• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.65-74
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• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.

• Journal of Yeungnam Medical Science
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• v.2 no.1
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• pp.175-181
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• 1985

Agrobacterium tumefaciens induces cancerous growths called crown galls at wound sites on dicotyledonous plants. A large plasmid called Ti plasmid is responsible for virulence. Upon tumor induction, part of the plasmid, termed T-DNA, becomes integrated into plant genome and its genetic sequences are expressed. These properties allow Ti plasmids to be used as gene vectors in plants. Several in vitro methods for the transfer of Ti plasmid into plant cell have been developed. One of them is the treatment of bacterial spheroplasts and plant protoplasts mixture with polyethylene glycol that is generally used as fusogen in cell-to-cell fusion. Several workers investigated the interaction of bacterial spheroplasts with plant protoplasts in the presence of polyethylene glycol and suggested that the interaction is not fusion but endocytosis. In this report we observed the interaction of Agrobacterium tumefaciens spheroplasts with Nicotiana tabacum protoplasts by electron microscope. Agrobacterium tumefaciens spheroplasts and Nicotiana tabacum protoplasts were prepared and mixed in the presence of polyethylene glycol and high pH-high $Ca^{2+}$ buffer. Then the interaction of the spheroplasts with the protoplasts was examined by transmission electron microscope. After the treatment of polyethylene glycol the spheroplasts adhered to the surface of the protoplasts and then they were engulfed by the protoplasts. After the high pH-high $Ca^{2+}$ buffer treatment the engulfed spheroplasts lost their cell integrity. No fusion process was observed. Thus all these observations suggest that the introduction process of Agrobacterium tumefaciens spheroplasts into Nicotiana tabacum protoplasts with the aid of polyethylene glycol is endocytosis.

• International Journal of Advanced Culture Technology
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• v.5 no.1
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• pp.58-63
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• 2017

Emergencies and disasters can happen any time without any warning, and things can change and escalate very quickly, and often it is swift and decisive actions that make all the difference. It is a responsibility of the building facility management to ensure that a proven evacuation plan in place to cover various worst scenario to handled automatically inside the facility. To mapping out optimal safe escape routes is a straightforward undertaking, but does not necessarily guarantee residents the highest level of protection. The emergency evacuation navigation approach is a state-of-the-art that designed to evacuate human livings during an emergencies based on real-time decisions using live sensory data with pre-defined optimum path finding algorithm. The poor decision on causalities and guidance may apparently end the evacuation process and cannot then be remedied. This paper propose a cloud connected emergency evacuation system model to react dynamically to changes in the environment in emergency for safest emergency evacuation using IoT based emergency exit sign system. In the previous researches shows that the performance of optimal routing algorithms for evacuation purposes are more sensitive to the initial distribution of evacuees, the occupancy levels, and the type and level of emergency situations. The heuristic-based evacuees routing algorithms have a problem with the choice of certain parameters which causes evacuation process in real-time. Therefore, this paper proposes an evacuee routing algorithm that optimizes evacuation by making using high computational power of cloud servers. The proposed algorithm is evaluated via a cloud-based simulator with different "simulated casualties" are then re-routed using a Dijkstra's algorithm to obtain new safe emergency evacuation paths against guiding evacuees with a predetermined routing algorithm for them to emergency exits. The performance of proposed approach can be iterated as long as corrective action is still possible and give safe evacuation paths and dynamically configure the emergency exit signs to react for real-time instantaneous safe evacuation guidance.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.5
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• pp.623-629
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• 2018

Smart Factory is a concept of automatic production system of machines by the fusion of ICT and manufacturing. As a base technology for realizing such a smart factory, there is an increasing interest in a low-power environmentally friendly LED lighting system, and researches on so-called optical ID related application technologies such as communication using a LED and position recognition are actively underway. In this paper, We have proposed a system that can reliably identify logistics location and additional information without being affected by electromagnetic interference such as high voltage, high current, and generator in the plant. Through the basic experiment, we confirmed the applicability of the color ID recognition rate from 98.8% to 93.8% according to the eight color variations in the short distance.

