• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.7
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• pp.1071-1077
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• 2022

A security SoC that can be used to implement elliptic curve cryptography (ECC) based public-key infrastructures was designed. The security SoC has an architecture in which a hardware accelerator for the elliptic curve digital signature algorithm (ECDSA) is interfaced with the Cortex-A53 CPU using the AXI4-Lite bus. The ECDSA hardware accelerator, which consists of a high-performance ECC processor, a SHA3 hash core, a true random number generator (TRNG), a modular multiplier, BRAM, and control FSM, was designed to perform the high-performance computation of ECDSA signature generation and signature verification with minimal CPU control. The security SoC was implemented in the Zynq UltraScale+ MPSoC device to perform hardware-software co-verification, and it was evaluated that the ECDSA signature generation or signature verification can be achieved about 1,000 times per second at a clock frequency of 150 MHz. The ECDSA hardware accelerator was implemented using hardware resources of 74,630 LUTs, 23,356 flip-flops, 32kb BRAM, and 36 DSP blocks.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.