• Membrane and Water Treatment
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• v.9 no.3
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• pp.163-172
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• 2018

This study investigated the effect of organic matter on the precipitation of struvite and calcium phosphate for phosphorus recovery from synthetic dairy wastewater. Batch precipitation experiments were performed to precipitate phosphorus from solutions containing $PO_4{^{3-}}$ and $NH_4{^+}$ by the addition of $Mg^{2+}$ and $Ca^{2+}$, separately, at varying pH, Mg/P and Ca/P molar ratios, and organic matter concentrations. Soluble total organic solids exhibited more inhibition to precipitation due to potential interaction with other dissolved ionic species involved in phosphorus precipitation. Xylan with low total acidity only exhibited significant inhibition at very high concentrations in synthetic wastewater (at up to 100 g/L). No significant inhibition was observed for Mg and Ca precipitation at relatively lower concentrations (at up to 1.2 g/L). MINTEQ simulations show that dissolved organic matter (DOM) as humic substances (HS) can cause significant inhibition even at relatively low concentrations of 0.165 g/L fulvic acid. However, scanning electron microscopy (SEM) and X-ray diffraction (XRD) analysis suggested that xylan altered the crystal structure of both precipitates and had caused the formation of smaller sized struvite crystals with slightly rougher surfaces This could be due to xylan molecules adhering on the surface of the crystal potentially blocking active sites and limit further crystal growth. Smaller particle sizes will have negative practical impact because of poorer settleability.

• Korean Journal of Materials Research
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• v.24 no.10
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• pp.550-555
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• 2014

The present study deals with the effects of tempering treatment on the microstructure and mechanical properties of Cu-bearing high-strength steels. Three kinds of steel specimens with different levels of Cu content were fabricated by controlled rolling and accelerated cooling, ; some of these steel specimen were tempered at temperatures ranging from $350^{\circ}C$ to $650^{\circ}C$ for 30 min. Hardness, tensile, and Charpy impact tests were conducted in order to investigate the relationship of microstructure and mechanical properties. The hardness of the Cu-added specimens is much higher than that of Cu-free specimen, presumably due to the enhanced solid solution hardening and precipitation hardening, result from the formation of very-fine Cu precipitates. Tensile test results indicated that the yield strength increased and then slightly decreased, while the tensile strength gradually decreased with increasing tempering temperature. On the other hand, the energy absorbed at room and lower temperatures remarkably increased after tempering at $350^{\circ}C$; and after this, the energy absorbed then did not change much. Suitable tempering treatment remarkably improved both the strength and the impact toughness. In the 1.5 Cu steel specimen tempered at $550^{\circ}C$, the yield strength reached 1.2 GPa and the absorbed energy at $-20^{\circ}C$ showed a level above 200 J, which was the best combination of high strength and good toughness.

• Korean Journal of Materials Research
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• v.16 no.4
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• pp.257-263
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• 2006

We have investigated the effect of silver added to Cu films on the microstructure evolution, resistivity, surface morphology, stress relaxation temperature, and adhesion properties of Cu(Ag) alloy thin films deposited on Mo glue layer upon annealing. In addition, pure Cu films deposited on Mo has been annealed and compared. The results show that the silver in Cu(Ag) thin films control the grain growth through the coarsening of its precipitates upon annealing at $300^{\circ}C{\sim}600^{\circ}C$ and the grain growth of Cu reveals the activation energy of 0.22 eV, approximately one third of activation energy for diffusion of Ag dopant along the grain boundaries in Cu matrix (0.75 eV). This indicates that the grain growth can be controlled by Ag diffusion along the grain boundaries. In addition, the grain growth can be a major contributor to the decreased resistivity of Cu(Ag) alloy thin films at the temperature of $300^{\circ}C{\sim}500^{\circ}C$, and decreases the resistivity of Cu(Ag) thin films to $1.96{\mu}{\Omega}-cm$ after annealing at $600^{\circ}C$. Furthermore, the addition of Ag increases the stress relaxation temperature of Cu(Ag) thin films, and thus leading to the enhanced resistance to the void formation, which starts at $300^{\circ}C$ in the pure Cu thin films. Moreover, Cu(Ag) thin films shows the increased adhesion properties, possibly resulting from the Ag segregating to the interface. Consequently, the Cu(Ag) thin films can be used as a metallization of advanced TFT-LCDs.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.16 no.2
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• pp.76-81
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• 2006

The leaching behavior of heavy metal ions with pH and colloid/interface property was analyzed by ICP and SEM. The heavy metals in EAF dust are 'amphoteric metal' and the heavy metal ions leached a little at pH 10. And the leaching concentrations of heavy metals at pH 12 were higher than the that at pH 8. The leaching concentrations of heavy metal ion were decreased with adding the clay to the EAF dust. Especially, the leaching concentrations of heavy metal ion were effectively decreased at pH 12. The observation of colloid/interface properties shows that the soluble silicon hydroxide from clay at pH 12 was precipitated at the surface of the heavy metal and clay particles. This silicon hydroxide precipitates were named the PSHP. The leaching concentrations of heavy metal ion were effectively decreased by the formation of PSHP when adding the clay to the EAF dust and controlling the pH of the slurry at 12.

• Journal of Welding and Joining
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• v.34 no.6
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• pp.47-54
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• 2016

Post-Weld Heat Treatment (PWHT) cracking susceptibility in the weld heat-affected zone (HAZ) of reduced activation ferritic-martensitic (RAFM) steels was evaluated through stress-rupture tests. 9Cr-1W based alloys including different C, Ta and Ti content were prepared. The coarse grained heat-affected zone (CGHAZ) samples were simulated with welding condition of 30 kJ/cm heat input. CGHAZ samples consisted of martensite matrix. Stress rupture experiments were carried out using a Gleeble simulator at temperatures of $650-750^{\circ}C$ and at stress levels of 125-550 MPa, corresponding to PWHT condition. The results revealed that PWHT cracking resistance was improved by Ti addition, i.e., Ti contributed to the formation of fine and stable MX precipitates and suppression of coarse M23C6 carbides, resulting in improvement of stress rupture ductility. Meanwhile, rupture strength increased with increasing solute C content.

