• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.5
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• pp.230-235
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• 2004

In this paper, epoxy elasticity factors were investigated by TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microscope) to improve toughness and reduce brittleness of existing epoxy resin. Dumbbell shaped specimens were made and tested at rates of 0, 20 and 35phr (part per hundred resins). TMA temperatures ranged from -2$0^{\circ}C$ to 20$0^{\circ}C$. Tg (glass transition temperature) of elastic epoxy was measured by thermal analysis. Also investigated were thermal expansion coefficient ($\alpha$), modulus and Tan$\delta$ (loss factor). And we analyzed structure through FESEM, could find elastic-factors of elastic epoxy that is not existing-epoxy. In addition, we measured permittivity and Tan$\delta$ for investigation of the electrical properties of elastic epoxy. Permittivity and Tan$\delta$ depend on elastomer composition. Namely, permittivity and Tan$\delta$ increase according to the elastomer contents. For experimental analysis results, 20phr was considered an excellent specimen.

• Composites Research
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• v.32 no.6
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• pp.349-354
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• 2019

The Aluminum conductor composite core consists of fast-curing thermosetting epoxy used as reinforcements and carbon fiber and glass fiber used as matrix. In this study, we have investigated fast curing epoxy cured products used for composite core(Aluminum Conductor Composite Core, ACCC). Tetrafunctional epoxy(PA 806) was used as a multifunctional epoxy, along with two kinds of curing agents, MNAn(5-Methyl-5-norbornene-2,3-dicarboxylic anhydride) and HHPA(Hexahydrophthalic Anhydride), to make an epoxy cured product and their properties were evaluated. Optimum conditions are confirmed by varying the content of curing accelerator in the selected epoxy and curing agent.

• Advances in nano research
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• v.4 no.4
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• pp.281-294
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• 2016

The advantages of nano-scale materials (size 1-99 nm in at least in one dimension) could be realized with their potential applications in diversified avenues. Herein, we report for the first time on the successful synthesis of homogeneous epoxy coatings containing phytogenic silver nanoparticles (Ag) on PVC and glass substrates by room-temperature curing of fully mixed epoxy slurry diluted by acetone. Alstonia scholaris bark extract was used to reduce and stabilize the silver ions. The surface morphology and mechanical properties of these coatings were characterized using the techniques like, UV-Vis (UV-Visible) spectrophotometry, X-ray diffraction (XRD), Fourier transform infrared spectrophotometry (FT-IR), Epifluorescence microscopy and scanning electron microscopy (SEM). The effect of incorporating Ag nanoparticles on the biofilm (scale) resistant epoxy-coated PVC was investigated by total viable counts ($CFU/cm^2$) from epoxy coating from (Initial) $1^{st}$ day to $25^{th}$ days. The phytogenic Ag nanoparticles were found to be significantly improving the microstructure of the coating matrix and thus enhanced the anti-biofilm performance of the epoxy coating. In addition, the antimicrobial mechanism of Ag nanoparticles played an important role in improving the anti-biofilm performance of these epoxy coatings.

• Elastomers and Composites
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• v.43 no.1
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• pp.39-48
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• 2008

Peel strength of epoxy adhesives can be increased by adding some amounts of XNBR. In this case, thermal resistance of the adhesive will be decreased by decrease of glass transition temperature of the adhesive. Epoxy resin modified with siloxane-imide was synthesized to improve thermal resistance and peel strength of the adhesive, after that the properties of modified epoxy resin were compared with the commercial epoxy resin. When 5% XNBR was added to 30% modified epoxy resin, this adhesive showed 0.42 N/mm of peel strength and $155^{\circ}C$ of glass transition temperature. These properties are enough compared to the required properties by the industry, i.e., 0.3 N/mm and $150^{\circ}C$, respectively. Weight loss of the modified epoxy resin by the treatment of nitric acid and 0.1N NaOH was reduced, but weight gain by the humid condition was increased by the presence of benzene ring and imide ring. 30% modified epoxy resin blended with 5% XNBR showed 220% improvement in tensile strength and elongation compared to the case of common epoxy resin. This is due to the flexibility of the siloxane in the modified epoxy resin.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.191-194
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• 2005

Impact properties of glass/Kevlar hybrid composites which have 3-D braided structures were studied. Results were compared to those of composites made of only glass fibers where the same epoxy resin were used as matrix. Absorbed impact energies evaluated through the combination of the data from the impact tester and high speed camera were compared to each other. In order to see the difference between the damaged area distribution CCD camera captures were performed.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.128-130
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• 2003

As toughness-investigation to improve brittleness of existing epoxy resin, elastic-factor of elastic epoxy using TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microsope) for structure-images analysis were investigated. A range of measurement temperature of the TMA, DMTA was changed from -20[$^{\circ}C$] to 200[$^{\circ}C$]. When modifier was ratio of 0[phr], 20[phr], 35[phr], glass transition temperature (Tg) of elastic epoxy was measured through thermal analysis devices. Also, it was investigated thermal expansion coefficient ($\alpha$), modulus and loss factor through DMTA. In addition, it was analyzed structure through FSSEM and made sure elastic-factor of elastic epoxy visually. As thermal analysis results, 20[phr] was superior than 30[phr] thermally and mechanically. Specially, thermal expansion coefficient, modulus, damping properties were excellent. By structure-images analysis through FESEM, we found elastic-factor of elastic epoxy that is not existing epoxy, and proved high impact.

