• Journal of the Semiconductor & Display Technology
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• v.8 no.2
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.22 no.10
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• pp.974-984
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• 2012

This research introduces a new method to attenuate flip-over vibration generation in the flat blade windshield wiper by adjusting the contact pressure between the windshield glass and the blade. The knocking force in the flip-over action of the blade is decreased by inducing gradual tilting-over along the rubber strip of the blade. This gradual tilting-over is induced by introducing a non-uniform contact pressure distribution between the blade and windshield glass. The contact pressure distribution is adjusted by controlling the unloaded profile of the body spring in the blade using a procedure proposed in a previous study. Two blades, one blade designed to generate a uniform pressure distribution and the other designed to generate non-uniform pressure distribution, are developed using the procedure. Contact pressure distributions of the developed blades are measured using a special device and compared with the intended distributions confirming the similarities between the two groups. Vertical and lateral vibrations of the two blades are measured under realistic operating condition simulated by a wiper test rig. The vertical vibrations of the blade with non-uniform contact pressure are substantially smaller than corresponding vibrations of the blade with uniform contact pressure over the entire rubber strip.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.146-150
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• 2001

Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.1
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• pp.10-14
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• 1998

In this paper a double edge triggered (DET) filp-flop is proposed which changes its output state at both the positive and the negative edge transitions of the triggering input. DET filp-flop has advantages in terms of speed and power dissipation over single edge triggered (SET) filp-flop has proposed DET flip-flop needs only 12 MOS transistors and can operate at clock speed of 500 MHz. Also, the power dissipation has decreased about 33% in comparison to SET flip-flop.

• Progress in Superconductivity and Cryogenics
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• v.4 no.1
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• pp.35-39
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• 2002

We have simulated and laid out a Single Flux Quantum(SFQ) AND gate for Arithmetic Logic Unit by using XIC, WRspice and Lmeter. SFQ AND gate circuit is a combination of two D Flip-Flop. D Flip-Flop and dc SQUID are the similar shape form the fact that it has the loop inductor and two Josephson junction We obtained perating margins and accomplished layout of the AND gate. We got the margin of $\pm$38%. over. After layout, we drew mask for fabrication of SFQ AND sate. This mask was included AND gate, dcsfq, sfqdc, rs flip-flop and jtl.

• Journal of Welding and Joining
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• v.26 no.3
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of Mechanical Science and Technology
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• v.18 no.10
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• pp.1869-1879
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• 2004

The present study has numerically investigated two-dimensional flow over three circular cylinders in an equidistant side-by-side arrangement at a low Reynolds number. For the study, numerical simulations are performed, using the immersed boundary method, in the range of g* < 5 at Re= 100, where g* is the spacing between two adjacent cylinder surfaces divided by the cylinder diameter. Results show that the flow characteristics significantly depend on the gap spacing and a total of five kinds of wake patterns are observed over the range: modulation-synchronized (g* (equation omitted) 2), inphase-synchronized (g* (equation omitted) 1.5) , flip-flopping (0.3 < g* (equation omitted) 1.2) , deflected (g* (equation omitted) 0.3), and single bluff-body patterns (g* < 0.3). Moreover, the parallel and symmetric modes are also observed depending on g* in the regime of the flip-flopping pattern. The corresponding flow fields and statistics are presented to verify the observations.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.141-143
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• 2002

We have simulated and Laid out a Single Flux Quantum(SFQ) AND gate for Arithmetic Logic Unit by using XIC, WRspice and Lmeter. This circuit is a combination of two D Flip-Flop. D Flip- Flop and dc SQUID are the similar shape from the fact that it has the a loop inductor and two Josephson junction. We also obtained operating margins and accomplished layout of the AND gate. We got the margin of $\pm$42% over.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.