• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.1-9
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• 2013

Recently flexible electronic devices have attracted a great deal of attention because of new application possibilities including flexible display, flexible memory, flexible solar cell and flexible sensor. In particular, development of flexible memory is essential to complete the flexible integrated systems such as flexible smart phone and wearable computer. Research of flexible memory has primarily focused on organic-based materials. However, organic flexible memory has still several disadvantages, including lower electrical performance and long-term reliability. Therefore, emerging research in flexible electronics seeks to develop flexible and stretchable technologies that offer the high performance of conventional wafer-based devices as well as superior flexibility. Development of flexible memory with inorganic silicon materials is based on the design principle that any material, in sufficiently thin form, is flexible and bendable since the bending strain is directly proportional to thickness. This article reviews progress in recent technologies for flexible memory and flexible electronics with inorganic silicon materials, including transfer printing technology, wavy or serpentine interconnection structure for reducing strain, and wafer thinning technology.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2022.05a
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• pp.550-551
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• 2022

In the present study, flexible display technology, which has attracted significant attention in recent years, is discussed. The technology has been widely applied to various devices, such as foldable smartphones and rollable TVs. Notably, different flexible display types from LCD to OLED and E-paper have been employed to implement such devices in practice. Among them, the OLED technology has thus far led the flexible display market. In the present study, the concept and current application fields of the technology are analyzed, and further its potential applications are discussed.

• Electronics and Telecommunications Trends
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• v.36 no.3
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• pp.65-75
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• 2021

In the era of the 4th industrial revolution, interest in flexible devices is increasing for information and communication technology electronic products. This is a hot technology field in which competition is intensifying to preoccupy the global market for flexible electronic devices because of the many advantages of ultra-lightweight, flexibility, design diversity, high applicability, and low cost. Some flexible electronic products have been commercialized in Korea, but they are still inadequate in terms of price versus performance, so technology development is required continuously. Particularly, the development of flexible electronic materials is emerging as a key factor for flexible electronic device applications. In this study, we will look into the flexible electronic material technology and industry trends following the trend of flexible technology changes in the display, secondary battery, and solar cell, which has emerged as national core industry and has secured global competitiveness. In addition, I want to introduce the Flexible Electronic Material Center, which was established to foster the flexible electronic material industry.

• Transactions of Materials Processing
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• v.20 no.3
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• pp.206-213
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• 2011

A flexible die, which is composed of a number of punches with adjusted heights to form a three-dimensional curved surface, is a crucial part of a flexible forming technology. In this study, the punch and control system of the flexible die were designed. The flexible die is divided into three modules, namely, punch, control and joint, and the corresponding modules were developed. The punch module materializes a three-dimensional forming surface by the control module, which is composed of an AC servo motor set and a linear guide. The joint module is necessary for the sequential motion between the servo motor set and the punch module. A sequential motion algorithm for the AC servo motor set, that uses the data of the punch relative heights, was also proposed. Finally, a flexible stretch forming test was carried out using the presently designed flexible die.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.605-608
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• 2008

The preparation and characteristics of flexible indium tin oxide electrodes grown on polyethylene terephthalate (PET) substrates using a specially designed roll-to-roll sputtering system for use in flexible optoelectronics In spite of low a PET substrate temperature, we can obtain the flexible electrode with a sheet resistance of 47.4 ohm/square and an average optical transmittance of 83.46 % in the green region of 500~550 nm wavelength. Both x-ray diffraction (XRD) and field emission scanning electron microscopy (FESEM) analysis results showed that all flexible ITO electrodes grown on the PET substrate were an amorphous structure with a very smooth and featureless surface, regardless of the Ar/$O_2$ flow ratio due to the low substrate temperature, which is maintained by a cooling drum. In addition, the flexible ITO electrode grown on the Ar ion beam treated PET substrates showed more stable mechanical properties than the flexible ITO electrode grown on the wet cleaned PET substrate, due to an increased adhesion between the flexible ITO and the PET substrates.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.223-227
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• 2003

A new flexible electronic packaging technology and its medical applications are presented. Conventional silicon chips and electronic modules can be considered as "mechanically rigid box." which does not bend due to external forces. This mechanically rigid characteristic prohibits its applications to wearable systems or bio-implantable devices. Using current MEMS (Microelectromechanical Systems) technology. a surface micromachined flexible polysilicon sensor array and flexible electrode array fer neural interface were fabricated. A chemical thinning technique has been developed to realize flexible silicon chip. To combine these techniques will result in a realization of truly flexible sensing modules. which are suitable for many medical applications.

• Nuclear Engineering and Technology
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• v.53 no.3
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• pp.851-859
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• 2021

Small PWR can be used for power generation and heating. Considering that small PWR has the characteristics of flexible operating conditions and complex operating environment, the controller designed based on single power level is difficult to achieve the ideal control of small PWR in the whole range of core power range. To solve this problem, a flexible switching controller based on fuzzy controller and LQG/LTR controller is designed. Firstly, a core fuzzy multi-model suitable for full power range is established. Then, T-S fuzzy rules are designed to realize the flexible switching between fuzzy controller and LQG/LTR controller. Finally, based on the core power feedback principle, the core flexible switching control system of small PWR is established and simulated. The results show that the flexible switching controller can effectively control the core power of small PWR and the control effect has the advantages of both fuzzy controller and LQG/LTR controller.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.2
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• pp.142-150
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• 2016

This paper developed new manufacture process technology of slim type flexible flat lighting product used lower power white LED. Flexible flat lighting is applied to letter sign lighting, traffic lighting, interior wall lighting, flat lighting, aquarium back lighting, wreath light etc. Main manufacture process technology were developed drawing software for electronics circuit, inkjet electronic circuit pattern and inkjet white ink coating. For pattern printing it was utilized for piezoelectonic inkjet head printing technology. Also high vacuum pressure laminating technology was waterproofing for LED flat lighting protection. Hence, form process technology we were manufactured for flexible flat lighting product of the power 12 W, input voltage 48 V and plane size $480{\times}480mm$. It acquired a these validity from experiment results.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.5-5
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• 2008

Research and development on flexible electronic displays has gone on for over 20 years. Despite this history, very few flexible displays have entered the marketplace. I will discuss the history of development of flexible display technology and the technical and market forces that have slowed the commercialization of this technology.