• 제목/요약/키워드: Glass Thermal Deformation

검색결과 62건 처리시간 0.023초

열방식 마이크로 임프린트 공정을 위한 고분자 재료의 수치적 모델링 (Experimental and Numerical Study on the Viscoelastic Property of Polycarbonate near Glass Transition Temperature for Micro Thermal Imprint Process)

  • 란 슈하이;이혜진;이형욱;송정한;이수훈;준니;이문구
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 춘계학술대회 논문집
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    • pp.70-73
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    • 2009
  • The aim of this research is to obtain a numerical material model for an amorphous glassy polymer, polycarbonate (PC), which can be used in finite element analysis (FEA) of the micro thermal imprint process near the glass transition temperature. An understanding of the deformation behavior of the PC specimens was acquired by performing tensile stress relaxation tests. The viscoelastic material model based on generalized Maxwell model was introduced for the material near Tg to establish the FE model based on the commercial FEA code ABAQUS/Standard with a suitable set of parameters obtained for this material model from the test data. Further validation of the model and parameters was performed by comparing the analysis of FE model results to the experimental data.

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다성분계 Glass Fiber의 La$_2$O$_3$첨가에 따른 광학적 특성에 관한 연구 (The Study on Optical Properties by Adding La$_2$O$_3$ in Multicomponent Glass Fiber)

  • 김용호;강원호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1985년도 추계학술대회 논문집
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    • pp.21-23
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    • 1985
  • By adding La$_2$O$_3$ to optical multicomponent glass composition, after making mother glass and core fiber that enable to enlarge the infrared transmittance region, then surveyed the optical properties. Through thermal analysis of the glass abstained by melt-quenching after selecting stable basic composition on devitrification and replace SiO$_2$ by 4-12wt% La$_2$O$_3$. As La$_2$O$_3$ increases up to l2wt% transition temperature, refractive index, density, deformation temperature increased, whereas thermal expansion coefficient decreased. As a result of inspectig transmittance in UV/VIS/IR region, visable region indicated the decrease of transmittance by increasing the La$_2$O$_3$ and transmittance region was enlarged by increasing the La$_2$O$_3$ in IR region. Also, fabricate core fiber at 820$^{\circ}C$ and severy the optical loss we could fact that La$_2$O$_3$ composition added 12wt% showed the minimum optical loss.

유리 압축 실험에서의 복굴절 분포 예측 (Prediction of Birefringence Distribution in Cylindrical Glass Compression Test)

  • 이주현;나진욱;임성한;오수익
    • 소성∙가공
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    • 제13권6호
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    • pp.509-514
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    • 2004
  • An analysis using FEM simulation was conducted to predict residual stresses and birefringence in simple compressed cylindrical glass as a preliminary part of the optimum design determination of optical lenses. The FEM simulation with the Maxwell viscoelastic constitutive model was used to predict thermal induced residual stresses and birefringence during the compression test considering stress relaxation. Also the linear photoelastic theory was introduced to calculate birefringence from the residual stress state. The error of simulation results between experimental results in the birefringence value at the center of glass specimen is $4.2\%$, and the error in the maximum radius of deformed glass specimen is $1.2\%$. The simulation results were in good agreement with deformation and birefringence distribution in the existing experimental result.

Development of 2-inch Plastic Film STN LCD

  • Park, Sung-Kyu;Han, Jeong-In;Kim, Won-Keun;Kwak, Min-Gi
    • Journal of Information Display
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    • 제1권1호
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    • pp.14-19
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    • 2000
  • Due to distinct properties of plastic substrates such as poor thermal resistance, non-rigidness and high thermal expansion, it is difficult to fabricate plastic film LCDs by conventional LCD processes. Poor thermal resistance and high thermal expansion of substrates induced deformation of substrates surface, mismatch of thermal expansion between ITO electrodes and substrates resulted in defects in the ITO electrodes during the high temperature process. Defects of ITO electrodes and non-uniform cell gap caused by non-rigid and flexible properties were also observed in the pressuring process. Based on in these observations, we used a newly developed material and fabrication process to prevent deformation of substrates, defects of electrodes and to maintain uniform cell gap. The maximum temperature of the process is limited up to $110^{\circ}C$ and pressure loaded during the process is five times less than conventional one. With these invented processes and materials, we obtained highly reliable Plastic Film STN LCDs whose electro-optical characteristics are better than or equivalent to those of typical glass LCDs.

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유리섬유/탄소섬유 강화 비대칭 하이브리드 복합재의 스프링 백 예측 (Prediction of Spring-back for GFR/CFR Unsymmetric Hybrid Composites)

  • 정우균;안성훈;원명식
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2005년도 춘계학술발표대회 논문집
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    • pp.158-161
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    • 2005
  • The fiber-reinforced composite materials have been advanced for various applications because of its excellent mechanical and electromagnetic properties. On their manufacturing processes, however, thermo-curing inherently produces the undesired thermal deformation mainly from temperature drop from the process temperature to the room temperature, so called spring-back. The spring-back must be removed to keep the precision of designed shape. In this research, the spring-back of {glass fiber / epoxy}+{carbon fiber / epoxy} unsymmetric hybrid composites were predicted using Classical Lamination Theory (CLT), and compared with the experimental data. Additionally, using finite element analysis (ANSYS), the predicted data and experimental data were compared. The predicted values by CLT and ANSYS were well matched with experimental data.

