• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.99-103
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• 2012

Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.3
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• pp.90-95
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• 2000

Today fiber composite materials are routinely used in such wide applications as ships automobiles aircraft space vehi-cles containers sporting goods and appliances. The current knowledge of machining glass fiber reinforced polyester com-posites unfortunately is inadequate for its optimum utilization in many applications. Therefore This paper deals with drilling characteristic of glass fiber reinforced polyester composites. In the drilling of glass fiber reinforced polyester the quality of the cut surfaces is strongly dependent on the drilling parameters. drilling tests were carried out on glass fiber reinforced polyester using standard HSS tools. The material containing random chopped strand fibers and woven roving was fabricated by hand lay-up The entrance and exit surface of the holes was examined. The cutting force was also mea-sured to analyze the drilling characteristics,.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1052-1055
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• 2001

In micro-drilling of brittle materials including glass, cracks occur at the exit surface. In drilling glass, the main type of crack is cone crack. Cone crack is generated by thrust force acting at the bottom surface of the workpiece. Cone crack size could be reduced by changing cutting conditions, but cone crack still existed. Two methods were proposed to prevent crack formation and perfect hole shapes were obtained. One method is attaching two glass plates with water and the other method is constraining two glass plates. The proposed methods eliminated tensile stress acting on the exit surface of glass and prevented crack propagation.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.4
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• pp.117-122
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• 1998

Glass fiber epoxy composite material is widely used in the structures of aircrafts, robots and other machines because of their high specific strength, high specific stiffness and high damping. In order for the composite materials to be used in the aircraft structures or machine elements, accurate surfaces for bearing mounting or joint must be provided, which require precise machining. In this paper, the machinability of the glass fiber epoxy composite material was experimentally investigated. The results can be summarized as follows : 1. The entrance of hole is very good manufacturing existing, but exit come to occur sever surface exfoliation. 2. The cutting force in drilling of the glass fiber epoxy composite material is decreased as the drilling speed increased. 3. If the glass fiber epoxy composite material is drilling by the standard twist drill, then the hole recommand cutting condition is spindle speed 400∼600rpm, feed 40∼50mm/min.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.353-354
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.151-152
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• 2013

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.12-15
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• 2002

In this paper, we fabricated a electro-chemical discharge machine for drilling microscopic glass hole. In this research, we used a glass plate and NaOH solution. From the experimental result, we knew that the change of voltage wave was caused by drilling microscopic hole of glass using electro-chemical discharge method. So, we can give a function of the power auto stop to electro-chemical discharge machine with the change of voltage wave.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.89-92
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• 2001

In this paper, we studied on drilling a microscopic hole of glass using electro-chemical discharge methode. In this research, we fabricated a electro-chemical discharge machine for drilling glass hole. The used parameters to get a fine microscopic hole are the concentration of NaOH solution from 5wt% to 50wt%, the supply voltage from 10V to 40V and the fabricating time from 5 second to 50 second. Also, we used a 0.16mm glass plate. We learned from our experiment that, the fabrication most efficient when supply voltage is 25V-30V and concentration of NaOH solution 35wt% or less.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.89-92
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• 2001

In this paper, we studied on drilling a microscopic hole of glass using electro-chemical discharge methode. In this research, we fabricated a electro-chemical discharge machine for drilling glass hole. The used parameters to get a fine microscopic hole are the concentration of NaOH solution from 5wt% to 50wt%, the supply voltage from 10V to 40V and the fabricating time from 5 second to 50 second. Also, we used a 0.16mm glass plate. We learned from our experiment that, the fabrication most efficient when supply voltage is 25V-30V and concentration of NaOH solution 35wt% or less.