• 제목/요약/키워드: GID

검색결과 29건 처리시간 0.027초

Dietary Behavior and Food Intake of Korean Farmers in Relation to Farmers' Syndrome and Gastro-Intestinal Problem

  • Rhie, Seung-Gyo;Park, Yaungja
    • Journal of Community Nutrition
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    • 제1권1호
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    • pp.44-51
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    • 1999
  • The purpose of this study was to compare dietary behavior and food intake in relation to physical complaints, such as farmer' syndrome(FS) and gastro-intestinal(GI) problem among Korean farmers. The questionnaire was composed of 24 Cornell Medical Index (CMI), 8 farmers' syndrome, and 5 GI problem questions. Food intake data was gathered by the semi-quantitative food frequency method. The subjects(male 226, female 415) who had FS and Gi problem were 12./8% and 8.3%, respectively. The physical complaints were higher in female and the elderly group. In the FS group, lower activity was seen that in normal groups. The lower health status and fatigues were found in the physical complaint groups. Dietary behavior showed low appetite in the physical complaint group, irregular lunch in FS, and irregular breakfast in GI problem group. Changes in dietary behavior were shown in the aspects of lower amount of intake quantity(40.8%), lower consumption in fat(32.8%) and salty(38.8%) foods, and diverse food items(47.8%). Quantity of food consumed was significantly different withing groups with FS. Kinds of food consumed, intake of protein source foods, milk and calcium and total animal foods were lower in the FS group. But milk and calcium source food and all animal food intakes were higher in the GID problem group. The results suggest that dietary behavior and food intake differ within the group of physical complaints.

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PLD 기법으로 제조된 ${La_{0.67}}{A_{0.33}}{MnO_{3-\$delta}}$ (A=Ca, Sr, Ba) 박막의 결정구조 및 전기전도 특성 (Crystalline Structure and Electrical Transport Characteristics of ${La_{0.67}}{A_{0.33}}{MnO_{3-\$delta}}$ (A=Ca, Sr, Ba) Thin Films Prepared by PLD Techniques)

  • 조남희;임세주;성건용
    • 한국세라믹학회지
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    • 제38권4호
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    • pp.370-379
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    • 2001
  • PLD(pulsed laser deposition) 기법을 이용하여 LaAl $O_3$(100) 기판 위에 L $a_{0.67}$ $A_{0.33}$Mn $O_{3-{\delta}}$ (A=Ca, Sr, Ba) 에피 박막을 성장하였다. 박막의 격자 상수 및 스트레인 상태는 GID(grazing incidence X-ray diffraction)법과 투과 전자 현미경 법을 이용하여 조사하였다. 박막의 <001> 방향은 기판 표면의 수직방향에 평행하게 놓였으며, 박막의 단위포는 기판과의 격자 불일치에 기인하여 a/c=0.98인 의사-정방정 페롭스카이트(pseudo-tetragonal perovskite) 구조를 가졌다. A 자리의 양이온 반경이 증가함에 따라 단위포의 체적, $\varepsilon$$^{∥}$, 그리고 $\varepsilon$$_{⊥}$이 각각 증가하였다. L $a_{0.67}$ $A_{0.33}$Mn $O_{3-{\delta}}$ (A=Ca, Sr, Ba) 박막의 온도 및 자장에 따른 전기 전도 특성 MR(%), Tc, $T_{MI}$ 들을 조사하였으며, 이 결과들을 박막의 구조적 특성과 상관하여 고찰하였다.여 고찰하였다.

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CIM 기반의 실시간 전압안정도 해석 시스템 구축 (CIM-Based System For Real-Time Voltage Stability Analysis)

  • 이성우;장문종;서동완;남궁원
    • 조명전기설비학회논문지
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    • 제27권10호
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    • pp.41-49
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    • 2013
  • There is a wide variety of system and applications in the power system. However, they have compatibility issues because they use different data standard and communication method. With the introduction of the smart grid, power system has been grow and diversified. Therefore power system need to be compatible with each other and the interoperability between applications is increasingly important. Thus, the IEC established IEC61970 and CIM Standard data exchange model for interoperability and system integration. Server-Client system was constructed which using CIM HSDA(Part4), a standard communication model, presented in IEC 619710. Also, self-developed real-time voltage stability analysis application and contingency analysis application was used. CIM HSDA was used for data input and real-time analysis. Tolerance of result which is in the range of allowable derived by Perform real-time voltage stability and contingency analysis of Jeju power system, and then compare it's result with PSS/E result.

