• Korean Journal of Materials Research
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• v.15 no.4
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• pp.281-284
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• 2005

Room and high temperature deformation behaviors of Cu-Zr-Ti-Pd bulk metallic glasses produced by copper mold casting were investigated. The addition of Pd was shown to enhance the glass forming ability and thermal stability of Cu-Zr-Ti base bulk metallic glass. The compressive strength of $Cu_{55}Zr_{30}Ti_{10}Pd_5$ bulk metallic glass was 2230 MPa with 1.8 plastic strain. The stress overshoot and yield drop phenomenon were observed below $487^{\circ}C$ and a drastic decrease in the flow stress was observed at $487^{\circ}C$. The stress overshoot is thought to be associated with stress-induced structural relaxation.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.5
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• pp.3286-3291
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• 2014

A study on the crack protection and thermal insulation properties of the expanded perlite inorganic composites was performed. Mixed expanded perlite with a water glass was stabilized for 24 hrs at room temperature in the mold and, thereafter, converted into a massive foamed body through complete drying process at $150^{\circ}C$. Aluminum phosphate and micron size mica powder were used as a reaction accelerator and a stabilizer for thermal crack, respectively. Especially, use of mica exhibited a remarkable effect on the protection of thermal crack at higher temperature over $500^{\circ}C$, and thermal conductivity of the composites was enhanced with higher perlite contents, showing ca. 0.09 W/mK for the sample of 100/200/10/1.5 water glass/perlite/mica/Al phosphate by weight. A severe dimensional deformation of the composite materials was observed over $600^{\circ}C$, however, showing a temperature limitation for a practical application. The facts were considered as the results from the glass transition temperature of the water glass, of which main component is sodium silicate.

• The KSFM Journal of Fluid Machinery
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• v.16 no.5
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• pp.18-23
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• 2013

Thermal aging test is performed to qualify the life time of equipment in thermally aged condition. Due to long life time more than 10 years like as in power plant, the equipment is subjected to the accelerated thermal aging condition which is able to shorten the long aging test period by increasing aging temperature. Normally, conservatism of thermal aging test causes to impose unbalanced and excessive thermal load on components of the equipment, and deformation and damage problems of the components. Additionally, temperature rise of each component through heat generation of the electric equipment leads to long-term problem of the test period. Multi-phase accelerating aging test is to perform thermal aging test in multiple aging conditions after dividing into groups with various components of equipment. The groups might be classified considering various factors such as activation energy, temperature rise, glass transition temperature and melting temperature. In this study, we verify that the multi-phase accelerating aging test method can reduce and equalize the thermal over load of the components and shorten aging test time.

• Korean Journal of Metals and Materials
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• v.46 no.9
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.413-413
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• 2007

In recent years, flexible display devices such as liquid crystal display (LCD), organic light emitting diode (OLED), etc. have attracted considerable interest in a wide variety of applications. Polymer substrate is absolutely necessary to realize this kind of flexible display devices. Using the polymer as a substrate, there are lots of advantages including not only mechanical flexibility such as rolling and bending characteristics but also light weights, low cost and so on. In detail, thickness and weights is only one forth and one second of glass substrate, respectively. However, it needs low temperature below $150^{\circ}C$ in the fabrication process comparing to conventional deposition process. The polymer substrate is not thermally stable as much as the glass substrate so that some deformation can be occurred according to variation of temperature. In particular, performance of devices can be easily deteriorated by shrinkage of substrate when heating it. In this paper, pre-annealing and deposition of buffer layer was introduced and studied to solve previously mentioned problems of the shrinkage and followed shear stress.