• Journal of the Korean Chemical Society
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• v.40 no.1
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• pp.81-86
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• 1996

The physical properties of epoxy molding compound (EMC) according to the change of softening point of epoxy resin have been investigated in order to study the relationship between the properties of o-cresol novolac epoxy resin, which is main component of EMC for semiconductor encapsulation, and EMC. The softening points of used epoxy resin are 65.1 $^{\circ}C$, 72.2 $^{\circ}C$, and 83.0 $^{\circ}C$, respectively. The flexural strength and flexural modulus as mechanical properties were measured, and thermal expansion coefficient, thermal conductivity and glass transition temperature (Tg) as thermal properties, and spiral flow as moldability have been investigated to see the change of physical properties of EMC. The flexural modulus, thermal expansion coefficients in the glass state (${\alpha}_1$), and thermal conductivity of EMC were found to be keep constant value irrespective of the change of softening point, but Tg increased with softening point of epoxy resin, and the spiral flow decreased with that. It can be considered that these phenomena are due to the increase of crosslinking density of EMC according to the increase of softening point. The transition points were found out in the thermal expansion coefficient data in the rubbery state (${\alpha}_2$) and the flexural strength data. These can show the decrease of filler dispersion according to increase of epoxy resin viscosity.

• Composites Research
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• v.32 no.2
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• pp.90-95
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• 2019

Sloshing impact loads on liquefied natural gas (LNG) carr iers are the main issue of damage to the insulation system in LNG cargo containment system (LNG CCS). The damage to the insulation system would be fatal in maintaining a temperature-savings environment in LNG CCS. The typical method is to enhance the insulation materials that can maintain a constant cryogenic temperature. Insulation materials consist of polyurethane foam and plywood, an adhesive for bonding these two materials. This study intends to improve the absorption energy of the material when the impact load is applied by creating a glass bubble/epoxy composite resin as part of the insulation. The experimental scenarios consider the effect of temperature ($20^{\circ}C$, $-163^{\circ}C$), glass bubble weight fraction in epoxy resin through free fall experiments. Experiments have shown that if the glass bubble additive reaches 20 wt.%, the cryogenic absorption energy is a maximum performance and that 0 wt.% has a maximum ambient absorption energy. However, the agglomeration has been occurred due to deterioration of the stirring performance if weight fraction was 20 wt.% and the result of 0 wt.% have been revealed that ambient absorption energy is significantly lower.

• Polymer(Korea)
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• v.26 no.4
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• pp.501-507
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• 2002

In this work, diglycidylether of bisphenol-S (DGEBS) epoxy resin was prepared by alkaline condensation of bisphenol-S (BPS) with epichlorohydrin (ECH) in the presence of NaOH catalyst. The structure of the synthesized DGEBS epoxy resin was confirmed by IR, NMR spectra, and elemental analysis. The curing reaction and glass transition temperature ($T_g$) of DGEBS epoxy resin cured with phthalic anhydride (PA) and tetrahydrophthalic anhydride (THPA) at curing agents were studied by dynamic differential scanning calorimetry (DSC). The thermal stability of the cured specimen was investigated by thermogravimetric analysis (TGA). As a result, the activation energy ($E_a$) of DGEBS/PA system was higher than that of DGEBS/THPA system, whereas $T_g$, initial decomposed temperature (IDT), and decomposition activation energy ($E_t$) of DGEBS/PA were lower than those of DGEBS/THPA. This was probably due to the fact that the crosslinking density of DGEBS/THPA was increased by ring strain of curing agent.

• Journal of the Korean institute of surface engineering
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• v.43 no.6
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• pp.272-277
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• 2010

We investigated the life time characteristics of OLED device with aluminium oxide ($AlO_x$) passivation film on glass substrate and polyethylene terephthalate (PET) substrate by RF magnetron sputtering for the transparent barrier film applied to flexible OLED device. Basic buffer layer was determined as $Alq_3$(500 nm)-LiF(300 nm)-Al(1200 nm), and the most suitable aluminium oxide ($AlO_x$) film have been formed when the partial volume ratio of oxygen was 20% and the sputtering power was 100 watt and the minimum thickness of buffer was $2\;{\mu}m$. $AlO_x$/epoxy hybrid film was also used as a effective passivation layer for the purpose of improving life time characteristics of OLED devices with the glass substrate and the plastic substrate. Besides, the simultaneous deposition of $AlO_x$/epoxy film on back side of PET could result in better improvement of life time.