• 제목/요약/키워드: Ga doping

검색결과 224건 처리시간 0.031초

III-V족 질화물 반도체 성장과 청색 LED 제작 특성

  • 이철로;임재영;손성진
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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    • pp.93-93
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    • 1998
  • III-V족 질화물반도체를 이용한 광 및 전자소자 용용에 있어서 가장 중요한 고홈위 u undoped GaN 에피충 성장과 GaN 에피충의 doping 특허 p-type doping의 복성융 고찰한다. 그리고 III-V nitride 이용한 band gap en명neertng에 있어서 가장 중요한 InGaN 생장파 81 및 :at codoplng 륙성융 평가 분석 한다. 위의 기반기술융 기본으로 하여 InGaN/AlG때 DH s$\sigma$ucture lED훌 제작하고 이의 륙성 용 명가분석하였다.

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Insertion of Carbon Interlayer Into GaN Epitaxial Layer

  • Yu, H.S.;Park, S.H.;Kim, M.H.;Moon, D.Y.;Nanishi, Y.;Yoon, E.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.148-149
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    • 2012
  • This paper reports doping of carbon atoms in GaN layer, which based on dimethylhydrazine (DMHy) and growth temperature. It is well known that dislocations can act as non-radiative recombination center in light emitting diode (LED). Recently, many researchers have tried to reduce the dislocation density by using various techniques such as lateral epitaxial overgrowth (LEO) [1] and patterned sapphire substrate (PSS) [2], and etc. However, LEO and PSS techniques require additional complicated steps to make masks or patterns on the substrate. Some reports also showed insertion of carbon doped layer may have good effect on crystal quality of GaN layer [3]. Here we report the growth of GaN epitaxial layer by inserting carbon doped GaN layer into GaN epitaxial layer. GaN:C layer growth was performed in metal-organic chemical vapor deposition (MOCVD) reactor, and DMHy was used as a carbon doping source. We elucidated the role of DMHy in various GaN:C growth temperature. When growth temperature of GaN decreases, the concentration of carbon increases. Hence, we also checked the carbon concentration with DMHy depending on growth temperature. Carbon concentration of conventional GaN is $1.15{\times}1016$. Carbon concentration can be achieved up to $4.68{\times}1,018$. GaN epilayer quality measured by XRD rocking curve get better with GaN:C layer insertion. FWHM of (002) was decreased from 245 arcsec to 234 arcsec and FWHM of (102) decreased from 338 arcsec to 302 arcsec. By comparing the quality of GaN:C layer inserted GaN with conventional GaN, we confirmed that GaN:C interlayer can block dislocations.

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n형 GaN의 doping 농도에 따르는 건식 식각 손상 (Doping-level dependent dry-etch damage of in n-type GaN)

  • 이지면
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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    • pp.417-420
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    • 2004
  • The electrical effects of dry-etch on n-type GaN by an inductively coupled $Cl_2/CH_4/H_2/Ar$ plasma were investigated as a function of ion energy, by means of ohmic and Schottky metallization method. The specific contact resistivity(${\rho}_c$) of ohmic contact was decreased, while the leakage current in Schottky diode was increased with increasing ion energy due to the preferential sputtering of nitrogen. At a higher rf power, an additional effect of damage was found on the etched sample, which was sensitive to the dopant concentration in terms of the ${\rho}_c$ of ohmic contact. This was attributed to the effects such as the formation of deep acceptor as well as the electron-enriched surface layer within the depletion layer. Furthermore, thermal annealing process enhanced the ohmic and Schottky property of heavily damaged surface.

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(F, Ga) 코도핑된 ZnO 투명 전도 박막의 솔-젤 제조와 특성 (Sol-gel Spin-coating of ZnO Co-doped with (F, Ga) as A Transparent Conducting Thin Film)

  • 남길모;권명석
    • 반도체디스플레이기술학회지
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    • 제13권1호
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    • pp.91-95
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    • 2014
  • (F,Ga) co-doped ZnO thin film on glass substrate was fabricated via a simple non-alkoxide sol-gel spin-coating. Contrary to the F single doped ZnO thin film, the (F,Ga) co-doped thin film showed a significant reduce in electrical resistivity after a second post-heat-treatment in reducing environment. The resulting decrease in electrical resistivity with Ga co-doping is considered to be resulted from the increases both carrier density and mobility. The optical transmittance of the (F,Ga) co-doped thin film in the visible range showed higher transmittance with Ga co-doping compared with F single doped ZnO thin film.