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패키징으로 인한 응력이 MEMS 소자에 미치는 영향 분석 및 개선 (Effects of Package Induced Stress on MEMS Device and Its Improvements)

  • 좌성훈;조용철;이문철
    • 한국정밀공학회지
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    • 제22권11호
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    • pp.165-172
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    • 2005
  • In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

열방식 마이크로 임프린트 공정을 위한 고분자 재료의 수치적 모델링과 해석 (Numerical Investigation of Micro Thermal Imprint Process of Glassy Polymer near the Glass Transition Temperature)

  • 란 슈하이;이수훈;이혜진;송정한;성연욱;김무종;이문구
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 추계학술대회 논문집
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    • pp.45-52
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    • 2009
  • The research on miniature devices based on non-silicon materials, in particular polymeric materials has been attracting more and more attention in the research field of the micro/nano fabrication in recent years. Lost of applications and many literatures have been reported. However, the study on the micro thermal imprint process of glassy polymer is still not systematic and inadequate. The aim of this research I to obtain a numerical material model for an amorphous glassy polymer, polycarbonate (PC), which can be used in finite element analysis (FEA) of the micro thermal imprint process near the glass transition temperature (Tg). An understanding of the deformation behavior of the PC specimens was acquired by performing tensile stress relaxation tests. The viscoelastic material model based on generalized Maxwell model was introduced for the material near Tg to establish the FE model based on the commercial FEA code ABAQUS/Standard with a suitable set of parameters obtained for this material model form the test data. As a result, the feasibility of the established viscoelastic model for PC near Tg was confirmed and this material model can be used in FE analysis for the prediction and improvement of the micro thermal imprint process for pattern replication.

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유리 압축 실험에서의 복굴절 분포 예측 (Prediction of birefringence distribution in cylindrical glass compression test)

  • 이주현;나진욱;임성한;오수익
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2004년도 춘계학술대회 논문집
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    • pp.95-100
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    • 2004
  • An analysis using FEM simulation was conducted to predict residual stresses and birefringence in simple compressed cylindrical glass as a preliminary part of the optimum design determination of optical lenses. The FEM simulation with the Maxwell viscoelastic constitutive model was used to predict thermal induced residual stresses and birefringence during the compression test considering stress relaxation. Also the linear photoelastic theory was introduced to calculate birefringence from the residual stress state. The simulation results were in good agreement with deformation and birefringence distribution in the existing experimental result.

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필라멘트 와인딩 장력에 따른 Composite Bushing의 특성에 관한 연구 (Properties of Composite Bushing with Filament Winding Tension)

  • 조한구;김광용
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 춘계학술대회 논문집
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    • pp.34-34
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    • 2010
  • This paper describes effect of the bending deformation of high voltage composite bushing with winding tension. The composite bushing can be formed, by adding silicone rubber sheds to a tube of composite materials. The FRP tube is internal insulating part of a composite bushing and is designed to ensure the mechanical characteristics. Generally the properties of FRP tube can be influenced by the winding angle, wall thickness and winding tension. As winding tension is increased glass contents was increased in the range of 70.4~76.6%. In the bending test, winding tension is increased residual deflection was decreased in the range of 14.0~12.2 mm.

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세라믹-금속 기반 LED 어레이 패키지의 저온동시소성시 휨발생 억제 연구 (Low Temperature Co-firing of Camber-free Ceramic-metal Based LED Array Package)

  • 허유진;김효태
    • 마이크로전자및패키징학회지
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    • 제23권4호
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    • pp.35-41
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    • 2016
  • 고출력 LED 조명용 패키지를 제조함에 있어서 발열은 LED의 광출력과 수명에 매우 중요한 영향을 주는 인자로 알려져 있다. 본 연구에서는 가로등용 고출력 LED 패키지를 개발함에 있어서 효과적인 방열을 하기 위하여 방열효과가 상대적으로 우수한 구조인 chip-on-a-heat sink 구조를 가지는 세라믹-메탈 기반의 패키지를 제조하였다. 열확산 기능을 하는 heat sink 기판소재는 알루미늄 합금을, LED 어레이 회로를 형성하는 절연막으로는 저온동시소성용 glass-ceramics을 사용하였다. 특히 열처리 시 가장 이슈가 되는 세라믹-금속 하이브리드 패키지 기판의 휨을 억제하기 위한 수단으로서, glass-ceramic 절연막을 부분 코팅함으로써 휨현상을 용이하게 줄일 수 있게 되었다. 또한, LED 패키지의 방열특성의 향상 즉 열저항도 기존의 MCPCB 패키지나 전면 코팅형 절연막 패키지에 비해 훨씬 낮아지는 효과를 얻었을 뿐 아니라, 세라믹 코팅소재의 절감효과도 볼 수 있게 되었다.