• Title/Summary/Keyword: Functional packaging materials

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Comparison of Environmental Evaluation for Paper and Plastic Based Mask Packaging (종이 기반과 플라스틱 기반 보건마스크 패키징의 환경영향 비교)

  • Dongho Kang;Youjin Go;Sanghoon Oh;Gohyun Choo;Jisoo Jang;Junhyuk Lee;Jinkie Shim
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.30 no.1
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    • pp.73-83
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    • 2024
  • In this study, environmental evaluation of high barrier coated paper (coating layer/paper) packaging is conducted in comparison with conventional aluminum laminated (PET/VMPET/LLDPE) plastic packaging. The target product for this packaging is a KF94 mask, which requires a high barrier of water and oxygen to maintain the filtration ability of the mask filter. The functional unit of this study is 10,000 mask packaging materials based on a material capable of blocking oxygen (<1 g/m2day) and moisture (<3 g/m2day) for the preservation of KF94 masks. In order to understand the results easily, paper-based mask packaging system divided into 6 stages (pulp, pulping & paper making, calendaring & coating, printing, packing and waste management), while plastic-based mask packaging consists of 5 stages (material production, processing, printing, packing, waste management) In case of paper-based mask packaging, most contributing stage is calendaring & coating, resulting from heat and electricity production. On the other hand, plastic-based mask packaging is contributed more than 30% by material production, specifically due to linear low density polyethylene and purified terephthalic acid production. The comparison results show that global warming potential of paper-based mask packaging has 32% lower than that of plastic-based mask packaging. Most of other impact indicators revealed in similar trend.

Development of Sustainable Packaging Materials Using Coffee Silverskin and Spent Coffee Grounds: A Comprehensive Review (커피 은피와 커피찌꺼기를 활용한 지속가능한 포장소재 개발을 위한 연구동향)

  • Jihyeon Hwang;Dowan Kim
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.30 no.1
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    • pp.1-14
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    • 2024
  • As awareness of environmental issues continues to grow, there is an escalating demand for recycling and repurposing byproducts of agricultural and food production processes and their conversion to high-value products. Coffee is the most widely consumed beverage globally; during coffee beverage processing and consumption, byproducts such as coffee silverskin (CS), spent coffee grounds (SCGs), and oil are generated. Despite containing beneficial materials such as cellulose, hemicellulose, lignin, lipids, and bioactive substances, these byproducts are typically discarded in landfills or incinerated. The utilization of CS, SCGs, and oil in the development of packaging materials holds significant potentials toward the realization of a sustainable society. To this end, considerable research efforts have been dedicated to the development of high-value materials derived from coffee byproducts, including functional fillers, polymer composites, and biodegradable polymers. Notably, CS and SCGs have been employed as functional fillers in polymer composites. Additionally, lipids extracted from SCGs have been used as plasticizers for polymers and cultured with microorganisms to produce biodegradable polymers. This review focuses on the research and development of polymer/CS and polymer/SCG composites as well as cellulose extraction and utilization from CS and SCGs and its applications, oil extraction from SCGs, and cultivation with microorganisms using extracted oil for polyhydroxyalkanoates(PHA) production.

A Survey on the Consumer Preferences for Korean Rice Cake Packaging in the Seoul Metropolitan Area (떡 포장 개선을 위한 국내 수도권 지역 소비자의 기호도 조사)

  • Choi, Woo-Suk;Park, Sang-Kyu;Lee, Youn-Suk
    • Journal of the Korean Society of Food Science and Nutrition
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    • v.41 no.3
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    • pp.418-429
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    • 2012
  • In this study we surveyed the packaging preferences of consumers for Korean rice cakes as current commercial products in Korea. The questionnaire was developed from a preliminary investigation of typical rice cake packaging patterns and sent to 2332 residents in Korea by random sampling mail. The questionnaire contained questions on the preferences of interior design in packaging, opening methods, individually separated types, printing position, packaging methods, and packaging materials such as paper and plastic. There were responses from 304 residents. The collected data was analyzed by an SPSS package program. Most of the packaging used for Korean rice cakes was plastic (58.9%) which was used for packaging materials and stretch wrap (42.9%) as packing methods. The results showed the preference was the perforated line type used by hand for opening a packaging and interior packaging design with 2~3 partitions. Most respondents expressed an interest in using individual packaging and having printing directly on the packaging. Also, the respondents preferred the packaging design that let them see the contents of a package. Based on the results of the questionnaire, this paper suggested that most consumers would prefer to choose a packaging system with a partition design in a plastic container, individually separated products, and a transparent container for Korean rice cakes. The results of packaging preferences could provide important information for suitable packaging development for Korean rice cakes. Further research should be conducted to improve the shelf life of Korean rice cakes with functional packaging systems such as modified atmosphere packaging or anti-microbial packaging.