고신뢰성 광모듈을 위한 솔더 범프의 전단강도와 시효 특성 (Shear Strength and Aging Characteristics in Solder Bumps for High Reliability Optical Module)

  • 유정희
    • Journal of Welding and Joining
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    • 제21권2호
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    • pp.97-101
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    • 2003
  • The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

공통정보모델(CIM) 기반의 실시간 전압안정도 해석 (CIM-based System for Real-time Voltage Stability Analysis)

  • 이성우;장문종;서동완;남궁원;허성욱
    • 전기학회논문지
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    • 제64권1호
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    • pp.48-56
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    • 2015
  • There is a wide variety of system and applications in the power system. However, they have compatibility issues because they use different data standard and communication method. With the introduction of the smart grid, power system has been grow and diversified. Therefore power system need to be compatible with each other and the interoperability between applications is increasingly important. Thus, the IEC established IEC61970 and CIM Standard data exchange model for interoperability and system integration. Server-Client system was constructed which using CIM HSDA(Part4), a standard communication model, presented in IEC 619710. Also, self-developed real-time voltage stability analysis application and contingency analysis application was used. CIM HSDA was used for data input and real-time analysis. Tolerance of result which is in the range of allowable derived by Perform real-time voltage stability and contingency analysis of Jeju power system, and then compare it's result with PSS/E result.

차세대전동차 안전스텝 개발에 관한 연구 (A Study on Safety Step for Advanced Electric Multiple Unit)

  • 정의진;김길동;이기열;임봉채;박상규;이원대
    • 한국철도학회:학술대회논문집
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    • 한국철도학회 2010년도 춘계학술대회 논문집
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    • pp.475-480
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    • 2010
  • The safety step has been developed to ensure the passengers' safety including the disabled and the weak by eliminating gap between vehicle and platform. The type of safety step is divided according to the position that the safety step is installed. The type of safety step attached platform is the rubber type that is previously attached to a platform. The installed rubber can reduces the gap between vehicle and platform by a fixed distance. If the safety step is installed on the vehicle, it is possible to respond to the various platform typed such as straight or curved form. It is also flexible to the height of riding depends on number of passenger and platform conditions and does not require crew's additional operation. We have been developed vehicle attached safety step for advanced electric multiple unit. We hope to increase the use of safety step for the disabled and the weak to expand the convenience use of railway transportation system.

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Interlayer and Interfacial Exchange Coupling of IrMn Based MTJ

  • Wrona, J.;Stobiecki, T.;Czapkiewicz, M.;Kanak, J.;Rak, R.;Tsunoda, M.;Takahashi, M.
    • Journal of Magnetics
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    • 제9권2호
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    • pp.52-59
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    • 2004
  • As deposited and annealed MTJs with the structure of $Ta(5 nm)/Cu(10 nm)/Ta(5 nm)/Ni_{80}Fe_{20}(2 nm)/Cu(5 nm)/ Ir_{25}Mn_{75}(10 nm)/Co_{70}Fe_{30}(2.5 nm)/Al-O/Co_{70}Fe_{30}(2.5nm)/Ni_{80}Fe_{20}(t)/Ta(5nm)/Ni_{80}Fe_{20}(t)/Ta(5 nm)$, where t=10, 30, 60 and 100 nm were characterized by XRD and magnetic hysteresis loops measurements. The XRD measurements were done in grazing incidence $(GID scan-2{\theta})$ and ${\theta}-2{\theta}$ geometry, by rocking curve $(scan-{\omega})$ and pole figures in order to establish correlation between texture and crystallites size and magnetic parameters of exchange biased and interlayer coupling. The variations of shifting and coercivity field of free and pinned layers after annealing in $300^{\circ}C$ correlate with the improvement of [111] texture and grains size of $Ni_{80}Fe_{20}$ and $Ir_{25}Mn_{75}$ respectively. The exchange biased and the coercivity fields of the pinned layer linearly increased with increasing grain size of $Ir_{25}Mn_{75}$, The reciprocal proportionality between interlayer coupling and coercivity fields of the free layer and grain size of $Ni_{80}Fe_{20}$ was found. The enhancement of interlayer coupling between pinned and free layers, after annealing treatment, indicates on the correlated in-phase roughness of dipolar interacting interfaces due to increase of crystallites size of $Ni_{80}Fe_{20}$.

