• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.261-261
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• 2011

펄스 직류 전원 $BCl_3/SF_6$ 플라즈마를 이용하여 GaAs/$Al_{0.2}Ga_{0.8}As$의 선택적 식각을 연구하였다. 식각 주요 공정 변수는 $BCl_3/SF_6$ 플라즈마에서 $SF_6$ 가스 유량(0~50%)이었다. $BCl_3/SF_6$의 총 가스 유량은 20 sccm이었다. 다른 공정 조건인 공정 압력(100 mTorr), 펄스 파워(500 V), 펄스 주파수(200 kHz), 리버스 시간 (0.7 ${\mu}s$)은 일정하게 고정시켰으며 기계적 펌프만을 이용하여 공정을 진행하였다. 오실로스코프(Oscilloscope) 데이터에 의하면 가스의 조성 변화에도 척에 걸리는 입력 전압과 전류가 거의 변화가 없었다. $BCl_3/SF_6$ 가스가 10%의 조성에서 GaAs와 $Al_{0.2}Ga_{0.8}As$의 식각 선택비가 약 48 : 1로 우수한 결과를 나타내었다. 그러나 $BCl_3/SF_6$ 가스의 증가는 GaAs의 식각율과 선택도를 감소시켰다. 그리고 $SF_6$ 가스의 조성비가 30% 이상일 경우에는 GaAs와 $Al_{0.2}Ga_{0.8}As$가 식각되지 않았다. 식각 후에 GaAs의 표면 거칠기(RMS surface roughness)는 0.7~1.3 nm로 나타났다. 위의 결과들을 종합적으로 보면 펄스 직류 전원 $BCl_3/SF_6$의 조성비가 10%일 때 가장 좋은 식각 선택비를 얻을 수 있었다.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.325-329
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• 1996

We report on p-type arsenic doping of metalorganic vapor phase epitaxially (MOVPE) grown HgCdTe on (100) GaAs. HgCdTe was grown at $370^{\circ}C$ in a horizontal reactor with using dimethy-cadmium, diisoprophyltelluride, and elemental Hg. We used tris-dimethylaminoarsenic (DMAAs) as the metalorganic for p-doping. 4micron thick CdTe and subsequently 10micron thick HgCdTe were grown on (100) GaAs substrate. Interdiffused multilayer process in which thin CdTe and HgTe layers are grown alternately and interdiffused to obtain homogeneous HgCdTe alloys was used. Arsenic was doped during CdTe growth cycle. After growth HgCdTe was annealed at $415^{\circ}C$ for 15 min and then annealed again at $220^{\circ}C$ for 3 hr, both with Hg-saturate condition. We could obtain p-doping from 2.5$\times$$10^{16}$ to 6.6$\times$$10^{17}$$cm^{-3}$, depending on the DMAAs partial pressure. With the dual Hg-annealing, activation of arsenic was aboutt 90%, which was confirmed by SIMS measurement. With only low temperature annealing at $220^{\circ}C$ for 3hr, activation efficiency was about 50%.

• Journal of the Korean Ceramic Society
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• v.44 no.1 s.296
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• pp.32-36
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• 2007

Zinc gallate $(ZnGa_2O_4)$ thin film phosphors have been formed on ITO glass substrates by a sol-gel spinning coating method. For the formation of the film phosphors, the starting materials of zinc acetate dihydrate, gallium nitrate hydrate and 2-methoxyethanol as a solution were used. The thin films deposited were firstly dried at $100^{\circ}C$ and fired at $500^{\circ}C\;or\;600^{\circ}C$ for 30 min and then, annealed $500^{\circ}C\;or\;600^{\circ}C$ at for 30 min under an annealing atmosphere of 3% $H_2/Ar$. The thin films deposited on ITO glass plates showed the (220), (222), (400), (422), (511), and (440) peaks of spinel structure as well as the (311) peak indicating a standard powder diffraction pattern. The surface morphologies of the thin film phosphors were observed with a firing and an annealing condition. The $ZnGa_2O_4$ film phosphors showed the blue emission spectra around 410 nm as well as the emission spectra in the UV region (360-380 nm).