• KIPS Transactions on Software and Data Engineering
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• v.12 no.9
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• pp.407-418
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• 2023

The Multi-Object Goal Visual Navigation(MultiOn) is a visual navigation task in which an agent must visit to multiple object goals in an unknown indoor environment in a given order. Existing models for the MultiOn task suffer from the limitation that they cannot utilize an integrated view of multimodal context because use only a unimodal context map. To overcome this limitation, in this paper, we propose a novel deep neural network-based agent model for MultiOn task. The proposed model, MCFMO, uses a multimodal context map, containing visual appearance features, semantic features of environmental objects, and goal object features. Moreover, the proposed model effectively fuses these three heterogeneous features into a global multimodal context map by using a point-wise convolutional neural network module. Lastly, the proposed model adopts an auxiliary task learning module to predict the observation status, goal direction and the goal distance, which can guide to learn the navigational policy efficiently. Conducting various quantitative and qualitative experiments using the Habitat-Matterport3D simulation environment and scene dataset, we demonstrate the superiority of the proposed model.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2005.04a
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• pp.55-62
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• 2005

In this paper, a CAB/CAE integrated optimal design system is developed, in which design and analysis process is automated using CAD/CAE softwares, for a complicated model for which parametric modeling provided by CAD software is not possible. CAD modeling process is automated by using UG/OPEN API function and UG/Knowledge Fusion provided by Unigraphics. The generated model is transferred to the analysis code ANSYS in parasolid format. Visual DOC software is used for optimization. The system is developed for PLS(Plasma Lighting System), which is a next generation illumination system that is used to illuminate stadium or outdoor advertizing panel. The PLS system consists of more then 20 components, which requires a lot of human efforts in modeling and analysis. The analysis for PLS includes static load, wind load and impact load analysis. As a result of analysis, it is found that the most critical component is a tilt assembly, which links lower & upper body assembly. For more reliable analysis, experiment is conducted using MTS and compared with the Finite element analysis result. The objective in the optimization is to minimize the material volume under allowable stresses. The design variables are three parameters in the tilt assembly that are chosen to be the most sensitive in stress values of twelve parameters. Gradient based method and RSM(Response Surface Method) are used for the algorithm and the results are compared. As a result of optimization, the maximum stress is reduced by 57%.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.323-330
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• 2005

We fabricate PIN PD (Positive Intrinsic Negative Photo-Diode) for CWDM optical repeater and optical transmission system, and analyze theoretically the characteristics to verify the capability of device fabricated. Furthermore, we integrate CWDM filter into PD package to enhance the cost and the performance when compared to the conventional system, in which CWDM filter and PD package are linked by optical fusion splicing. The integrated CWDM PD is fabricated by three steps as follows: CWDM filter design, PD packaging, and product assembly and test. The results of measurement for PD fabricated reveal 0.5 dB bandwidth of 17 nm, isolation over 60 dB at transmission port and over 20 dB at reflection port. Also, the IMD3 for wireless communication is over 63 dBc, and the responsivity of PD presents over 0.9 A/W for 20 samples of the total 23 PD. The total insertion loss reduces about 0.4${\~}$0.7 dB due to the integrated assembly of CWDM and PD.

• Korean Chemical Engineering Research
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• v.44 no.1
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• pp.1-9
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• 2006

Biodevices composed of biomolecular layer by mimicking the natural functions of cells and the interaction mechanisms of the constituted biomolecules have been developed in various industrial fields such as medical diagnosis, drug screening, electronic device, bioprocess, and environmental pollution detection. To construct biodevices such as bioelectronic devices (biomolecular diode, bio-information storage device and bioelectroluminescence device), protein chip, DNA chip, and cell chip, biomolecules including DNA, protein, and cells have been used. Fusion technology consisting of immobilization technology of biomolecules, micro/nano-scale patterning, detection technology, and MEMs technology has been used to construct the biodevices. Recently, nanotechnology has been applied to construct nano-biodevices. In this paper, the current technology status of biodevice including its fabrication technology and applications is described and the future development direction is proposed.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.25 no.11
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• pp.1463-1470
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• 2021

With the development of ICT technology, a monitoring system to check the status of an object to be managed in real time in various industrial fields is widely used. Existing monitoring systems implemented individual systems according to monitoring targets, but recently, monitoring systems have been implemented using open sources such as Prometheus and Grafana. When using Prometheus and Grafana, many parts become more convenient compared to the existing monitoring system development method, but there are still problems. In this paper, to solve this problem, we propose an integrated monitoring system that supports Prometheus and Grafana. The proposed system is a detailed module that collects, stores, visualizes, and manages data to be monitored, and each module is implemented so that roles can be divided and existing problems can be solved. The proposed system can conveniently manage and monitor monitoring targets stored in heterogeneous databases, and create dashboards through simple operation.