• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2002년도 춘계학술발표회 초록집
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• pp.46-46
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• 2002

It is well known that thin film growth and surface morphology can be substantially modified by ion-bombardment during the deposition. This is particularly important in case of thin-film deposition at low temperatures where the film growth occurs under highly nonequilibrium conditions. An attractive way to promote crystalline growth and surface morphology is deposition of additional energy in to the surface of the growing film by bombardment with hyperthermal particles. We were deposited crystalline Ti and TiN thin films on Si substrate by magnetron sputtering method with grid. Its thin films were highly smoothed and dense as increasing grid bias. In order explore the benefits of a bombardment of the growing film with high energetic particles. Ti and TiN films were deposited on Si substrates by an unbalanced magnetron sputter source with attached grid assembly for energetic ion extraction. Also, we have studied the variation of the plasma states by Langmuir probe and Optical Emission Spectroscopy (OES). The epitaxial orientation. microstructual characteristics. electrical and surface properties of the films were analyzed by XRD. SEM. Four point probe and AFM.

• 한국재료학회지
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• 제16권9호
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• pp.564-570
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• 2006

Silicides have been required to be below 40 nm-thick and to have low contact resistance without agglomeration at high silicidation temperature. We fabricated composite silicide layers on the wafers from Ni(20 nm)/Co(20 nm)/poly-Si(70 nm) structure by rapid thermal annealing of $700{\sim}1100^{\circ}C$ for 40 seconds. The sheet resistance, surface composition, cross-sectional microstructure, and surface roughness were investigated by a four point probe, a X-ray diffractometer, an Auger electron spectroscopy, a field emission scanning electron microscope, and a scanning probe microscope, respectively. The sheet resistance increased abruptly while thickness decreased as silicidation temperature increased. We propose that the fast metal diffusion along the silicon grain boundary lead to the poly silicon mixing and inversion. Our results imply that we may consider the serious thermal instability in designing and process for the sub-0.1 um CMOS devices.

• 한국재료학회지
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• 제18권1호
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• pp.5-11
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• 2008

Thermally evaporated 10 nm-Ni/1 nm-Au/(30 nm-poly)Si structures were fabricated in order to investigate the thermal stability of Au-inserted nickel silicide. The silicide samples underwent rapid thermal annealing at $300{\sim}1100^{\circ}C$ for 40 seconds. The sheet resistance was measured using a four-point probe. A scanning electron microscope and a transmission electron microscope were used to determine the cross-sectional structure and surface image. High-resolution X-ray diffraction and a scanning probe microscope were employed for the phase and surface roughness. According to sheet resistance and XRD analyses, nickel silicide with Au had no effect on widening the NiSi stabilization temperature region. Au-inserted nickel silicide on a single crystal silicon substrate showed nano-dots due to the preferred growth and a self-arranged agglomerate nano phase due to agglomeration. It was possible to tune the characteristic size of the agglomerate phase with silicidation temperatures. The nano-thick Au-insertion was shown to lead to self-arranged microstructures of nickel silicide.

• 대한화학회지
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• 제58권5호
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• pp.456-462
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• 2014

(+)-Camphorsulfonic acid (CSA)와 hydrochloric acid (HCl)로 binary 도핑된 키랄 polyaniline (PAni)을 중합온도 $0^{\circ}C$와 상온(RT)에서 전기화학적 중합법으로 합성하였다. 순환전압전류 곡선, FT-IR과 circular dichroism spectra로부터 PAni는 각각 (+)-CSA와 HCl로 single 도핑된 PAni 혼합물이 아닌, binary 도핑된 키랄 PAni임을 확인하였다. 중합온도가 전기화학적 거동과 도핑레벨에 영향을 주었고, 이에 따라서 PAni의 결정성과 모폴로지가 변화되는 것을 확인하였다. 중합온도가 $0^{\circ}C$에서 RT로 상승됨에 따라 키랄PAni의 모폴로지가 fibrous에서 short-fibrous구조로 변화되었다. ITO 위에 적층된 PAni필름의 면저항을 4-point probe 법으로 측정하였다.

