• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.5-8
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• 2000

This paper proposes GaN film as a piezoelectric material for SAW(surface acoustic wave) filters. The fabricated GaN SAW filter exhibited a very high velocity of 5800 ㎧and relatively low insertion loss of -9.9 dB without matching circuit. From Smith's equivalent circuit model, the calculated electromechanical coupling factor (K$^2$) was about 4.$\pm$03％. which is larger than those obtained from other thin film piezoelectric materials and allows the realization of wider filter fractional bandwidths.

• Journal of the Korean Vacuum Society
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• v.12 no.S1
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• pp.52-55
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• 2003

GaAs/AlGaAs quantum-wire (QWR) gain-coupled distributed-feedback (GC-DFB) lasers are fabricated and characterized Constant metalorganic chemical vapor deposition (MOCVD) growth is used to avoid grating overgrowth during the fabrication of DFB structures. Numerical calculation shows large gain anisotropy by optical feedback along the DFB directions near Bragg wavelength. DFB lasing via QWR active gratings is also experimentally achieved.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.93-93
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• 1998

III-V족 질화물반도체를 이용한 광 및 전자소자 용용에 있어서 가장 중요한 고홈위 u undoped GaN 에피충 성장과 GaN 에피충의 doping 특허 p-type doping의 복성융 고찰한다. 그리고 III-V nitride 이용한 band gap en명neertng에 있어서 가장 중요한 InGaN 생장파 81 및 :at codoplng 륙성융 평가 분석 한다. 위의 기반기술융 기본으로 하여 InGaN/AlG때 DH s$\sigma$ucture lED훌 제작하고 이의 륙성 용 명가분석하였다.

• Proceedings of the Korean Society of Crop Science Conference
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• 1992.05a
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• pp.50-51
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• 1992

• Proceedings of the Korean Society of Crop Science Conference
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• 1992.05a
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• pp.52-53
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• 1992

• Proceedings of the KSR Conference
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• 2002.05a
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• pp.128-134
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• 2002

This paper is to investigate adoptability of the genetic algorithm to the railway traffic conflict resolution problem. We categorize the problem in two cases, one is the specific-boundary case and the other is not. GA is may be used in the first case, but not for second case. For a sample problem, an GA is designed, and the GA is being compared with Ho's.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.408-411
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• 1995

Microstructure and magnetic properties of $Fe-Nd_{13.5}-Co_{15}-B_{6-8}Ga_{0-1}-Zr_{0.2-1}$ alloys during HDDR process were studied. $ZrB_{2}$ phase was detected and identified by X-Ray diffraction. Influence of Ga, Zr and Ga+Zr additions on phase relations at different stages of HDDR process was studied by X-ray diffraction and magnetic measurements.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.3 no.4
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• pp.915-922
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• 1999

The field dependent characteristics of electron transport with GaAs impact ionization have been analyzed, using GaAa full band E-k relationship. The E-k relationship is derived from empirical pseudopotential method, using Fermi's golden rule and local form factor, and Brillouin zone is divided into tetrahedrons for calculating impact ionization rate, and tetrahedron method, in which integrates each tetrahedrons, is used. Monte Carlo simulation is used for analyzing anisotropy of impact ionization. A result of transient analysis for impact ionization has presented that anisotropy of impact ionization only arises during transient state and impact ionization is isotropic under steady state. Anisotropic characteristics of impact ionization for GaAs, which is presented in this paper, can be used in carrying out a transient analysis for GaAs devices.

• International Journal of Internet, Broadcasting and Communication
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• v.12 no.2
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• pp.30-36
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• 2020

We demonstrated a successful fabrication of 4" Gallium Nitride (GaN)/Diamond High Electron Mobility Transistors (HEMTs) incorporated with Inner Slot Via Hole process. We made in manufacturing technology of 4" GaN/Diamond HEMT wafers in a compound semiconductor foundry since reported [1]. Wafer thickness uniformity and wafer flatness of starting GaN/Diamond wafers have improved greatly, which contributed to improved processing yield. By optimizing Laser drilling techniques, we successfully demonstrated a through-substrate-via process, which is last hurdle in GaN/Diamond manufacturing technology. To fully exploit Diamond's superior thermal property for GaN HEMT devices, we include Aluminum Nitride (AlN) barrier in epitaxial layer structure, in addition to conventional Aluminum Gallium Nitride (AlGaN) barrier layer. The current collapse revealed very stable up to Vds = 90 V. The trapping behaviors were measured Emission Microscope (EMMI). The traps are located in interface between Silicon Nitride (SiN) passivation layer and GaN cap layer.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1264-1267
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• 1998

$Cu(In_xGa_{1-x})Se_2$ thin films were prepared and characterized with various Ga contents. As the Ga content increased, the grain size of CIGS film became smaller. The 2 $\theta$ values in XRD patterns were shifted to larger values and the overlapped peaks were splitted. The energy bandgap increased from 1.04 to 1.67 eV and the resistivity decreased. The solar cell fabricated with ZnO/CdS/$Cu(In_{0.7}Ga_{0.3})Se_2/Mo$ structure yielded an efficeincy of 14.48% with an acitive area of 0.18 $cm^2$. The efficiency decreased with further increase of Ga content.