일방향응고 Ni기 초내열합금 천이액상화산접합부의 미세조직에 미치는 모재와 삽입금속 분말 혼합비의 영향 (The Mixing Ratio Effect of Insert Metal Powder and Insert Brazing Powder on Microstructure of the Region Brazed on DS Ni Base Super Alloy)

  • 예창호;이봉근;송우영;오인석;강정윤
    • Journal of Welding and Joining
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    • 제23권6호
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    • pp.99-105
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    • 2005
  • The mixing ratio effect of the GTD-111(base metal) powder and the GNI-3 (Ni-l4Cr-9.5Co-3.5Al-2.5B) powder on TLP(Transient Liquid Phase) bonding phenomena and mechanism was investigated. At the mixing ratio of the base metal powder under $50wt\%$, the base metal powders fully melted at the initial time and a large amount of the base metal near the bonded interlayer was dissolved by liquid inter metal. Liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B into the base metal. The solid phases in the bonded interlayer grew epitaxially from the base metal near the bonded interlayer inward the insert metal during the isothermal solidification. The number of grain boundaries farmed at the bonded interlayer corresponded with those of base metal. At the mixing ratio above $60wt\%$, the base metal powder melted only at the surface of the powder and the amount of the base metal dissolution was also less at the initial time. Nuclear of solids firmed not only from the base metal near the bonded interlayer but also from the remained base metal powder in the bonded interlayer. Finally, the polycrystal in the bonded interlayer was formed when the isothermal solidification finished. When the isothermal solidification was finished, the contents of the elements in the boned interlayer were approximately equal to those of the base metal. Cr-W borides and Cr-W-Ta-Ti borides formed in the base metal near the bonded interlayer. And these borides decreased with the increasing of holding time.

NA-Seq를 이용한 제주산 메밀의 발아초기 전사체 프로파일 분석 (Transcriptomic Profile Analysis of Jeju Buckwheat using RNA-Seq Data)

  • 한송이;정성진;오대주;정용환;김찬식;김재훈
    • 한국산학기술학회논문지
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    • 제19권1호
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    • pp.537-545
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    • 2018
  • 본 연구에서는 메밀의 발아초기에 발현되는 전사체의 다양한 정보 수집을 위해 양절메밀과 대관 3-3호의 RNA를 추출하여 전사체 분석을 수행하였다. 제주산 양절메밀과 대관3-3호의 종자 및 발아 후 12, 24, 36시간별로 total RNA를 추출하고, llumina Hiseq 2000 플랫폼을 사용하여 시퀀싱 하였다. SolexaQA package의 DynamicTrim과 LengthsORT 프로그램으로 이용하여 raw 데이터 분석을 실시한 후, 어셈블리(assembly)와 annotation을 수행하였다. RNA-seq raw 데이터로부터 약 84.2%, 81.5%에 해당하는 16.5Gb, 16.2Gb의 transcriptome 데이터를 확보하였다. 47Mb에 해당하는 43,494개의 대표적인 전사체(representative transcripts)를 확보하였고, 그 중에서 annotation DB와 서열 유사도를 갖는 서열은 23,165개로 확인되었다. 메밀의 representative transcripts 유전자의 유전자 온톨로지(gene ontology) 분석결과, biological process는 metabolic process (49.49%)에서, cellular components는 cell (46.12%)에서, molecular function은 catalyltic activity (80.43%)에서 유전자가 많이 분포되어 있는 것을 확인하였다. 종자의 발아에 관련된 gibberellin receptor GID1C의 경우에는 양절메밀, 대관 3-3호의 발현양이 모두 시간이 지남에 따라 증가되는 것을 확인할 수 있었으며, gibberellin 20-oxidase1의 경우에는 양절메밀에서는 발아 후 12 시간이내에 증가되었으나, 대관 3-3호에서는 36시간까지 유전자 발현양 증가하는 것을 확인할 수 있었다. 이러한 제주산 메밀의 발아초기 단계별 전사체 분석 데이터는 종간의 기능적, 형태학적 차이를 일으키는 메커니즘 규명에 도움을 줄 것으로 사료된다.