• 한국운동역학회지
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• 제32권2호
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• pp.37-42
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• 2022

Objective: The aim of this study is to analyze the effect of the strength of the ankle support on the walking characteristics and ankle joints when men with flexible flat feet walk. Method: 13 adult male subjects (age: 23.9 ± 2.4 yrs, height: 173.0 ± 5.0 cm, weight: 76.9 ± 13.2 kg, Navicular Drop Test (NDT): 10.2 ± 0.8 mm) participated in this study. Each participant had to walk with the 3 conditions, barefoot, soft arch support and hard arch support, along a walkway while their kinematics was recorded at 100 Hz. Results: Based on the results of this study, it is considered that men with flexible flat feet should use hard arch support rather than bare feet to induce normal arch shape, relieve foot damage caused by excessive ankle joint abnormalities and improve stability. Conclusion: Our results for men with flat flexibility, there was a significant difference in the value of step length when walking was performed using two arch supports with different strengths. The angle of ankle dorsiflexion was significantly increased, and the ankle eversion angle was significantly decreased.

• 대한금속재료학회지
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• 제49권8호
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• pp.657-663
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• 2011

This study represents the results of the peel strength and surface morphology according to the preprocessing times of polyimide (PI) in a Cu/Ni/PI structure flexible copper clad laminate production process based on the polyimide. Field emission scanning electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to analyze the surface morphology, crystal structure, and interface binding structure of sputtered Ni, Cu, and electrodeposited copper foil layers. The surface roughness of Ni, Cu deposition layers and the crystal structure of electrodeposited Cu layers were varied according to the preprocessing times. In the RF plasma times that were varied by 100-600 seconds in a preprocessing process, the preprocessing applied by about 300-400 seconds showed a homogeneous surface morphology in the metal layers and that also represented high peel strength for the polyimide. Considering the effect of peel strength on plastic deformation, preprocessing times can reasonably be at about 400 seconds.

• Journal of Advanced Research in Ocean Engineering
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• 제4권4호
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• pp.174-184
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• 2018

We herein propose a new design procedure of a flexible container ship model where the vertical bending and torsional vibration modes are similar to its prototype. To achieve similarity in torsional vibration mode shapes, the height of the shear center of the model must be located below the bottom hull, similar to an actual container ship with large opening decks. Therefore, we designed a ship model by imparting appropriate stiffness to the hull, using urethane foam without a backbone. We built a container ship model according to this design strategy and validated its dynamic elastic properties using a decay test. We measured wave-induced structural vibrations and present the results of tank experiments in regular and freak waves.

• 대한의용생체공학회:의공학회지
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• 제19권5호
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• pp.519-530
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• 1998

본 논문에서는 하지 전단 환자의 보행 성능을 개선하고, 활동성을 증대시긴 목적으로 에너지 저장형 의족의 유연 용골 선계를 위한 기초 연구를 수행하였다. 문헌에서 얻을 수 있는 2차원 시상면에서의 정성걸음새와 인체측정 데이터를 분석하여, 의족의 유연 용골 기초 구조 모델을 제시하였다. 기초 구조 모델은 단순한 빔과 선혈 회전 스프링 ·댐퍼로 구성되었다. 고강도 경량 소재를 의족의 유연 용골 기초 구조에 적용하기 위해 탄소섬유 강화 복합재료를 용골의 기초 구조 소재로 선정하였다. 빔의 형상 변화에 따른 복원변형에너지를 유한요소해석에 의해 계산해내고, 빔형상 변화가 설계변수가 될 수 있음을 제시하였다. 복원변형에너지를 많이 저장할 수 있는 유연 용골 구조의 설계를 위해, 직교배열표를 이용한 조지전 시뮬레이션 계획을 세우고, 유한요소 프로그램인 ABAQUS를 이용하여 계획에 따른 유한요소해석을 수행하고, 분산활석을 통해 효과적인 에너지 저장형 의족의 유연 용골 구조를 얻어냈다. 유연 용골 구조를 이용한 의족걸음새의 동적 시뮬레이션 모델을 완성하고, 한 보행 사이클 동안의 동적 해석을 수행하였다. 그리하여 의족 시스템 개발을 위한 효과적 설계 과정이 제시되었다.

• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.113-119
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• 2022

플렉서블, 웨어러블 디바이스 등을 포함한 차세대 전자 기기의 기계적 신뢰성 향상을 위하여 다양한 유연 접합부에서 높은 수준의 기계적 신뢰성이 요구되고 있다. 기존 고분자 기판 접합을 위한 에폭시 등의 유기 접착소재는 접합부 두께 증가가 필연적이며, 반복 변형, 고온 경화에 의한 열기계적 파손 문제를 수반한다. 따라서 유연 접합을 위해서 접합부 두께를 최소화하고 열 손상을 방지하기 위한 저온 접합 공정 개발이 요구된다. 본 연구에서는 플렉서블 기판의 유연, 강건, 저 열 손상 접합이 가능한 플렉서블 레이저 투과 용접(flexible laser transmission welding, f-LTW)를 개발하였다. 유연 기판 위 탄소나노튜브(carbon nanotube, CNT)를 박막 코팅하여 접합부 두께를 줄였으며, CNT 분산 빔 레이저 가열을 통한 고분자 기판 표면의 국부적 용융 접합 공정이 개발되었다. 짧은 접합 공정 시간과 기판의 열 손상을 최소화하는 레이저 공정 조건을 구축하였으며 고분자 기판과 CNT 접합 형성 메커니즘을 분석하였다. 또한 접합부의 강건성 및 유연성 평가를 위해 인장강도 시험, 박리 시험과 반복 굽힘 시험을 진행하였다.

• 한국표면공학회지
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• 제50권3호
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• pp.164-169
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• 2017

Ni-Cr-X ternary interlayers were investigated to improve the adhesion of Cu/Ni-Cr/Polyimide flexible copper clad laminates. The ternary compounds are sputtered Ni-Cr-X films (where X is one of Nb, V, Mo, or Ti), and the effect of third elements on the adhesion was evaluated and investigated chemically and mechanically. The feel strength was higher in the order of Ni-Cr-Nb > Ni-Cr-V > Ni-Cr > Ni-Cr-Mo > Ni-Cr-Ti. Nb, which has a comparable standard electrode potential to Cr, increased the adhesion, while Ti, with a low standard electrode potential, degraded the adhesion. The Ni-Cr-Nb interlayer was amorphous, while Ni-Cr-Ti was partially crystalline. The similar morphology structure of the Ni-Cr-Nb interlayer with polyimide resulted in a better adhesion.

• 한국표면공학회지
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• 제38권2호
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• pp.49-54
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• 2005

Flexible copper clad laminates (FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializing it. Chromium (Cr) which strongly reacts with O moiety was used as tie-coating layer in order to improve low adhesion between copper (Cu) and polyimide (PI). Sputtering raw polyimide (SRPI) and casting raw polyimide (CRPI) were used as substrates at this research. PI was pretreated by plasma before sputtering, and each sample was varied with RF power and Cr thickness on sputtering. Peel strength of the FCCL on SRPI was higher than that on CRPI. Adhesion had maximum value when 10 nm of Cr was deposited on SRPI by RF power of 50 W. It seems to be by the formation of Cu-Cr-O solid solution at the metal-PI interface.

• Asia pacific journal of information systems
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• 제29권4호
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• pp.547-570
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• 2019

With the advances of information technologies, the interest in SmartWork including extended version of telework and flexible work are increasing, and various types of SmartWork attempted to make working time and place flexible with the goal of work and life balance. Despite its emphasis on work and life balance, SmartWork is expected to make the boundaries between work and nonwork blur and role conflicts occur more than before, and thus the goal of work and life balance becomes more distant. A number of SmartWork users are significantly increasing in Korea, but little is known concerning the antecedents and mechanisms to explain psychological work and interferences in the SmartWork environment. In this paper, using boundary theory, we empirically investigate factors affecting the interferences at both work and nonwork domains. The results, based on data collected from SmartWork users in one of the biggest telecommunication companies in Korea where SmartWork is adopted and extensively used, suggest the factors may be affecting differently interferences at the work and nonwork domains.

• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.11-15
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• 2013

The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.

• 한국분말재료학회지
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• 제28권1호
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• pp.13-19
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• 2021

Bulk graphite is manufactured using graphite scrap as the filler and phenolic resin as the binder. Graphite scrap, which is the by-product of processing the final graphite product, is pulverized and sieved by particle size. The relationship between the density and porosity is analyzed by measuring the mechanical properties of bulk graphite. The filler materials are sieved into mean particle sizes of 10.62, 23.38, 54.09, 84.29, and 126.64 ㎛. The bulk graphite density using the filler powder with a particle size of 54.09 ㎛ is 1.38 g/㎤, which is the highest value in this study. The compressive strength tends to increase as the bulk graphite density increases. The highest compressive strength of 43.14 MPa is achieved with the 54.09 ㎛ powder. The highest flexural strength of 23.08 MPa is achieved using the 10.62 ㎛ powder, having the smallest average particle size. The compressive strength is affected by the density of bulk graphite, and the flexural strength is affected by the filler particle size of bulk graphite.