• Korean Journal of Crystallography
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• v.2 no.1
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• pp.1-11
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• 1991

When GaAs single crystals are grown by LEC method, a serious problem is that longitudinal twins are often generated. the growth axis is changed from (100) to (221) direction by logitudinal twin. In this experiment, 3 inch GaAs single crystals, slaving (100) uonh axis, were von by LEC method. Striations and edge facets generated during crystal growth, were observed by SPW photo-etching. Relationship between striations and edge facets was studied. Instability of their generation was the cause of goneration of longitudinal twins. The shape of striations was changed with the growth conditions such as crystal diameter and melt volume. In the region of crystal edge: there was the microscopic fluctuation by the instability of melt convection. Edge facets consisting of {111} plane developed well in the region which striation were convex to the melt. Because the angle between striation and {111} edge facet decreased in that region. Longitudinal twins were generated on the crystal surface at the <111> direction which is perpendicular to the growth axis. These were generated by unstable melt convection and propagated in the crystal as crystal grew. Longitudinal twins were generated when regrowth rate was very fast after {111} edge facets were remelted. So, in order to supress the generation of longitudinal twin, abrupt change of melt convection must be prohibited.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.4
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• pp.121-127
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• 2022

β-Gallium oxide (Ga₂O₃), an ultra-wide bandgap semiconductor, has attracted great attention due to its promising applications for high voltage power devices. The most stable phase among five different polytypes, β-Ga₂O₃ has the wider bandgap of 4.9 eV and higher breakdown electric field of 8 MV/cm. Furthermore, it can be grown from melt source, implying higher growth rate and lower fabrication cost than other wide bandgap semiconductors such as SiC, GaN and diamond for the power device applications. In this study, β-Ga₂O₃ bulk crystals were grown by the edge-defined film-fed growth (EFG) process. The growth direction and the principal surface were set to be the [010] direction and the (100) plane of the β-Ga₂O₃ crystal, respectively. The spectra measured by Raman an alysis could exhibit the crystal phase an d impurity dopin g in the β-Ga₂O₃ ingot, and the crystallinity quality and crystal direction were analyzed using high-resolution X-ray diffraction (HRXRD). The crystal quality and various properties of as-grown β-Ga₂O₃ ribbon was systematically analyzed in order to investigate the spatial variation in entire crystal grown by EFG method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.361-365
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• 2003

Planar Inductively Coupled Plasma (PICP) etching of InGaP was performed in $BCl_3,\;BCl_3/Ar\;and\;BCl_3/Ne$ plasmas as a function of ICP source power ($0\;{\sim}\;500\;W$), RIE chuck power ($0\;{\sim}\;150\;W$), chamber pressure ($5\;{\sim}\;15\;mTorr$) and gas composition of $BCl_3/Ar\;and\;BCl_3/Ne$. Total gas flow was fixed at 20 sccm (standard cubic centimeter per minute). Increase of ICP source power and RIE chuck power raised etch rate of InGaP, while that of chamber pressure reduced etch rate. We also found that some addition of Ar and Ne in $BCl_3$ plasma improved etch rate of InGaP. InGaP etch rate was varied from $1580\;{\AA}/min$ with pure $BC_3\;to\;2800\;{\AA}/min$ and $4700\;{\AA}/min$ with 25 % Ar and Ne addition, respectively. Other process conditions were fixed at 300 W ICP source power, 100 W RIE chuck power and 7.5 mTorr chamber pressure. SEM (scanning electron microscopy) and AFM (atomic force microscopy) data showed vertical side wall and smooth surface of InGaP at the same condition. Proper addition of noble gases Ar and Ne (less than about 50 %) in $BCl_3$ inductively coupled plasma have resulted in not only increase of etch rate but also minimum preferential loss and smooth surface morphology by ion-assisted effect.

