• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제36회 동계학술대회 초록집
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• pp.147.1-147.1
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• 2009

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2016년도 자성 및 자성재료 국제학술대회
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• pp.192-192
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• 2016

• 센서학회지
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• 제26권2호
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• pp.79-84
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• 2017

The drain current of the SB MOSFET was analytically modeled by an equation composed of thermionic emission and tunneling with consideration of the image force lowering. The depletion region electron concentration was used to model the channel electron concentration for the tunneling current. The Schottky barrier width is dependent on the channel electron concentration. The drain current is changed by the gate oxide thickness and Schottky barrier height, but it is hardly changed by the doping concentration. For a GaN SB MOSFET with ITO source and drain electrodes, the calculated threshold voltage was 3.5 V which was similar to the measured value of 3.75 V and the calculated drain current was 1.2 times higher than the measured.

• 한국재료학회지
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• 제6권9호
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• pp.950-958
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• 1996

저압 유기금속 화학증착법을 사용하여 AIGaInP층의 diethylzinc의 III족 원소(AO, Ga, In)에 대한 비와 성장온도 변화에 따른 Zn(acceptor)의 첨가 농도특성을 연구하였다. Diethylzinc의 III족 원소(AI, Ga, In)비를 0.4에서 2.0까지 변화시켜 본 결과 0.85일 때 가장 높은 acceptor 농도를 가졌으며, 성장온도를 69$0^{\circ}C$에서 80$0^{\circ}C$까지 변화시킨 결과 성장온도에 대한 변화는 69$0^{\circ}C$-73$0^{\circ}C$일 때 온도가 증가함에 따라 acceptor농도는 커졌으며, 그 이상에서는 감소하였다. 또한, 성장속도가 빠를수록 높은 acceptor 농도를 가지게 되어 3.3$\mu\textrm{m}$/hr의 성장속도일 때 8x1017/㎤의 가장 높은 acceptor 농도를 얻을수 있다.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2005년도 추계 학술대회
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• pp.35-39
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• 2005

Phosphor powders of zinc gal late added with Mg and rare-earth elements were prepared by sol id state reaction to improve luminescent properties. Green emitting $ZnMnGa_{2}O_{4}$ reached maximum intensity at Mn=0,005 mole$\%$ and further improvement was achieved by addition of $Mg^{2+}$. Tm, Mg-added zinc gallate phosphor exhibited a strong blue band emission, peaking at about 420 nm with the maximum intensity at the concentration of 0.003 mole$\%$ Mg and 0.015 mole$\%$ Tm. Deepening of the potential wells of the ground and excited states was suggested to be the cause for the enhancement in emission intensity at optimal doping of Mg and Tm.

• 센서학회지
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• 제5권5호
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• pp.79-84
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• 1996

$n^{+}$형 GaAs 기판위에 MBE로 $1\;{\mu}m$ 두께의 GaAs층과 AlAs층 및 GaAs cap 단결정층을 차례로 성장시켰다. AlAs/GaAs epi층을 $400^{\circ}C$에서 각각 2시간 및 3시간동안 $N_{2}$로 bubbled된 $H_{2}O$ 수증기(水蒸氣)($95^{\circ}C$)에서 산화시켰다. 산화시간에 따른 산화막의 XPS 분석결과, 작은 양의 $As_{2}O_{3}$ 및 AlAS 그리고 원소형 As들이 2시간동안 산화된 시편에서 발견되었다. 그러나 3시간동안 산화시킨 후에는, 2시간동안 산화시켰을 때 산화막내에 존재하던 소량의 As 산화물과 As 원자들은 발견되지 않았다. 따라서 As-grown된 AlAs/GaAs epi층은 3시간동안 $400^{\circ}C$의 산화온도에서 선택적으로 $Al_{2}O_{3}/GaAs$으로 변화되었다. 그러므로 산화온도 및 산화시간은 AlAs/GaAs 계면에서 결함이 없는 표면을 형성하고 기판쪽으로 산화가 진행되는 것을 멈추기 위해서는 매우 결정적으로 작용하는 것으로 조사되었다.