• Journal of the Korean Society for Nondestructive Testing
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• v.12 no.1
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• pp.16-24
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• 1992

Moire interferometry using a diffraction grating and a laser is a powerful technique for analizing small deformation of a specimen. In the method, the x and y-directional fringe patterns are obtained by using the x and y-directional sets of two beams. If the both sets of two beams are simultaneously incident to the specimen, the x and y-directional fringe patterns are super imposed. In this case, it is difficult to separate each directional fringe pattern. Therefore each fringe pattern has been separately recorded by selecting each set of two beams. In order to analyze a two-dimensional strain changing with time, Moire interferometry using the two-dimensional fourier transform method is proposed and the x and y-directional fringes are separated. By this method, the thermal deformation of a glass plate is analyzed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.77-83
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• 2022

Amorphous alloys exhibit excellent mechanical properties; therefore, application technology development is being attempted in various fields. However, industrial use of application technology is limited owing to the limitations in fabrication. In this study, micropattern fabrication of an amorphous alloy was conducted using laser beam machining. Although microhole fabrication is possible without the deformation of the amorphous phase through nanosecond pulsed laser beam machining, there are limitations in the generation of recast layers and spatters. In cover plate laser beam machining (c-LBM), a cover plate is used to reduce the thermal deformation and processing area. Therefore, it is possible to fabricate holes at the level of several micrometers. In this study, it was confirmed that recast layers are hardly generated in c-LBM. Furthermore, square-shaped micropatterns were successfully fabricated using c-LBM.

• Advances in nano research
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• v.14 no.3
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• pp.261-271
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• 2023

The present study follows three main goals. First, an analytical solution with high accuracy is developed to assess the effects of embedding pre-strained shape memory alloy (SMA) wires on the critical buckling temperatures of rectangular sandwich plates made of soft core and graphite fiber/epoxy (GF/EP) face sheets based on piecewise low-order shear deformation theory (PLSDT) using Brinson's model. As the second goal, this study compares the effects of SMAs on the thermal buckling of sandwich plates with those of carbon nanotubes (CNTs). The glass transition temperature is considered as a limiting factor. For each material, the effective ranges of operating temperature and thickness ratio are determined for real situations. The results indicate that depending on the geometric parameters and thermal conditions, one of the SMAs and CNTs may outperform the other. The third purpose is to study the thermal buckling of sandwich plates with advanced hybrid SMA/CNT/GF/EP composite face sheets. It is shown that in some circumstances, the co-incorporation of SMAs and CNTs leads to an astonishing enhancement in the critical buckling temperatures of sandwich plates.

• Journal of Korea Foundry Society
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• v.28 no.6
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• pp.261-267
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• 2008

In-situ quasicrystalline icosahedral (I) phase reinforced Ti-based bulk metallic glass (BMG) matrix composites have been successfully fabricated by using two distinct thermal histories for BMG forming alloy. The BMG composite containing micron-scale Iphase has been introduced by controlling cooling rate during solidification, whereas nano-scale I-phase reinforced BMG composite has been produced by partial crystallization of BMG. For mechanical properties, micron-scale I-phase distributed BMG composite exhibited lower strength and plasticity compared to the monolithic BMG. On the other hand, nano-scale icosahedral phase embedded BMG composite showed enhanced strength and plasticity. These improved mechanical properties were attributed to the multiplication of shear bands and blocking of the shear band propagation in terms of isolation and homogeneous distribution of nanosize icosahdral phases in the glassy matrix, followed by stabilizing the mechanical and deformation instabilities.

• Journal of the Korean Ceramic Society
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• v.52 no.2
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• pp.108-113
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• 2015

In an effort to evaluate the practicability of an imprinting technique for amorphous chalcogenide film in Ge-based compositions, we investigate the deformation behavior of the surface of amorphous $GeSe_2$ film deposited via a thermal evaporation route according to varying static loads applied at elevated temperatures. We observe that, under these static loading conditions, crystallization tends to occur on its surface relatively more easily than in As-based $As_2Se_3$ films. As for the present $GeSe_2$ film, higher processing temperatures are required in order to make its surface reflect the given stamp patterns well; however, in this case, its surface becomes partially crystallized in the monoclinic $GeSe_2$ phase. The increased vulnerability of this amorphous $GeSe_2$ film toward surface crystallization under static loading, when compared with the $As_2Se_3$ counterpart, is explained in terms of the topological aspects of its amorphous structure.