• Membrane and Water Treatment
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• v.3 no.3
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• pp.169-179
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• 2012

One of the major limitations in the use of commercial aromatic polyamide thin film composite (TFC) reverse osmosis (RO) membranes is to maintain high performance over a long period of operation, due to the sensitivity of polyamide (PA) skin layer to oxidizing agents, such as chlorine, even at very low concentrations in feed water. This article reports surface modification of a commercial TFC RO membrane (BW30-Dow Filmtec) by covering it with a thin film of poly(vinyl alcohol) (PVA) crosslinked with glutaraldehyde (GA) to improve its resistance to chlorine. Crosslinking reaction was carried out at 25 and $40^{\circ}C$ by using PVA 1.0 wt.% solutions at different GA/PVA mass ratio, namely 0.0022, 0.0043 and 0.013. Water swelling measurements indicated a maximum crosslinking density for PVA films prepared at $40^{\circ}C$ and GA/PVA 0.0043. ATR-FTIR and TGA analysis confirmed the reaction between GA and PVA. SEM images of the original and modified membranes were used to evaluate the surface coating. Chlorine resistance of original and modified membranes was evaluated by exposing it to an oxidant solution (NaClO 300 mg/L, NaCl 2,000 mg/L, pH 9.5) and measuring water permeability and salt rejection during more than 100 h period. The surface modification effectively was demonstrated by increasing the chlorine resistance of PA commercial membrane from 1,000 ppm.h to more than 15.000 ppm.h.

• Analytical Science and Technology
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• v.8 no.4
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• pp.669-674
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• 1995

The preparation and characterization of photosemiconductive electrodes of GaAs and of $Fe_2O_3$ doped with MgO or CaO were investigated. The doped $Fe_2O_3$ photosemiconductive electrodes were prepared from thin films sintered at temperatures from 1,100 to $1,450^{\circ}C$, and rapidly quenched in distilled water. The surfaces of the electrodes containing both corundum structure of $Fe_2O_3$ and spinel structure of $Mg_xFe_{3-x}O_4$ or $Ca_xFe_{3-x}O_4$ were analyzed by X-ray diffraction and scanning electron microscopy. The cathodic and anodic photocurrents on these electrodes indicated a critical doping amount of 5-11 wt. %. The photocurrents were enhanced when GaAs electrodes were treated with methylene violet the anodic photo-currents were temporarial enhanced and changed to the cathodic ptotocurrents after the surface was dryed.

• ETRI Journal
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• v.27 no.3
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• pp.304-311
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• 2005

We report on the fabrication of an AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (PHEMT) using a dielectric-defined process. This process was utilized to fabricate $0.12\;{\mu}m\;{\times}\;100 {\mu}m$ T-gate PHEMTs. A two-step etch process was performed to define the gate footprint in the $SiN_x$. The $SiN_x$ was etched either by dry etching alone or using a combination of wet and dry etching. The gate recessing was done in three steps: a wet etching for removal of the damaged surface layer, a dry etching for the narrow recess, and wet etching. A structure for the top of the T-gate consisting of a wide head part and a narrow lower layer part has been employed, taking advantage of the large cross-sectional area of the gate and its mechanically stable structure. From s-parameter data of up to 50 GHz, an extrapolated cut-off frequency of as high as 104 GHz was obtained. When comparing sample C (combination of wet and dry etching for the $SiN_x$) with sample A (dry etching for the $SiN_x$), we observed an 62.5% increase of the cut-off frequency. This is believed to be due to considerable decreases of the gate-source and gate-drain capacitances. This improvement in RF performance can be understood in terms of the decrease in parasitic capacitances, which is due to the use of the dielectric and the gate recess etching method.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.29-32
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• 2009

Dense and periodic arrays of nano-sized holes were patterned in oxide thin film on GaAs substrate. To obtain the nano-size patterns, self-assembling diblock copolymer was used to produce thin film of uniformly distributed parallel cylinders of polymethylmethacrylate (PMMA) in polystyrene (PS) matrix. The PMMA cylinders were removed with UV expose and acetic acid rinse to produce PS nanotemplate. By reactive ion etching, pattern of the PS template was transferred to under laid silicon oxide layer. Transferred patterns were reached to the GaAs substrate by controlling the dry etching time. We confirmed the achievement of etching through the removing oxide layer and observation of GaAs substrate surface. Optimized etching time was 90 to 100 sec. Pore sizes of the nanopattern in the silicon oxide layer were 20~22 nm.