Photoluminescence Up-conversion in GaAs/AlGaAs Heterostructures

  • Cheong, Hyeonsik M.
    • Journal of Korean Vacuum Science & Technology
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    • 제6권2호
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    • pp.58-61
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    • 2002
  • Photoluminescence up-conversion in semiconductor heterostructures is a phenomenon in which luminescence occurs at energies higher than that of the excitation photons. It has been observed in many semiconductor heterostructure systems, including InP/AnALAs, CdTe/CdMgTe, GaAs/ordered-(Al)GalnP, GaAs/AIGaAs, and InAs/GaAs. In this wort, GaAs/AIGaAs heterostructures are used as a model system to study the mechanism of the up-conversion process. This system is ideal for testing different models because the band offsets are quite well documented. Different heterostructures are designed to study the effect of disorder on the up-converted luminescence efficiency. In order to study the roles of different types of carriers, the effect of doping was investigated. It was found that the up-converted luminescence is significantly enhanced by p-type doping of the higher-band-gap material.

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MBE에 의해 성장된 Heteroface AlGaAs/GaAs 태양전지 (Heteroface AlGaAs/GaAs Solar Cells grown by MBE)

  • 장호성;임성규
    • 대한전자공학회논문지
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    • 제27권1호
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    • pp.46-50
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    • 1990
  • Heteroface AlGaAs/GaAs drift solar cells with an active area conversion efficiency of 15.9% under one sun and AM 1.5 condition have been grown by molecular beam epitaxy(MBE). These drift solar cells have graded doping profiles in the base and emitter regions. The cells have a short circuit current density (Jsc) of 19.00 mA/cm\ulcorner an open circuit voltage(Voc) of 0.93 V, and f fill factor(FF) of 0.78, respectively. Conventional solar cells with fixed doping profiles were also grown by MBE for comparison with the drift solar cells. Even though the fabrication cost of MBE grown solar cell is higher, the expected highest conversion efficiency of the single or multiple cells could compensate for the increased cost, particularly in case of space applications.

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Inclusion of Silicon Delta-doped Two-dimensional Electron Gas Layer on Multi-quantum Well Nano-structures of Blue Light Emitting Diodes

  • Kim, Keun-Joo
    • Transactions on Electrical and Electronic Materials
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    • 제5권5호
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    • pp.173-179
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    • 2004
  • The influence of heavily Si impurity doping in the GaN barrier of InGaN/GaN multi-quantum well structures of blue light emitting diodes were investigated by growing samples in metal-organic chemical vapor deposition. The delta-doped sample was compared to the sample with the undoped barrier. The delta-doped sample shows the tunneling behavior and forms the energy level of 0.32 eV for tunneling and the photoemission of the 450-nm band. The photo-luminescence shows the blue-shifted broad band of the radiative transition due to the inclusion of Si delta-doped layer indicating that the delta doping effect acts to form the higher energy level than that of quantum well. The dislocation may provide the carrier tunneling channel and plays as a source of acceptor. During the tunneling of hot carrier, there was no light emission.

