• Proceedings of the KSME Conference
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• 2008.11a
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• pp.408-409
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• 2008

This paper presents a new development for topology optimization of heat-dissipating structure with forced convection. To cool down electric devices or machines, two types of convection models have been widely used: Natural convection model with a large Archimedes number and Forced convection with a small Archimedes number. Nowadays, many engineering application areas such as electrochemical conversion device or fuel cell devices adopt the forced convection to transfer generated heat. Therefore, to our knowledge, it becomes an important issue to design flow channels inside which generated heat transfer. Thus, this paper studies optimal topological designs considering fluid-heat interaction. To consider the effect of the advection in the heat transfer problem, the incompressible Navier-stokes equation is solved. This paper numerically studies the coupling phenomena and presents optimal channel design considering forced convection.

• Journal of Korea Foundry Society
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• v.18 no.3
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• pp.234-239
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• 1998

Unidirectional solidification of $Al-CuAl_2$ eutectic composites was studied under the condition of forced convection by vibration. It has been shown that thermal gradient for solid is different from that for liquid during solidification under force convection by vibration. With increase of vibration, mobility of liquid increases, but decreases with decreasing vibration. The rate of solidification is very high initially, and decreases suddenly. For further solidification, the rate of solidification decrceases slowly, and shows a L-type behavior. The mechanical vibration during solidification effects efficiently on nucleation, and induces a forced convection in liquid. By the forced convection, great thermal gradient of liquid interface between solid and liquid can be obtained. The amount of solute near the interface also decreases as solute distribution is improved by the forced convection.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4072-4080
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• 2014

The Peltier Module has been used to dissipate the heat from electronic devices and electronic components. In this module, a heat sink is used to release the operating heat into the air outside. This study addressed the heat transfer characteristics for a heat sink with an inner tunnel. Under forced and natural convection conditions, the heat transfer characteristics were different. Therefore, the cooling and heating performances were studied for the heat sink, which has an inner tunnel. The heat transfer conditions were also evaluated by performing an experimental test, which investigated the heat transfer characteristics related to the variance in time and temperature distribution. Experiments on the heat transfer characteristics of the heat sink were conducted based on the forced and natural convection and temperature distribution changes. In the cooling experiment, the A- and B-shaped cooling pin heat sinks decreased the temperature of the forced convection than the temperature of natural convection. In the forced and natural convection, the A- and B-shaped decreased to a minimum of $-15^{\circ}C$. Under the forced and natural convection conditions, A- and B-shaped cooling pin heat sinks decreased the temperature when the voltage was increased. In the heating experiment, the A- and B-shaped cooling pin heat sinks increased the temperature of the forced convection than the temperature of natural convection. In forced convection, when the voltage was $15^{\circ}C$, the temperature of the A-shaped cooling pin heat sink increased to $150^{\circ}C$, and the temperature of the B-shaped cooling pin heat sink increased to $145^{\circ}C$. Under forced and natural convection conditions, the A- and B-shaped cooling pin heat sinks showed an increase in temperature with increasing voltage.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.775-779
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• 2004

For improvement of heat dissipation performance, heat analysis is conducted on the newly designed heat sinks under two convection conditions by using computational fluid dynamics(CFD). Three types of heat sink, plate, wave and top vented wave, are used, and convection conditions are the variations of gravity direction at natural convection and of fan location at forced convection. The results of analysis showed that the heat resistances of top vented wave heat sink were $0.17^{\circ}C$/W(forced convection) and $0.48^{\circ}C$/W(natural convection). In the case of natural convection, gravity direction affected heat flow change, and protection against heat performance was superior in case of z-axis gravity direction. Under the forced convection, all the heat sinks revealed superior thermal characteristics in the fan position of z-axis rather than y-axis. In this study, it was observed that the top vented wave type heat sink showed the best ability of heat radiation comparing with the others.

