• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.285-285
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• 2010

$Cu(In,Ga)Se_2$ (CIGS) 박막 태양전지 제조에는 동시증발법 (co-evaporation)으로 Cu, In, Ga, Se 각 원소의 증발을 세 단계로 제어하여 CIGS 박막을 증착하는 3-stage 방법이 널리 이용된다[1]. 3-stage 중 1st-stage에서는 In, Ga, Se 원소 만을 증발시켜 $(In,Ga)_2Se_3$ 전구체 (precursor) 박막을 성장시킨다. 고효율의 CIGS 태양전지를 위해서는 $(In,Ga)_2Se_3$ 전구체 증착의 공정 변수와 이에 따른 박막 특성의 이해가 중요하다. 본 연구에서는 Mo 박막이 증착된 소다석회유리 (soda lime glass) 기판에 동시증발장비를 이용하여 280 380 의 기판 온도에서 In, Ga, Se 물질을 증발시켜 $(In,Ga)_2Se_3$/Mo/glass 시료를 제작하였으며 XRD, SEM, EDS 등의 방법을 이용하여 특성을 분석하였다. XRD 분석 결과 기판 온도 $280{\sim}330^{\circ}C$에서는 $(In,Ga)_2Se_3$ 박막의 (006), (300) 피크가 관찰되었으며, 기판 온도가 증가할수록 (006) 피크 세기는 감소하였고 (300) 피크 세기는 증가하였다. $380^{\circ}C$에서는 (110)을 포함한 다수의 피크가 관찰되었다. 그레인 (grain) 크기는 기판 온도가 증가할수록 커지며 Ga/(In+Ga) 조성비는 기판 온도에 따라 일정함을 각각 SEM과 EDS 측정을 통해 알 수 있었다. $(In,Ga)_2Se_3$ 전구체의 (300) 배향은 CIGS 박막의 (220/204) 배향을 촉진하고[2], 이것은 높은 광전변환효율에 기여하는 것으로 알려져 있다. 때문에 $(In,Ga)_2Se_3$의 (300) 피크의 세기가 가장 큰 조건인 $330^{\circ}C$를 1st-stage 증착 온도로 하여 3-stage CIGS 태양전지 공정을 수행하였으며, $MgF_2$/Al/Ni/ITO/i-ZnO/CdS/CIGS/Mo/glass 구조의 셀에서 광전변환효율 16.96%를 얻었다.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.416-422
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• 1999

The characteristics of inductively coupled Cl$_2$/BCl$_3$ plasmas during the GaN etching were studied using plasma mass spectrometry by measuring the relative amounts of reactive ions, neutrals, and etch products. GaN etch rates increased with the increase of pressure and showed a maximum near 25mTorr for the pure $Cl_2$ and near 30mTorr for $Cl_2$$BCl_3$. The addition of$ BCl_3$ to $Cl_2$ also was increased GaN etch rates until 50%BCl$_3$ was mixed to $Cl_2$. The GaN etching with pure $Cl Cl_2$ appears to be related to the combination of Cl$_2^{+}$ ion bombardment and the chemical reaction of Cl radicals. In the case of the GaN etching with Cl$_2$/BCl$_3$, in addition to the combined effect of$_2^{ +}$ ions and Cl radicals, $_BCl2^{+ }$ ions appear to be responsible for some of GaN etching even though they do not have significant effect on the GaN etching compared to $Cl_2^{+}$ and Cl. $Ga^{+ }$ , $GaCl^{+}$ , $GaCl_2^{+}$ , and $N_2^{+}$ were observed as the positive ions of etch products, and the intensities of these etch products showed the same trends as those of GaN etch rate. Among the etch products, Ga and $N_2$ appear to be the main etch products.

