• 대한약리학회:학술대회논문집
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• 대한약리학회 2006년도 The 6th Congress of the Federation of Asian and Oceanian Physiological Societies
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• pp.88.2-88.2
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• 2006

• 대한수의사회지
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• 제32권10호
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• pp.627-633
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• 1996

• 한국의학물리학회:학술대회논문집
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• 한국의학물리학회 1999년도 Japanese Journal of Medical Physics
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• pp.299-300
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• 1999

• Archives of Plastic Surgery
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• 제51권2호
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• pp.262-264
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• 2024

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.441-442
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• 2002

Chemical mechanical polishing (CMP) is a manufacturing process that uses controlled wear to planarize dielectric and metallic layers on silicon wafers. CMP experiments revealed that a sub-ambient film pressure developed at the wafer/pad interface. Additionally, dishing occurs in CMP processes when the copper-in-trench lines are removed at a rate higher than the barrier layer. In order to study dishing across a stationary wafer during polishing, dishing maps were created. Since dishing is a function of the total contact pressure resulting from the applied load and the fluid pressure, the hydrodynamic pressure model was refined and used in an existing model to study copper dishing. Density maps, highlighting varying levels of dishing across the wafer face at different radial positions, were developed. This work will present the results.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.435-437
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• 2002

Polishing of copper, a process called copper chemical mechanical polishing, is a critical, intermediate step in the planarization of silicon wafers. During polishing, the electrodeposited copper films are removed by slurries: and the differential polishing rates between copper and the surrounding silicon dioxide leads to a greater removal of the copper. The differential polishing develops dimples and furrows; and the process is called dishing and erosion. In this work, we present the results of experiments on dishing and erosion of copper-CMP, using patterned silicon wafers. Results are analyzed for the pattern factors and properties of the copper layers. Three types of pads - plain, perforated, and grooved - were used for polishing. The effect of slurry chemistries and pad soaking is also reported.

• Journal of electromagnetic engineering and science
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• 제6권4호
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• pp.235-243
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• 2006

In this paper, the fractal shape is applied to microstrip band pass filters and integrated on a high-resistivity Si substrate to solve conventional $2^{nd}$ harmonic problem. Conventional microstrip coupled line filters are popular in RF front ends, because they can be easily fabricated and integrated with other RF components. However, they typically have large second harmonics that can cause unwanted interference in interested frequency bands. Without any additional filters, the proposed Koch shape filters have suppressed the $2^{nd}$ harmonics by about -40 dB, so they can be used in systems such as direct conversion receiver with stringent harmonic suppression requirements.

• 한국GIS학회:학술대회논문집
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• 한국GIS학회 2009년도 춘계학술대회
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• pp.138-141
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• 2009

This paper introduces AmericaView, a consortium for promoting remote sensing education, research and applications. As a case study, GeorgiaView is described in more detail. The AmericaView Consortium and StateView Consortia are good examples of collaboration for broadening the horizon of remote sensing applications in South Korea. Furthermore, the AmericaView example represents an opportunity for building a stepping stone to international collaboration.

• 한국지반공학회지:지반
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• 제37권2호
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• pp.59-63
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• 2021

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.337-337
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• 2002