• Journal of the Korean Society of Propulsion Engineers
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• v.13 no.1
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• pp.51-57
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• 2009

In this study, a new topology optimization method is developed to design heat-dissipating structure with forced convection. To cool down electrical devices or mechanical machines, two types of convection models have been widely used: the natural convection model with a large Archimedes number and the forced convection with a small Archimedes number. In these days, lots of engineering application areas such as electrochemical conversion devices (Fuel cell) or rocket propulsion engines adopt the forced convection to dissipate the generated heat. Therefore, to our knowledge, it becomes an important issue to design flow channels inside which the generated heat dissipate. Thus, this paper studies optimal topological designs considering fluid-heat interactions. To consider the effect of the advection in the heat transfer problem, the incompressible Navier-stokes equation is solved. This paper numerically studies the coupling phenomena and presents optimal channel design considering forced convection.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.8
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• pp.676-682
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• 2002

This paper has been made to investigate the thermal performance characteristics for the several types of heat sinks such as extruded heat sink, aluminum foam heat sink, layered heat sink. The various types heat sinks are prepared and tested for natural convection as well as forced convection. The experimental results for natural convection are compared to those for three types of heat sink so that the appropriate heat sink can be designed or chosen according to the heating conditions. The overall heat transfer performances for layered heat sink, extruded heat sink and aluminum foam heat sink are almost comparable to those under natural convection and forced convection. The forced convection of layered heat sink become 1.2 times as high as those of extruded heat sink, and the forced convection of extruded heat sink become 1.2 times as high as those of aluminum foam heat sink. This study shows that bar height, bar distance and number of bar for layered heat sink are important parameters, which have a serious influence on thermal performance for layered heat sinks.

• Journal of Welding and Joining
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• v.21 no.6
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• pp.46-54
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• 2003

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.4
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• pp.129-134
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• 2005

A numerical analysis was performed on magnetic field effects of silicon melt motion in Czochralski crystal puller. The turbulent modeling was used to simulate the transport phenomena in 18' single crystal growing process. For small crucible angular velocity, the natural convection is dominant. As the crucible angular velocity is increased, the forced convection is increased and the distribution of temperature profiles is broadened. The cusp magnetic field reduces effectively the natural and forced convection near the crucible and the temperature profiles of the silicon fluids is similar in the case of conduction.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.8
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• pp.541-546
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• 2014

Korea Expressway Corporation established standard of LED lighting fixture in Dec. 2013. To raise compatibility, the standard requires a fixed form and it is applied to street lights and tunnel lights, etc. Because streetlight has different circumstance condition from tunnel light that is down light and exposed to constant wind velocity over height of 8 meters, in case of LED module which has the same shape, characteristic of radiant heat can be different. In this paper, we designed 25 [W] LED Module that is designated by standard of Korea Expressway Corporation and analyzed characteristics of radiant heat about natural convection and forced convection. It is dropped 10.12[$^{\circ}C$] that max temperature is decreased by increasing 20 mm of bended height of heatsink at the condition of natural convection. Radiant heat characteristic of bended height 35 mm became 78.08[$^{\circ}C$] at the condition of natural convection, 55.30[$^{\circ}C$] at the condition of forced convection so that 22.78[$^{\circ}C$] is decreased that is 29.1[%] decrease. Bended height 55mm became 67.96[$^{\circ}C$] at the condition of natural convection, 48.04[$^{\circ}C$] at the condition of forced convection so that 19.92[$^{\circ}C$] is decreased that is 29.3% decrease.

• The Transactions of the Korean Institute of Power Electronics
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• v.24 no.6
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• pp.428-437
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• 2019

Analytical thermal models based on average convection heat transfer are frequently used for the design and selection of forced air-cooled plate fin heat sinks. In this paper, a convection heat transfer model within a ±10% margin of error was presented through experimental investigation. Five types of heat sinks with inlet widths of 1.7-6.8 mm were tested at 50-160 W heat sources to derive and verify the model. Causes of error between the experiment and analytical thermal model were analyzed and listed to design the heat sink. Using proposed method and the lists to be considered in the paper, a quick and accurate heat sink design of the power-conversion system is expected.