A Study on the antibiotic properties of plastic containers templated with antibiotic functional information (항균기능정보가 각인된 플라스틱 저장용기의 항균 특성에 관한 연구)

  • Bahng, Gun-Woong;Kim, Kang-Nyung;Kim, Hee-Jung
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.5 no.2
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    • pp.31-37
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    • 1999
  • To enhance antibiotic function of plastic containers, many methods have been applied. Most of the methods utilize antibiotic properties of antibiotic substances such as silver containing chemicals. Sometimes antibiotic substances are used without long term stability test as food container additives. Basically, this kind of methods is not safe since it is based on the antibiotic properties of the material itself and hence direct contact between food and container additives is unavoidable to obtain antibiotic effect. In this paper, a new concept of information templation was applied to make food containers with antibiotic function. It has been known recently that water memorize informations and this information could be tempelated to other materials through appropriate methods. One of the participating company developed this method to template informations onto plastic materials. Food containers were produced using this plastic chips and experimental results showed that antibiotic functional information temptation method is effective for practical application. Results and discussions are reported in this paper.

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Heat Dissipation Trends in Semiconductors and Electronic Packaging (반도체 및 전자패키지의 방열기술 동향)

  • S.H. Moon;K.S. Choi;Y.S. Eom;H.G. Yun;J.H. Joo;G.M. Choi;J.H. Shin
    • Electronics and Telecommunications Trends
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    • v.38 no.6
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    • pp.41-51
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    • 2023
  • Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

Enhancement of Oxygen and Moisture Permeability with Illite-Containing Polyethylene Film

  • Seong, Dong Min;Lee, Hyesun;Chang, Jeong Ho
    • Journal of the Korean Ceramic Society
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    • v.56 no.6
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    • pp.601-605
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    • 2019
  • This work reports the preparation of ceramic hybrid films with illite-polyethylene composites analyzed as a function of concentration of added illite in polyethylene. The enhancement of oxygen and water-vapor transmission rate of illite-polyethylene film was evaluated to determine its influence on the freshness in fruit packaging. Particle size of illite materials was controlled in the range of 1~10 ㎛ and then mixed with LDPE to form the masterbatch. Ceramic hybrid films were prepared through a blown film making process. To determine the dispersity and abundancy of illite materials in the polyethylene matrix, various characterizations of illite-PE hybrid masterbatch and films were performed using SEM, TGA, and FT-IR. The oxygen and water-vapor transmission rate of illite-polyethylene film was found to be two times higher than that of LDPE film.

Protein-based bio-plastics: formulation, processing, properties and applications

  • Guilbert Stephane;Gontard Nathalie;Morel Marie Helene
    • Proceedings of the Polymer Society of Korea Conference
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    • 2006.10a
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    • pp.357-357
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    • 2006
  • Many industrial sources of proteins can be used as raw materials to produce films, molded materials, and various hollow items either by "casting" techniques or by "thermoplastic processing". Combining proteins with natural fibbers, paper or biodegradable polyesters is very promising to form biodegradable composites witch take advantage of the barrier and mechanical properties of each component. Using nano-fillers to form nanocomposites has also been shown to be interesting to improve properties. Production, with low transformation cost, of protein based materials to form biodegradable materials with controlled functional properties for food uses, medical uses, packaging, agriculture, controlled release systems, etc. is discussed.

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Quality Changes in Mushrooms (Agaricus bisporus) due to Their Packaging Materials during Their Storage (포장재에 따른 양송이버섯의 저장 중 품질변화)

  • Lee, Da-Uhm;Chang, Min-Sun;Cho, Sun-Duk;Jhune, Chang-Sung;Kim, Gun-Hee
    • Food Science and Preservation
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    • v.20 no.1
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    • pp.7-13
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    • 2013
  • Mushrooms have a shorter shelf-life than most vegetables because of their very high respiration rates, sensitivity to enzymatic browning and susceptibility to microbial spoilage. This study was conducted to investigate effects of various packaging materials and precooling on the quality of mushrooms (Agaricus bisporus). Mushrooms were precooled at $4^{\circ}C$ for three hours and packaged using the following packaging materials; 1) polyethylene (PE) film bags of 0.03 mm thickness, 2) polypropylene (PP) film bags of 0.03 mm thickness, and 3) polystyrene (PS) tray+polyvinyl chloride (PVC) wrapper. The physiological changes (weight loss, gas composition, color, firmness, and sensory evaluation) associated with postharvest deterioration were monitored for 17 days at $10^{\circ}C$. The results showed that the PP film bag maintained quality of mushrooms most effectively, especially PP film bags inhibited decreasing firmness. The samples also exhibited smaller decreases in weight loss rate (0.57%) and Hunter L value (84.44) than PS tray+PVC wrapper (7.73%, 82.19) and PE film bags (0.89%, 82.96). Sensory evaluation level in all samples remained relatively constant during the first 5 days of storage. However, PE film bags and PS tray+PVC wrapper showed lower score of flavor, texture and color than PP film bags after 8 days of storage. This study suggested that PP film bag packaging effectively extends shelf-life of mushrooms during storage.

Thickness Effect of Double Layered Sheet on Burr Formation during Micro-Via Hole Punching Process (미세 비아홀 펀칭 공정 중 이종 재료 두께에 따른 버 생성)

  • 신승용;임성한;주병윤;오수익
    • Transactions of Materials Processing
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    • v.13 no.1
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    • pp.65-71
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    • 2004
  • Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging (3D 웨이퍼 전자접합을 위한 관통 비아홀의 충전 기술 동향)

  • Ko, Young-Ki;Ko, Yong-Ho;Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.32 no.3
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    • pp.19-26
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    • 2014
  • Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.