MOCVD를 이용한 Heteroface p-$Al_{x}Ga_{1-x}As/p-GaAs/n-GaAs/n^{+}$-GaAs 태양전지의 개발 (Heteroface p-$Al_{x}Ga_{1-x}As/p-GaAs/n-GaAs/n^{+}$-GaAs Solar Cell Grown by MOCVD)

  • 창기근;임성규
    • 전자공학회논문지A
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    • 제28A권1호
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    • pp.30-39
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    • 1991
  • The influence of physical parameters (Al mole fraction, thickness, doping concentration) in the window and emitter on the efficiency characteristics of heteroface p-$Al_{x}Ga_{1-x}As/p-GaAs/n-GaAs/n^{+}$-GaAs solar cell is investigated. The maximum efficiency theoretically calculated in this device is obtained when a thickness of the window is in a range of (400-1000))$\AA$and a thickness/doping concentration of the emitter is in a range of (0.5-0.8)$\mu$m/(1-7)${\times}10^{17}cm^{-3}$, respectively. Also is the efficiency improved according to the increase of Al mole fraction in the indirect gap window(0.41${\le}x{\le}1.0$). The optimum designed heteroface cell with an area of 0.165cm$^2$fabricated using MOCVD exhibits an active area conversion efficiency of 17%, having a short circuit current density of 21.2mA/cm\ulcorner an open circuit voltage of 0.94V, and a fill factor of 0.75 under ELH-100mW/cm$^2$illumination.

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Ga 도핑된 $\textrm{Zn}_{2}\textrm{SiO}_{4}$: Mn 녹색 형광체의 발광특성 (Photoluminescent Properties of $\textrm{Zn}_{2}\textrm{SiO}_{4}$: Mn Green Phosphors doped with Ga)

  • 박응석;장호정;조태환
    • 한국재료학회지
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    • 제8권9호
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    • pp.860-864
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    • 1998
  • 고상 반응법에 의해 제조된 $\textrm{Zn}_{1.98}\textrm{Mn}_{0.02}\textrm{SiO}_{4}$ 녹색 형광체에 Ga 원소를 치환시켜 소성온도 및 Ga의 첨가량에 따른 발광특성과 결정특성을 조사하였으나, $\textrm{Zn}_{1.98}\textrm{Mn}_{0.02}(\textrm{Si_{1-x}\textrm{Ga}_{x})\textrm{O}_{4}$ 형광체에 있어서 Ga을 첨가했을 경우가 첨가하지 않은 샘플에 비해 발광특성이 개선되었으며, 8mol%(x=0.08) Ga을 첨가했을 때 발광세기와 색순도에서 가장 우수한 특성을 보였다. $\textrm{Zn}_{1.98}\textrm{Mn}_{0.02}(\textrm{Si_{1-x}\textrm{Ga}_{x})\textrm{O}_{4}$ 형광체(x=0.08)에 대해서 소성온도를 $1100^{\circ}C$에서 $1400^{\circ}C$로 증가함에 따라 결정성이 개선되었으며 발광강도 역시 약 7배 이상 크게 증가하였다. 잔광시간은 Ga 첨가량에 관계없이 약 24 ms로 거의 변화가 없었다. 입도분석 결과 1-3$\mu\textrm{m}$의 작은 입자가 주로 관찰되었으며 10$\mu\textrm{m}$이상의 큰 응집입자도 소량 존재하였다.

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도핑된 GaAs의 형광 및 시간분해 형광 특성 (Properties of photoluminescence and time-resolved photoluminescence in doped GaAs)

  • 추장희;서정철;유성규;신은주;이주인;김동호
    • 한국광학회지
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    • 제8권3호
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    • pp.213-217
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    • 1997
  • n형과 p형 GaAs의 도핑에 따른 형광과 시간 분해 형광특성을 조사하였다. 도핑의 농도가 증가할수록 형광의 피크 위치는 p형은 낮은 에너지 쪽으로, n형은 높은 에너지 쪽으로 이동함을 관찰하였다. 이것은 p형은 띠간격 좁아짐 효과가 우세하게 작용하며, n형은 Burstein-Moss효과가 지배적으로 작용하기 때문인 것으로 해석된다. 또한, 도핑의 농도가 증가하면 형광의 소멸시간과 상승시간이 감소하며, p형의 형광소멸시간과 상승시간이 n형보다 더 빠르게 나타났다. 따라서 도핑된 GaAs에서 형광소멸시간과 상승시간은 다수 운반자의 종류와 농도에 의존함을 알 수 있으며, 운반자-운반자 상호작용이 에너지 이완 과정에 중요한 역할을 함을 알 수 있었다.

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