• Proceedings of the Korea Water Resources Association Conference
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• 2004.05b
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• pp.1381-1384
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• 2004

대상 지점의 수질 예측은 단순한 모델로 설명하는데 쉽지 않을 뿐만 아니라 많은 오차를 내포하고 있다. 그러나 최근, 신경회로망, 퍼지 논리, 전문가 시스템 및 유전자 알고리즘과 같은 인공지능이 대두되면서 복잡한 비선형 과정들을 나타낼 수 있게 되었다. 나아가 진정한 인공 지능을 실현하기 위해서는 신경회로망, 퍼지 논리, 전문가 시스템 및 유전자 알고리즘을 보다 효과적으로 이용하고 통합해야 가능할 것으로 기대된다. 본 연구에서는 유전자 알고리즘(Genetic Algorithm)을 T-S 퍼지시스템(Takagj-Sugeno Fuzzy system)의 삼각형 멤버쉽 함수 형태와 규칙 베이스를 최적화하기 위한 도구로 사용하였으면, 예측은 T-S 퍼지 시스템을 이용하여 실시하였다. 대상지점은 영산강 유역의 나주지점을 선정하여 유량자료 및 수질자료를 이용하여 GA와 T-S 퍼지 시스템의 결합에 의해 수질 예측을 실시할 결과 돌연변이율$(P_m)$ $0.05\~0.1$에서 우수한 결과를 얻을 수 있었다.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.45 no.2
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• pp.127-136
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• 2008

This paper proposes the efficient system for automatic design of FSS(Frequency Selective Surface) with periodic pattern and frequency characteristics specified by operator. The proposed system derives optimal design parameters through tool for analysis of FSS with arbitrary pattern, DB(Data Base) implemented from limited simulation and measurement data of FSS, and GA(Genetic Algorithm) for optimizing design parameters. FSS analysis tool consists of two analysis tools. One is the simulator for analysis of monolayer FSS that using moment method, another is the tool with approximated analysis method of FSS with dielectric layer. Given pattern configuration and characteristics specified by operators, the DB system searches the best matching FSS, and provides initial genes to GA from the searched parameters, which drastically reduces running time of GA for finding the FSS design parameters. In this paper, the proposed design system is verified through simulation and measurement about FSS with various patterns.

• Journal of Magnetics
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• v.19 no.2
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• pp.126-129
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• 2014

We report the crystallographic and magnetic properties of $Ni_{0.3}Fe_{0.7}Ga_2S_4$ by means of X-ray diffractometer (XRD), a superconducting quantum interference device (SQUID) magnetometer, and a M$\ddot{o}$ssbauer spectroscopy. In particular, $Ni_{0.3}Fe_{0.7}Ga_2S_4$ was studied by M$\ddot{o}$ssbauer analysis for evidence of spin reorientation. The chalcogenide material $Ni_{0.3}Fe_{0.7}Ga_2S_4$ was fabricated by a direct reaction method. XRD analysis confirmed that $Ni_{0.3}Fe_{0.7}Ga_2S_4$ has a 2-dimension (2-D) triangular lattice structure, with space group P-3m1. The M$\ddot{o}$ssbauer spectra of $Ni_{0.3}Fe_{0.7}Ga_2S_4$ at spectra at various temperatures from 4.2 to 300 K showed that the spectrum at 4.2 K has a severely distorted 8-line shape, as spin liquid. Electric quadrupole splitting, $E_Q$ has anomalous two-points of temperature dependence of $E_Q$ curve as freezing temperature, $T_f=11K$, and N$\acute{e}$el temperature, $T_N=26K$. This suggests that there appears to be a slowly-fluctuating "spin gel" state between $T_f$ and $T_N$, caused by non-paramagnetic spin state below $T_N$. This comes from charge re-distribution due to spin-orientation above $T_f$, and $T_N$, due to the changing $E_Q$ at various temperatures. Isomer shift value ($0.7mm/s{\leq}{\delta}{\leq}0.9mm/s$) shows that the charge states are ferrous ($Fe^{2+}$), for all temperature range. The Debye temperature for the octahedral site was found to be ${\Theta}_D=260K$.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.12 no.1
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• pp.19-26
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• 1987

The broadband microwave amplifier in the 3~4GHz frequency range has been designed by using potentially unstable GaAs FET. Input matching network is designed by 14dB available power gain circles which are in the stable region. In order to obtain maximu, transducer power gain, output matching network which is in the stable region can be designed using Fano's bandpass matching network. The measured values of transducer power gain, $S_11$and $S_22$ show close agreements with the theoretical valuse.

