• 한국생물공학회:학술대회논문집
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• 2002.04a
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• pp.145-148
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• 2002

Membrane bioreactors for wastewater treatment must operate for long periods without chemical cleaning. This study investigates the critical flux concept introduced by Field et al. as a means for achieving this goal. We conducted two series of tests: at fixed transmembrane pressure(TMP) and at fixed permeate flux. set by a volumetric pump on the permeate. Comparison of constant pressure and constants flux tests under same conditions showed that the critical flux is almost identical to the limiting or pressure independent flux obtained in constant pressure. More generally, constant flux procedure below the critical flux avoids overfouling of the membrane in the initial stage and is more advantageous for membrane bioreactor operation.

• Journal of Korean Society of Water and Wastewater
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• v.22 no.4
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• pp.429-436
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• 2008

Membrane system has been increasingly considered as a safe and cost-effective water treatment process especially in case of small scale water works. This research is a basis of membrane application in water works through a long period test with obtaining operation skills and evaluation of water quality and cost competitiveness. For the research, the UF membrane system was installed in small water treatment plant that uses river-bed water as raw water. The system was consisted of 2 stage membrane and operated in constant flow mode (Flux: 1.5, 1.0, 0.9, 0.6). In each different flux condition, TMP trends were showed better results at lower flux condition. And through the high flux condition test, it is certified that membrane system could deal with breakdown of one stage. Water quality of permeate was satisfied the water quality standards especially turbidity. To know what mainly causes fouling on membrane, the test by membrane with several cleaning agents and EDX analysis have done in lab. Through the tests, ferrous concentration in raw water, backwashing water and membrane surface etc. was high and it causes fouling inside and outside of membrane. So acid cleaning using organic acid such as oxalic acid is necessary in Chemical in Place (CIP). At the economical aspect the electrical cost of membrane system is higher than that of slow sand filtration but labor cost can be reduced by automation. However, the use of labor should be determined considering effectiveness and stability of operation. Because during the operation, there are several breakdown such as electrical shock by lightning, water drop in summer, etc.

• Membrane Journal
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• v.27 no.1
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• pp.104-107
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• 2017

Among many methods in solving the organic contamination in the reverse osmosis operation, caustic soda (NaOH) wash method is efficient and commercially affordable. In continuation of our many organic pollution removal works, this study focused mainly on caustic soda wash with micro-bubble to removal the organic contamination of the spent membrane from reverse osmosis process. First, the membrane was forced the pollute using known organic pollutants such as Humic acid, Bovine serum albumin, Sodium alginate drug. The organic contamination on the membrane was monitored flux. The decontamination of organic contaminants was derived flux variation at individual caustic soda was injected micro-bubble methods and combined method as well. the found results explain removal of organic contaminants effective only by combined caustic soda wash with micro-bubble methods.

• Journal of Microbiology and Biotechnology
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• v.16 no.6
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• pp.863-869
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• 2006

The behavior of submerged membrane bioreactor (SMBR) filtration systems utilizing rapid air backpulsing as a cleaning technique to remove reversible foulants was investigated using a genetic algorithm (GA). A customized genetic algorithm with suitable genetic operators was used to generate optimal time profiles. From experiments utilizing short and long periods of forward and reverse filtration, various experimental process parameters were determined. The GA indicated that the optimal values for the net flux fell between 263-270 LMH when the forward filtration time ($t_f$) was 30-37 s and the backward filtration time ($t_b$) was 0.19-0.27 s. The experimental data confirmed the optimal backpulse duration and frequency that maximized the net flux, which represented a four-fold improvement in 24-h backpulsing experiments compared with the absence of backpulsing. Consequently, the identification of a region of feasible parameters and nonlinear flux optimization were both successfully performed by the genetic algorithm, meaning the genetic algorithm-based optimization proved to be useful for solving SMBR flux optimization problems.

• Membrane and Water Treatment
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• v.3 no.3
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• pp.141-149
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• 2012

The aeration provided in a Submerged Membrane Bioreactor (SMBR) improves membrane filtration by creating turbulence on the membrane surface and reducing membrane resistance. However, conventional hollow fiber membrane modules are generally packed in a vertical orientation which limits membrane scouring efficiency, especially when aeration is provided in the axial direction. In the present research, 3 innovative hollow-fiber membrane modules, each with a different membrane orientation, were developed to improve membrane scouring efficiency and enhance permeate flux. Pilot testing was performed to investigate the permeate flux versus time relationship over a 7-day period under different intermittent modes. The results indicated that the best module experienced an overall permeate flux decline of 3.3% after 7 days; the other two modules declined by 13.3% and 18.3%. The lower percentage of permeate flux decline indicated that permeate productivity could be sustained for a longer period of time. As a result, the operational costs associated with membrane cleaning and membrane replacement could be reduced over the lifespan of the module.

• Membrane and Water Treatment
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• v.13 no.4
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• pp.191-199
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• 2022

In industrial production, the development of traditional polyamide nanofiltration (NF) membrane was limited due to its poor oxidation resistance, complex preparation process and high cost. In this study, a composite NF membrane with high flux, high separation performance, high oxidation resistance and simple process preparation was prepared by the method of dilute solution dip coating. And the sulfonated polysulfone was used for dip coating. The results indicated that the concentration of glycerin, the pore size of the based membrane, the composition of the coating solution, and the post-treatment process had important effects on the structure and performance of the composite NF membrane. The composite NF membrane prepared without glycerol protecting based membrane had a low flux, when the concentration of glycerin increased from 5% to 15%, the pure water flux of the composite NF membrane increased from 46.4 LMH to 108.2 LMH, and the salt rejection rate did not change much. By optimizing the coating system, the rejection rate of Na₂SO₄ and PEG1000 was higher than 90%, the pure water flux was higher than 40 LMH (60psi), and it can withstand 20,000 ppm.h NaClO solution cleaning. When the post treatment processes was adjusted, the salt rejection rate of NaCl solution (250 ppm) reached 45.5%, and the flux reached 62.2 LMH.

• Journal of Korean Society on Water Environment
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• v.25 no.1
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• pp.120-124
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• 2009

This study was performed to investigate the application of submerged membrane bioreactor (MBR) system for biological nutrient removal of municipal wastewater. MBR bioreactor consists of four reactors such as anaerobic, stabilization, anoxic and submerged membrane aerobic reactors with two internal recycles. The hydraulic retention time (HRT), sludge retention time (SRT) and flux were 6.2 hr, 34.1 days and $19.6L/m^2/hr$ (LMH), respectively. As a result of operation, the removal efficiency of $COD_{Cr}$, SS, TN and TP were 94.3%, 99.9%, 69.4%, and 74.6%, respectively. There was no significant effect of microbial activity after the maintenance cleaning using 200 mg/L of NaOCl. Membrane filtration for the treatment of municipal wastewater was performed for longer than 9 months without chemical recovery cleaning.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.305-310
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• 2001

UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.