• 한국재료학회지
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• 제1권1호
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• pp.17-22
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• 1991

불순물이 주입된 실리콘 기판에 500 두께의 탄탈륨 박막을 증착한 후 실리사이드를 형성시키기 위해 아르곤 분위기에서 급속열처리(RTA)률 하였다. 형성된 $TaSi_2$와 불순물의 거동은 XRD, SEM, 4-point probe, HP4145와 SIMS로 조사하였다. 불순물의 종류에 관계없이 $TaSi_2$는 RTA 온도가 $800^{\circ}C$일때 형성되기 시작하였으며 $1000^{\circ}C$이상에서 증착된 Ta가 전부 $TaSi_2$로 상 전이가 일어났다. 또한 $TaSi_2/P^+$영역에 대한 접촉저항간은 contact size가 $0.9{\times}0.9({\mu}{m^2}$)일때 $22{\Omega}$ 낮은값을 가졌으며 이온 주입된 불순물은 RTA처리시 형성된 $TaSi_2$층으로 out-diffusion이 일어났다.

• 한국재료학회지
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• 제1권4호
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• pp.191-197
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• 1991

Composite $TiSi_{2.6}$ target으로 부터 Ti-silicide를 형성시 단결정 Si기판과 다결정 Si내의 dopant의 확산 거동, 그리고 Ti-silicide 박막의 표면 거칠기를 secondary ion mass spectrometry (SIMS), 4-point probe, X-선 회절 분석, 표면 거칠기 측정을 통해 조사하였다. X-선 회절 분석결과 중착된 직후의 중착막은 비정질이었고, 단결정 Si기판에 증착된 막은 $800^{\circ}C$에서 20초간 급속 열처리 시 orthorhombic $TiSi_2$(C54 구조)로 결정화가 이루어졌다. 단결정 Si 기판과 다결정 Si에서 Ti-silicide 충으로의 dopant의내부 확산은 거의 발생하지 않았으며, 주입된 불순물들은 Ti-silicide/Si 계면 근처의 단결정 Si이나 다결정 Si 내부에 존재하고 있었다. 또한 형성된 Ti-silicide 박막의 표면 거칠기는 16-22nm이었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1806-1808
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• 1999

The electrical and physical characteristics of MgO and Pt thin-films on Si substrate, deposited by r.f magnetron sputtering. It were analyzed with annealing condition($1000^{\circ}C$ for 120 min) by four point probe, a-step, SEM and XRD. Until $1000^{\circ}C$ of annealing temperature, MgO medium layer had the properties of improving Pt adhesion to $SiO_2$ and insulation without chemical reaction to Pt thin-films and the resistivity of Pt thin-films was improved. In the analysis of properties of Pt-RTD, TCR value had $3927ppm/^{\circ}C$ and liner in the temperature range of room temperature ${\sim}400^{\circ}C$.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권1호
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• pp.8-12
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• 2005

Indium tin oxide(ITO) surface treated by Oxygen plasma has been in situ analyzed using XPS(X-ray Photoelectron Spectroscopy) and EDS(Energy Dispersive Spectroscopy), to investigate the relations between the properties of the ITO surface and the properties of OLED(Organic Light Emitting Diode). We measured electrical resistivity using Four-Point-Probe and calculated sheet resistance, and ITO surface roughness was measured by AFM(Atomic Force Microscope). We fabricated OLED using substrate that was treated optimum ITO surface. The plasma treatment of the ITO surface lowered the operating voltage of the OLED. We have obtained an improvement of luminance and decrease of turn-on voltage.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.120-120
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• 2009

Ga doped ZnO (GZO) transparent conductive films were deposited on the glass substrates at room temperature by facing target sputtering (FTS) method. The sputtering targets were 100 mm diameter disks of GZO($Ga_2O_3$ 3.w.t%) and Zn metal. The GZO thin films were deposited as a various $PO_2$ (oxygen gas content). Base pressure was $2{\times}10^{-6}torr$, and a working pressure was 1mTorr. The properties of thin films on the electrical and optical properties of the deposited films were investigated by using a four-point probe (Chang-min), a Hall Effect measurement (Ecopia) and an UV/VIS spectrometer (HP). The minimum resistivity of film was $6.5{\times}10^{-4}[{\Omega}-cm]$ and the average transmittance of over 80% was seen in the visible range

• 대한전기학회논문지
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• 제40권6호
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• pp.590-597
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• 1991

Ion reflective index and sheet resistance in the silicon oblique range smaller than 8 degree and optimization of annealing temperature have been studied. A four point probe was used to obtain the sheet resistance after annealing, while high resolution SIMS was used to determine the Boron and Fluorine atomic profiles before and after annealing. Experimental results and theory of ion reflective index are compared. Ion reflective index was found to decrease according to increasing an ion oblique angle. We introduce a simple analytical model ion reflection, concidering the Rutherford scattering model. This result can not be explained by the conventional Gaussian model.