• 대한전자공학회논문지SD
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• 제45권11호
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• pp.21-28
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• 2008

본 논문에서는 단 채널 GaAs MESFET의 포화영역에서의 I-V 특성을 도출하기 위한 해석적 모델을 제안하였다. 기존의 단 채널 GaAs MESFET에 대한 해석이 채널 pinch-off의 개념이 도입되는 모델이었던 반면, 본 논문에서는 저자의 소도 포화 영역이 유한한 채널 폭을 갖으면서 전류 연속 조건을 만족하도록 공핍영역의 2차원 전위 분포 식을 도출하였다. 또한 소도 포화영역의 길이를 채널 전체 길이, 채널 도핑 농도, 게이트 전압 및 드레인 전압의 함수로 도출하여 포화영역에서의 Early 효과를 보다 합리적으로 설명할 수 있음을 보이고 있다.

• 전자공학회논문지A
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• 제30A권12호
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• pp.51-59
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• 1993

A 4${\times}10^{19}cm^{3}$ carbon-doped base AlGaAs/GaAs HBY was grown using carbontetracholoride(CCl$_4$) by atmospheric pressure MOCVD. Abruptness of emitter-base junction was characterized by SIMS(secondary ion mass spectorscopy) and the doping concentration of base layer was confirmed by DXRD(double crystal X-ray diffractometry). Mesa-type HBTs were fabricated using wet etching and lift-off technique. The base sheet resistance of R$_{sheet}$=550${\Omega}$/square was measured using TLM(transmission line model) method. The fabricated transistor achieved a collector-base junction breakdown voltage of BV$_{CBO}$=25V and a critical collector current density of J$_{O}$=40kA/cm$^2$ at V$_{CE}$=2V. The 50$\times$100$\mu$$^2$ emitter transistor showed a common emitter DC current gain of h$_{FE}$=30 at a collector current density of JS1CT=5kA/cm$^2$ and a base current ideality factor of ηS1EBT=1.4. The high frequency characterization of 5$\times$50$\mu$m$^2$ emitter transistor was carried out by on-wafer S-parameter measurement at 0.1~18.1GHz. Current gain cutoff frequency of f$_{T}$=27GHz and maximum oscillation frequency of f$_{max}$=16GHz were obtained from the measured Sparameter and device parameters of small-signal lumped-element equivalent network were extracted using Libra software. The fabricated HBT was proved to be useful to high speed and power spplications.

• Current Photovoltaic Research
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• 제3권1호
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• pp.21-26
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• 2015

High efficiency $Cu(In,Ga)Se_2$ solar cells are generally prepared above $500^{\circ}C$. Lowering the process temperature can allow wider selection of substrate material and process window. In this paper, the three-stage co-evaporation process widely used to grow CIGS thin film at high temperature was modified to reduce the maximum substrate temperature. Below $400^{\circ}C$ the CIGS films show poor crystal growth and lower solar cell performance, in spite of external Na doping by NaF. As a new approach, Cu source instead of Cu with Se in the second stage was applied on the $(In,Ga)_2Se_3$ precursor at $400^{\circ}C$ and achieved a better crystal growth. The distribution of Ga in the films produce by new method were investigated and solar cells were fabricated using these films.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.751-754
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• 2003

Metamorphic HEMTs (MHEMTs) have emerged as excellent challenges for the design and fabrication of high-speed HEMTs for millimeter-wave applications. Some of improvements result from improved mobility and larger conduction band discontinuity in the channel, leading to more efficient modulation doping, better confinement, and better device performance compared with pseudomorphic HEMTs. We have studied the calibration on the DC and RF characteristics of the MHEMT device using I $n_{0.53}$G $a_{0.47}$As/I $n_{0.52}$A1$_{0.48}$As modulation-doped heterostructure on the GaAs wafer. For the optimized device performance simulation, we calibrated the device performance of 0.1-${\mu}{\textrm}{m}$ $\Gamma$-gate MHEMT fabricated in our research center using the 2D ISE-DESSIS device simulator. With this calibrated parameter set, we have obtained very good reproducibility. The device simulation on the DC and RF characteristics exhibits good reproducibility for our 0.1-${\mu}{\textrm}{m}$ -gate MHEMT device compared with the measurements. We expect that our calibration result can help design over-100-GHz MHEMT devices for better device performance.ormance.