• Journal of Powder Materials
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• v.30 no.5
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• pp.431-435
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• 2023

An irradiation hardening of Inconel 718 produced by selective laser melting (SLM) was studied based on the microstructural observation and mechanical behavior. Ion irradiation for emulating neutron irradiation has been proposed owing to advantages such as low radiation emission and short experimental periods. To prevent softening caused by the dissolution of γ' and γ" precipitates due to irradiation, only solution annealing (SA) was performed. SLM SA Inconel 718 specimen was ion irradiated to demonstrate the difference in microstructure and mechanical properties between the irradiated and non-irradiated specimens. After exposing specimens to Fe³⁺ ions irradiation up to 100 dpa (displacement per atom) at an ambient temperature, the hardness of irradiated specimens was measured by nano-indentation as a function of depth. The depth distribution profile of Fe³⁺ and dpa were calculated by the Monte Carlo SRIM (Stopping and Range of Ions in Matter)-2013 code under the assumption of the displacement threshold energy of 40 eV. A transmission electron microscope was utilized to observe the formation of irradiation defects such as dislocation loops. This study reveals that the Frank partial dislocation loops induce irradiation hardening of SLM SA Inconel 718 specimens.

• Korean Journal of Materials Research
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• v.28 no.7
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• pp.391-397
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• 2018

This study deals with the microstructure and tensile properties of 700 MPa-grade high-strength and seismic reinforced steel bars. The high-strength reinforced steel bars (600 D13, 600 D16 and 700 D13 specimens) are fabricated by a TempCore process, while the seismic reinforced steel bar (600S D16 specimen) is fabricated by air cooling after hot rolling. For specimens fabricated by the TempCore process, the 600 D13 and 600 D16 specimens have a microstructure of tempered martensite in the surface region and ferrite-pearlite in the center region, while the 700 D13 specimen has a microstructure of tempered martensite in the surface region and bainite in the center region. Therefore, their hardness is the highest in the surface region and shows a tendency to decrease from the surface region to the center region because tempered martensite has a higher hardness than ferrite-pearlite or bainite. However, the hardness of the 600S D16 specimen, which is composed of fully ferrite-pearlite, increases from the surface region to the center region because the pearlite volume fraction increases from the surface region to the center region. On the other hand, the tensile test results indicate that only the 700 D13 specimen with a higher carbon content exhibits continuous yielding behavior due to the formation of bainite in the center region. The 600S D16 specimen has the highest tensile-to-yield ratio because the presence of ferrite-pearlite and precipitates caused by vanadium addition largely enhances work hardening.

• Journal of the Korean Society for Heat Treatment
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• v.9 no.4
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• pp.281-288
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• 1996

This study has been investigated the influence of solid solution treatment on the microstructure of Mg-6Al-xZn(x=0,1,2) alloys fabricated by squeeze casting process. The products having clean surface and fine microstructure are fabricated by adopting the liquid metal forging method. The microstructures of as-fabricated state show ${\beta}(Mg_{17}Al_{12})$ precipitates between the dendrite boundaries. It is found that the hardness of the alloys is increased with increasing amount of zinc due to the solid solution hardening effect of zinc. In the changes of microstructure upon solid solution treatment time at $405^{\circ}C$, ${\beta}$ phases are dissolved in ${\alpha}$ matrix up to 1hr and the microstructure are coarsened rapidly after 2hrs. The microhardness are decreased rapidly until 1hr of solution treatment time and then stabilized. From the above results, it is concluded that the optimum solid solution treatment condition for Mg-6Al-xZn alloys is at $405^{\circ}C$ for 1hr. The solution treatment time is greatly reduced comparing to conventional casting(at $385{\sim}418^{\circ}C$ for 10~14hrs) due to the formation of the super-saturated solid solution by liquid metal forging.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.59-59
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• 2009

The influences of B and Si in the filler metals on microstructure and isothermal solidification during transient liquid-phase (TLP) bonding of a nitrogen-containing duplex stainless steel with MBF-30 (Ni-4.5wt.%Si-3.2wt.%B) and MBF-35 (Ni-7.3wt.%Si-2.2wt.%B), were studied at the temperature range of $1030-1090^{\circ}C$ with various times from 60 s to 3600 s under a vacuum of approximately $10^{-5}$ Torr. In case of the former, BN, $Ni_3B$ and $Ni_3Si$ precipitates were formed in the bonding region. BN and $Ni_3Si$ secondary phases were present in the joint for the latter case. The formation of $Ni_3B$ within the joint centerline is dependent on B content. The morphology of $Ni_3Si$ is dominated by Si concentration. A difference between the times for complete isothermal solidification obtained by the experiments and the conventional TLP bonding diffusion model was observed when using MBF-35. According to the simulated results, the isothermal solidification completion time for MBF-35 case was smaller than that in MBF-30. However, this experimental value obtained using MBF-35 was notably larger than that obtained using MBF-30. Isothermal solidification of liquid MBF-30 is controlled by the first isothermal solidification regime dependent on B diffusion model, whereas that of liquid MBF-35 experiences two isothermal solidification regimes and is mainly controlled by the second isothermal solidification dependent on Si diffusion model. In addition, only if Si content exceeds a critical value, the slower 2nd solidification regime will commence.