transition temperature territory and caused in to the polarization of dipole. D peak is due to the depolarization of ionic space charge and E peak due to the detrapping of carriers injected from the electrodes. TG-TSSP and TSSP are measured to study the polarity of ionic carrier (D peak). In the unsatureated region of ionic space charge polarization, TG-TSSP is lower than TSSP during the initial stage of heating. Result of the experiment for E peak, TG-TSSP is higher than TSSP during the initial stage of heating and these results do not depend on the polarity of biassing voltage, and E peak is concerned with positive carriers (Holes).