• Transactions on Electrical and Electronic Materials
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• v.6 no.5
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• pp.229-232
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• 2005

Direct characterization of band alignment at chemical bath deposition $(CBD)-CdS/Cu_{0.93}(In_{1-x}Ga_x)Se_2$ has been carried out by photoemission spectroscopy (PES) and inverse photoemission spectroscopy (IPES). Ar ion beam etching at the condition of the low ion kinetic energy of 400 eV yields a removal of surface contamination as well as successful development of intrinsic feature of each layer and the interfaces. Especially interior regions of the wide gap CIGS layers with a band gap of $1.4\~1.6\;eV$ were successfully exposed. IPES spectra revealed that conduction band offset (CBO) at the interface region over the wide gap CIGS of x = 0.60 and 0.75 was negative, where the conduction band minimum of CdS was lower than that of CIGS. It was also observed that an energy spacing between conduction band minimum (CBM) of CdS layer and valance band maximum (VBM) of $Cu_{0.93}(In_{0.25}Ga_{0.75})Se_2$ layer at interface region was no wider than that of the interface over the $Cu_{0.93}(In_{0.60}Ga_{0.40})Se_2$ layer.

• ETRI Journal
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• v.31 no.6
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• pp.749-754
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• 2009

The design and performance of an InGaAs/InP transimpedance amplifier and post amplifier for 40 Gb/s receiver applications are presented. We fabricated the 40 Gb/s transimpedance amplifier and post amplifier using InGaAs/InP heterojunction bipolar transistor (HBT) technology. The developed InGaAs/InP HBTs show a cut-off frequency ($f_T$) of 129 GHz and a maximum oscillation frequency ($f_{max}$) of 175 GHz. The developed transimpedance amplifier provides a bandwidth of 33.5 GHz and a gain of 40.1 $dB{\Omega}$. A 40 Gb/s data clean eye with 146 mV amplitude of the transimpedance amplifier module is achieved. The fabricated post amplifier demonstrates a very wide bandwidth of 36 GHz and a gain of 20.2 dB. The post-amplifier module was fabricated using a Teflon PCB substrate and shows a good eye opening and an output voltage swing above 520 mV.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.2
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• pp.215-220
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• 2016

Monolithically integrated devices are strongly desired in next generation power ICs to reduce the chip size and improve the efficiency and frequency response. Three examples of the embedment of different functional diode(s) into AlGaN/GaN heterojunction field-effect transistors are presented, which can minimize the parasitic effects caused by interconnection between devices.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.65-65
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• 2003

청색 발광 LEDs의 개발과 상용화 이후에 백색조명등의 응용 가능성으로 인하여 이에 대한 많은 연구가 최근에 계속되고 있다 하지만 GaN의 많은 광학적인 장점에도 불구하고 이러한 소자의 기판으로 사용되고 있는 sapphire의 열악한 열적 특성은 소자의 열화를 야기할 수 있으며 특히 고출력작동 시에 소자성능 저하의 원인이 될 수 있다. 따라서 이러한 GaN를 기본으로 하는 LED의 경우 이에 대한 정확한 열 측정과 고출력 작동 시의 열적 모델링은 칩과 패키징 단위에서 모두 중요한 연구분야가 되고 있다. 고출력 GaN LED에 대하여 신뢰성에 관한 몇 가지 보고가 있지만, 이러한 보고의 대부분은 패키징 된 램프에 대한 분석이며 정작 칩에 대한 근본적인 열 분석과 신뢰성에 대한 연구결과는 미미한 실정이다 따라서 본 연구에서는 GaN LED 칩에 대하여 직접적인 열 분석을 시도하였다