• Title/Summary/Keyword: GHZ interconnect

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Design and Implementation of 5G mmWave LTE-TDD HD Video Streaming System for USRP RIO SDR (USRP RIO SDR을 이용한 5G 밀리미터파 LTE-TDD HD 비디오 스트리밍 시스템 설계 및 구현)

  • Gwag, Gyoung-Hun;Shin, Bong-Deug;Park, Dong-Wook;Eo, Yun-Seong;Oh, Hyuk-Jun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.27 no.5
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    • pp.445-453
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    • 2016
  • This paper presents the implementation and design of the 1T-1R wireless HD video streaming systems over 28 GHz mmWave frequency using 3GPP LTE-TDD standard on NI USRP RIO SDR platform. The baseband of the system uses USRP RIO that are stored in Xilinx Kintex-7 chip to implement LTE-TDD transceiver modem, the signal that are transceived from USRP RIO up or down converts to 28 GHz by using self-designed 28 GHz RF transceiver modules and it is finally communicated HD video data through self-designed $4{\times}8$ sub array antennas. It is that communication method between USRP RIO and Host PC use PCI express ${\times}4$ to minimize delay of data to transmit and receive. The implemented system show high error vector magnitude performance above 25.85 dBc and to transceive HD video in experiment environment anywhere.

A 30 GHz Band Low Noise for Satellite Communications Payload using MMIC Circuits (MMIC 회로를 이용한 위성중계기용 30GHz대 저잡음증폭기 모듈 개발)

  • 염인복;김정환
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.11 no.5
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    • pp.796-805
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    • 2000
  • A 30GHz band low noise amplifier module, which has linear gain of 30dB and noise figure of 2.6dB, for 30GHz satellite communication transponder was developed by use of MMIC and thin film MIC technologies. Two kinds of MMIC circuits were used for the low noise amplifier module, the first one is ultra low noise MMIC circuit and the other is wideband and high gain MMIC circuit. The pHEMT technology with 0.15$mu extrm{m}$ of gate length was applied for MMIC fabrication. Thin film microstrip lines on alumina substrate were used to interconnect two MMIC chips, and the thick film bias circuit board were developed to provide the stabilized DC bias. The input interface of the low noise amplifier module was designed with waveguide type to receive the signal from antenna directly, and the output port was adopted with K-type coaxial connector for interface with the frequency converter module behind the low noise amplifier module. Space qualified manufacturing processes were applied to manufacture and assemble the low noise amplifier module, and space qualification level of environment tests including thermal and vibration test were performed for it. The developed low noise amplifier was measured to show 30dB of minimum gain, $\pm$0.3dB of gain flatness, and 2.6dB of maximum noise figure over the desired operating frequency range from 30 to 31 GHz.

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Multichannel Transimpedance Amplifier Away in a $0.35\mu m$ CMOS Technology for Optical Communication Applications (광통신용 다채널 CMOS 차동 전치증폭기 어레이)

  • Heo Tae-Kwan;Cho Sang-Bock;Park Min Park
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.42 no.8 s.338
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    • pp.53-60
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    • 2005
  • Recently, sub-micron CMOS technologies have taken the place of III-V materials in a number of areas in integrated circuit designs, in particular even for the applications of gjgabit optical communication applications due to its low cost, high integration level, low power dissipation, and short turn-around time characteristics. In this paper, a four-channel transimpedance amplifier (TIA) array is realized in a standard 0.35mm CMOS technology Each channel includes an optical PIN photodiode and a TIA incorporating the fully differential regulated cascode (RGC) input configuration to achieve effectively enhanced transconductance(gm) and also exploiting the inductive peaking technique to extend the bandwidth. Post-layout simulations show that each TIA demonstrates the mid-band transimpedance gain of 59.3dBW, the -3dB bandwidth of 2.45GHz for 0.5pF photodiode capacitance, and the average noise current spectral density of 18.4pA/sqrt(Hz). The TIA array dissipates 92mw p in total from a single 3.3V supply The four-channel RGC TIA array is suitable for low-power, high-speed optical interconnect applications.